Methods for manufacturing RFID tags and structures formed therefrom
First Claim
1. A method for manufacturing integrated circuitry, comprising:
- a) forming, from a first silicon-containing ink, a plurality of first semiconductor layer elements in a first pattern on a first surface of a dielectric layer, said dielectric layer on an electrically active substrate and said first semiconductor layer elements comprising a transistor channel region in a first region of the substrate, and a first diode layer element in a second region of the substrate;
b) forming, from a second silicon-containing ink, a plurality of second semiconductor layer elements different from said first semiconductor layer elements in a second pattern on at least one of said first semiconductor layer element(s) and said first surface of said dielectric layer, said second semiconductor layer elements comprising a second semiconductor layer in the first region of the substrate and a second diode layer element in the second region of the substrate, wherein at least one of said first and second semiconductor layer element forming steps comprises printing the respective first and/or second silicon-containing ink; and
c) forming a plurality of metal elements on or over said first semiconductor layer element(s) and said second semiconductor layer element(s), said metal elements comprising a metal contact and a metal gate in the first region of the substrate, and a diode contact in the second region of the substrate.
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Accused Products
Abstract
Radio frequency identification (RFID) tags and processes for manufacturing the same. The RFID device generally includes (1) a metal antenna and/or inductor; (2) a dielectric layer thereon, to support and insulate integrated circuitry from the metal antenna and/or inductor; (3) a plurality of diodes and a plurality of transistors on the dielectric layer, the diodes having at least one layer in common with the transistors; and (4) a plurality of capacitors in electrical communication with the metal antenna and/or inductor and at least some of the diodes, the plurality of capacitors having at least one layer in common with the plurality of diodes and/or with contacts to the diodes and transistors. The method preferably integrates liquid silicon-containing ink deposition into a cost effective, integrated manufacturing process for the manufacture of RFID circuits. Furthermore, the present RFID tags generally provide higher performance (e.g., improved electrical characteristics) as compared to tags containing organic electronic devices.
62 Citations
33 Claims
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1. A method for manufacturing integrated circuitry, comprising:
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a) forming, from a first silicon-containing ink, a plurality of first semiconductor layer elements in a first pattern on a first surface of a dielectric layer, said dielectric layer on an electrically active substrate and said first semiconductor layer elements comprising a transistor channel region in a first region of the substrate, and a first diode layer element in a second region of the substrate; b) forming, from a second silicon-containing ink, a plurality of second semiconductor layer elements different from said first semiconductor layer elements in a second pattern on at least one of said first semiconductor layer element(s) and said first surface of said dielectric layer, said second semiconductor layer elements comprising a second semiconductor layer in the first region of the substrate and a second diode layer element in the second region of the substrate, wherein at least one of said first and second semiconductor layer element forming steps comprises printing the respective first and/or second silicon-containing ink; and c) forming a plurality of metal elements on or over said first semiconductor layer element(s) and said second semiconductor layer element(s), said metal elements comprising a metal contact and a metal gate in the first region of the substrate, and a diode contact in the second region of the substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 27, 28, 30)
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14. A method for manufacturing integrated circuitry, comprising:
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a) printing, from a silicon-containing ink, a plurality of semiconductor layer elements in a pattern on a first surface of a dielectric layer, said dielectric layer on an electrically active substrate and said semiconductor layer elements comprising a transistor channel region in a first region of the substrate and a diode layer element in a second region of the substrate; b) forming a gate layer over the transistor channel region in the first region of the substrate; c) forming at least one dielectric layer on said gate layer, said diode layer element, and at least part of said first surface of said dielectric layer, said dielectric layer having openings for contacts to said gate layer and terminals of said plurality of semiconductor layer elements and d) printing at least one metal element on or over the semiconductor layer elements and on said gate layer, at least some of said metal elements comprising a diode contact in the second region of the substrate and electrically connecting a first one of said terminals with a second one of said terminals and/or one of said terminals with said gate layer in the first region of the substrate. - View Dependent Claims (15)
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16. A method for manufacturing integrated circuitry for a radio frequency identification (RFID) device, comprising:
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a) forming, from a first semiconductor-containing ink, a plurality of first semiconductor layer elements in a first pattern on a first surface of a dielectric layer, said dielectric layer on an electrically active substrate and said first semiconductor layer elements comprising a transistor channel region in a first region of the substrate, and a first diode layer element in a second region of the substrate; b) forming, from a second semiconductor-containing ink, plurality of second semiconductor layer elements different from said first semiconductor layer elements in a second pattern on at least one of said first semiconductor layer element(s) and said first surface of said dielectric layer, said second semiconductor layer elements comprising a second semiconductor layer in the first region of the substrate and a second diode layer element in the second region of the substrate, wherein at least one of said first and second semiconductor layer element forming steps comprises printing the respective first and/or second silicon-containing ink; and c) forming a plurality of metal elements on or over of said first semiconductor layer element(s) and said second semiconductor layer element(s), said metal elements comprising a metal contact and a metal gate in the first region of the substrate, and a diode contact in the second region of the substrate.
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17. A method for manufacturing integrated circuitry for a radio frequency identification (RFID) device, comprising:
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a) printing, from a semiconductor-containing ink, a plurality of semiconductor layer elements in a pattern on a first surface of a dielectric layer, said dielectric layer on an electrically active substrate and said semiconductor layer elements comprising a transistor channel region in a first region of the substrate and a diode layer element in a second region of the substrate; b) forming a gate layer over the transistor channel region in the first region of the substrate; c) forming at least one dielectric layer on said gate layer, said diode layer element, and at least part of said first surface of said dielectric layer, said dielectric layer having openings for contacts to said gate layer and terminals of said plurality of semiconductor layer elements; and d) printing at least one metal element on or over the semiconductor layer elements and on said gate layer, at least some of said metal elements comprising a diode contact in the second region of the substrate and electrically connecting a first one of said terminals with a second one of said terminals and/or one of said terminals with said gate layer in the first region of the substrate.
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18. A method of manufacturing integrated circuitry, comprising:
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a) forming, from a first semiconductor-containing ink, a plurality of first semiconductor layer elements in a first pattern on a first surface of a dielectric layer, said dielectric layer on an electrically active substrate, and said first semiconductor layer elements comprising a transistor channel region in a first region of the substrate, a first diode layer element in a second region of the substrate, and a first capacitor plate in a third region of the substrate; b) forming, from a second silicon-containing ink, a plurality of second semiconductor layer elements different from said first semiconductor layer elements in a second pattern on at least one of said first semiconductor layer element(s) and said first surface of said dielectric layer, said second semiconductor layer elements comprising a second semiconductor layer in the first region of the substrate and a second diode layer element in the second region of the substrate, wherein at least one of said first and second semiconductor layer element forming steps comprises printing the respective first and/or second silicon-containing ink; and c) forming a plurality of metal elements on or over said first semiconductor layer elements and said second semiconductor layer elements, said metal elements comprising a metal contact and a metal gate in the first region of the substrate, a diode contact in the second region of the substrate, and a second capacitor plate in the third region of the substrate. - View Dependent Claims (19, 20, 21, 22, 23, 24, 25, 26, 29, 31, 32, 33)
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Specification