System and method for manufacturing thick and thin film devices using a donee layer cleaved from a crystalline donor

• US 7,687,372 B2
• Filed: 04/07/2006
• Issued: 03/30/2010
• Est. Priority Date: 04/08/2005
• Status: Active Grant

• Current Assignee: Versatilis, LLC
• Original Assignee: Versatilis, LLC
• Inventors: Jain, Ajaykumar R.
• Primary Examiner(s): Kunemund; Robert M
• Assistant Examiner(s): Song; Matthew J
• Application Number:
  US11/400,668
• Publication Number:
  US 20060246267A1
• Time in Patent Office: 1,453 Days
• Field of Search: 438/455, 438/458, 438/459
• US Class Current: 438/455
• CPC Class Codes: H01L 21/187 by direct bonding
• CPC Class Codes: H01L 21/6835 using temporarily an auxiliary support
• CPC Class Codes: H01L 21/76251 using bonding techniques
• CPC Class Codes: H01L 2221/68359 used as a support during manufacture of interconnect decals or build up layers
• CPC Class Codes: H01L 27/1214 comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
• CPC Class Codes: H01L 27/1218 with a particular composition or structure of the substrate
• CPC Class Codes: H01L 27/1266 the substrate on which the devices are formed not being the final device substrate, e.g. using a temporary substrate
• CPC Class Codes: H01L 29/78603 characterised by the insulating substrate or support H01L29/78657 takes precedence
• CPC Class Codes: H01L 29/78681 having a semiconductor body comprising AIIIBV or AIIBVI or AIVBVI semiconductor materials, or Se or Te
• CPC Class Codes: H01L 2924/19041 being a capacitor
• CPC Class Codes: H01L 33/0093 Wafer bonding; Removal of the growth substrate
• CPC Class Codes: H01S 5/0207 Substrates having a special shape
• CPC Class Codes: Y10T 156/12 Surface bonding means and/or assembly means with cutting, punching, piercing, severing or tearing
• CPC Class Codes: Y10T 428/24802 Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]

Abstract

Various embodiments of fabricated crystalline-based structures for the electronics, optoelectronics and optics industries are disclosed. Each of these structures is created in part by cleaving a donee layer from a crystalline donor, such as a micaceous/lamellar mass comprising a plurality of lamelliform sheets separable from each other along relatively weak cleavage planes. Once cleaved, one or more of these lamelliform sheets become the donee layer. The donee layer may be used for a variety of purposes, including a crystalline layer for supporting heteroepitaxial growth of one or more semiconductor layers thereon, an insulating layer, a barrier layer, a planarizing layer and a platform for creating useful structures, among others.

Claims

1. A method of making an electronic and/or optoelectronic device structure by layer transfer, comprising:

providing a crystalline donor having a first free surface and a plurality of intrinsic cleavage planes spaced from one another and each substantially parallel to the first surface, wherein the first free surface and a particular one of the plurality of intrinsic cleavage planes defining a first donee layer;

fabricating a device layer containing at least one device upon the first donee layer so that the at least one device is monolithic with the first donee layer, said at least one device being either one of an electronic type and an optoelectronic type;

securing a first handle to either the device layer or the first free surface of the first donee layer; and

cleaving the first donee layer from the crystalline donor along the particular one of the plurality of intrinsic cleavage planes so as to liberate the first donee layer, in combination with the first handle, from the crystalline donor.

2. A method according to claim 1, wherein said cleaving of the first donee layer is performed prior to said fabricating of the device layer and said securing of the first handle includes securing the handle to the free surface of the first donee layer, and said fabricating of the device layer includes fabricating the device layer on a second free surface of the first donee layer defined by the particular one of the plurality of cleavage planes.

3. A method according to claim 1, wherein said cleaving of the first donee layer is performed after said fabricating of the device layer and said fabricating of the device layer includes fabricating the device layer on the first free surface of the donee layer and said securing of the first handle includes securing the first handle to the device layer.

4. A method according to claim 1, wherein said fabricating of the device layer includes forming an amorphous layer on the first donee layer.

