Surface for reduced friction and wear and method of making the same

• US 7,687,112 B2
• Filed: 06/30/2006
• Issued: 03/30/2010
• Est. Priority Date: 07/14/2004
• Status: Active Grant

• Current Assignee: The Kinetitec Corp.
• Original Assignee: The Kinetitec Corp.
• Inventors: Bowles, Kay Dean, Buehler, Jane E., Bowles, Wade
• Primary Examiner(s): McNeil; Jennifer
• Assistant Examiner(s): Savage; Jason L
• Application Number:
  US11/477,569
• Publication Number:
  US 20100011826A1
• Time in Patent Office: 1,369 Days
• Field of Search: None
• US Class Current: 427/372.2
• CPC Class Codes: C21D 7/06 by shot-peening or the like
• CPC Class Codes: C23C 24/04 Impact or kinetic deposition of particles
• CPC Class Codes: Y02P 10/20 Recycling

Abstract

A process for producing an enhanced friction reducing surface by bonding a dry lubricant to a substrate by way of high velocity mechanical impact and low temperature diffusion bonding, and the friction-reduced surface produced thereby. A process for bonding the dry lubricant by peening and concurrently obtaining a desired dimpling or surface texturizing by appropriate selection of peening particle size and hardness relative to the substrate, as well as impact velocity against the substrate, is also provided.

Claims

1. A process for modifying a surface of a substrate for reduced friction, comprising the steps of:

selecting peening particles by size and hardness according to a hardness of said substrate and a desired dimpling saturation;

coating said peening particles with dry lubricant;

setting an impact velocity that is sufficient to cause said peening particles to bond said dry lubricant to said substrate surface and which is also sufficient to produce said desired dimpling saturation in said substrate surface;

impacting said peening particles against said substrate surface of said substrate at said selected impact velocity until 100% peening saturation is obtained;

continuing said step of impacting after 100% peening saturation is obtained until said desired dimpling saturation is produced; and

after said step of impacting, treating the substrate surface with a low temperature diffusion bonding process at a temperature less than half a melting point of said substrate to cause the dry lubricant to penetrate into a sub-surface beneath the substrate surface, said diffusion bonding process modifying the sub-surface of the substrate surface to a depth of approximately 2-25 microns below the substrate surface, said low temperature diffusion bonding process being performed in an absence of physical contact with said substrate, and said substrate being ready for use upon completion of said low temperature diffusion bonding process.

2. The process as set forth in claim 1, wherein said desired dimpling saturation is less than 10% and said step of selecting includes selecting peening particles from the group consisting of copper, copper alloy, aluminum, aluminum alloy, zinc, polymer, corn cob, pumice and walnut shell.

3. The process as set forth in claim 2, wherein said step of impacting is performed with an indirect pressure type nozzle at a pressure setting of between about 10 and 180 psi.

4. The process as set forth in claim 2, wherein said step of impacting is performed with an indirect pressure type nozzle at a pressure setting of between about 20 and 70 psi.

5. The process as set forth in claim 2, wherein said step of impacting is performed with a direct pressure type nozzle at a pressure setting of between about 5 and 100 psi.

6. The process as set forth in claim 2, wherein said step of impacting is performed with a direct pressure type nozzle at a pressure setting of between about 10 and 40 psi.

7. The process as set forth in claim 1, wherein said desired dimpling saturation is from about 10% to less than 30% and said step of selecting includes selecting peening particles from the group consisting of steel, steel alloy, stainless steel, titanium, titanium alloy, nickel and nickel alloy.

8. The process as set forth in claim 7, wherein said step of impacting is performed with an indirect pressure type nozzle at a pressure setting of between about 10 and 180 psi.

9. The process as set forth in claim 7, wherein said step of impacting is performed with an indirect pressure type nozzle at a pressure setting of between about 30 and 100 psi.

10. The process as set forth in claim 7, wherein said step of impacting is performed with a direct pressure type nozzle at a pressure setting of between about 5 and 100 psi.

11. The process as set forth in claim 7, wherein said step of impacting is performed with a direct pressure type nozzle at a pressure setting of between about 15 and 50 psi.

12. The process as set forth in claim 1, wherein said desired dimpling saturation is about 30% to less than 98% and said step of selecting includes selecting peening particles from the group consisting of hardened steel alloy, nickel, nickel alloy, glass bead and ceramic bead.

13. The process as set forth in claim 12, wherein said step of impacting is performed with an indirect pressure type nozzle at a pressure setting of between about 10 and 180 psi.

14. The process as set forth in claim 12, wherein said step of impacting is performed with an indirect pressure type nozzle at a pressure setting of between about 40 and 100 psi.

15. The process as set forth in claim 12, wherein said step of impacting is performed with a direct pressure type nozzle at a pressure setting of between about 5 and 100 psi.

16. The process as set forth in claim 12, wherein said step of impacting is performed with a direct pressure type nozzle at a pressure setting of between about 20 and 60 psi.

17. The process as set forth in claim 1, wherein said desired dimpling saturation is 98% or greater and said step of selecting includes selecting peening particles from the group consisting of hardened steel alloy, nickel, nickel alloy, glass bead and ceramic bead.

18. The process as set forth in claim 17, wherein said step of impacting is performed with an indirect pressure type nozzle at a pressure setting of between about 10 and 180 psi.

19. The process as set forth in claim 17, wherein said step of impacting is performed with an indirect pressure type nozzle at a pressure setting of between about 70 and 100 psi.

20. The process as set forth in claim 17, wherein said step of impacting is performed with a direct pressure type nozzle at a pressure setting of between about 5 and 100 psi.

21. The process as set forth in claim 17, wherein said step of impacting is performed with a direct pressure type nozzle at a pressure setting of between about 30 and 90 psi.

22. The process as set forth in claim 1, wherein said dimpling saturation is determined by counting a number of indentations having a depth that is twice an average surface roughness of said substrate.

23. The process as set forth in claim 22, wherein said depth is determined by a relationship between peening particle size and dimple diameter.

24. The process as set forth in claim 1, wherein said desired dimpling saturation is less than 10% and said step of selecting includes selecting peening particles having a hardness of 150 HV or less.

25. The process as set forth in claim 24, wherein said peening particles have an average diameter of between about 100 and 1000 micron.

26. The process as set forth in claim 1, wherein said desired dimpling saturation is about 10% to less than 30%, said substrate has a hardness of 150 HV or less, and said step of selecting includes selecting peening particles having a hardness of 500 HV or less.

27. The process as set forth in claim 26, wherein said peening particles have an average diameter of between about 100 and 1000 micron.

28. The process as set forth in claim 26, wherein said peening particles have an average diameter of between about 150 and 500 micron.

29. The process as set forth in claim 1, wherein said desired dimpling saturation is about 10% to less than 30%, said substrate has a hardness of about 151 HV to about 500 HV, and said step of selecting includes selecting peening particles having a hardness of about 151 HV to 500 HV.

30. The process as set forth in claim 1, wherein said desired dimpling saturation is about 10% to less than 30%, said substrate has a hardness of 501 HV or more, and said step of selecting includes selecting peening particles having a hardness of 151 HV or higher.

31. The process as set forth in claim 1, wherein said desired dimpling saturation is about 30% to less than 98%, said substrate has a hardness of 150 HV or less, and said step of selecting includes selecting peening particles having a hardness of about 151 HV to 500 HV.

32. The process as set forth in claim 1, wherein said desired dimpling saturation is about 30% to less than 98%, said substrate has a hardness of about 151 HV to about 500 HV, and said step of selecting includes selecting peening particles having a hardness of 151 HV or higher.

33. The process as set forth in claim 1, wherein said desired dimpling saturation is about 30% to less than 98%, said substrate has a hardness of 501 HV or more, and said step of selecting includes selecting peening particles having a hardness of 501 HV or higher.

34. The process as set forth in claim 1, wherein said desired dimpling saturation is 98% or greater, said substrate has a hardness of 150 HV or less, and said step of selecting includes selecting peening particles having a hardness of 151 HV or higher.

35. The process as set forth in claim 1, wherein said desired dimpling saturation is 98% or greater, said substrate has a hardness of about 151 HV to about 500 HV, and said step of selecting includes selecting peening particles having a hardness of 501 HV or higher.

36. The process as set forth in claim 1, wherein said desired dimpling saturation is 98% or greater, said substrate has a hardness of 501 HV or more, and said step of selecting includes selecting peening particles having a hardness of 501 HV or higher.