5. A method according to claim 1, wherein said fabricating of the device layer includes forming a polycrystalline layer on the first donee layer.

6. A method according to claim 1, wherein said fabricating of the device layer includes forming a single crystal layer on the first donee layer.

7. A method according to claim 1, wherein said securing of the first handle includes securing an elongate handle to either the device layer or the first free surface of the first donee layer in a roll-to-roll process.

8. A method according to claim 7, wherein said cleaving of the first donee layer is performed in the roll-to-roll process.

9. A method according to claim 8, wherein said fabricating of the device layer is performed in the roll-to-roll process.

10. A method according to claim 1, wherein said fabricating of the device layer includes fabricating at least one transistor.

11. A method according to claim 10, wherein said fabricating of the device layer includes forming at least one thin film transistor.

12. A method according to claim 10, wherein said fabricating of the device layer includes forming at least one thick film transistor.

13. A method according to claim 1, wherein said fabricating of the device layer includes forming at least one electroluminescent device.

14. A method according to claim 1, wherein said fabricating of the device layer includes forming at least one of 1) a sensor and 2) a detector.

15. A method according to claim 1, wherein said providing of the crystalline donor, said fabricating of the device layer, said securing of the handle, and said cleaving of the first donee layer are used to form a first device component, the method further comprising:

providing a second device component comprising a second device layer and a second handle fixed relative to the second device layer; and

laminating the first and second device components with one another.

16. A method according to claim 1, further comprising, following said cleaving of the first donee layer, removing substantially all of the first donee layer from the electronic and/or optoelectronic device structure.

17. A method according to claim 1, wherein said providing of the crystalline donor includes providing a micaceous/lamellar donor comprising a plurality of lamelliform sheets, the first donee layer being at least one of the plurality of lamelliform sheets.

18. A method according to claim 17, wherein said providing of the micaceous/lamellar donor includes providing a micaceous/lamellar donor comprising a plurality of fluorophlogopite sheets.

19. A method of manufacturing a plurality of electronic and/or optoelectronic device structures, comprising:

providing a crystalline donor having a plurality of intrinsic cleavage planes defining a plurality of donee layers;

forming a device layer on each of the plurality of donee layers, the device layer including at least one of

     1) an electronic device and

     2) an optoelectronic device; and

cleaving each of the plurality of donee layers from the crystalline donor along a corresponding one of the plurality of intrinsic cleavage planes in succession with one another so as to liberate that one of the plurality of donee layers from the crystalline donor.

20. A method according to claim 19, wherein said providing of the crystalline donor includes providing a micaceous/lamellar donor having a plurality of lamelliform sheets corresponding respectively to the plurality of donee layers.

21. A method according to claim 20, wherein said providing of the crystalline donor includes providing a unitary mass of fluorophlogopite sheets.

22. A method according to claim 19, further comprising affixing each of the plurality of donee layers to an elongate handle prior to that one of the plurality of donee layers being cleaved from said crystalline donor.

23. A method according to claim 22, wherein said cleaving of each of the plurality of donee layers includes cleaving each of the plurality of donee layers successively in a roll-to-roll process.

24. A method according to claim 23, wherein said forming of the device layer on each of the plurality of donee layers includes forming the device layer in the roll-to-roll process.

25. A method according to claim 22, wherein said affixing each of the plurality of donee layers to the elongate handle is performed after said forming of the device layer of a corresponding respective one of the plurality of donee layers.

26. A method of making an electronic and/or optoelectronic device by layer transfer, comprising:

fabricating a first device component by;

providing a crystalline donor having a first free surface and a plurality of intrinsic cleavage planes spaced from one another and each substantially parallel to the first surface, wherein the first free surface and a particular one of the plurality of intrinsic cleavage planes defining a first donee layer;

fabricating a first device layer containing at least one device upon the first donee layer so that said at least one device is monolithic with the first donee layer, said at least one device being either one of an electronic type and an optoelectronic type;

securing a first handle to either the device layer or the first free surface of the first donee layer; and

cleaving the first donee layer from the crystalline donor along the particular one of the plurality of intrinsic cleavage planes so as to liberate the first donee layer, in combination with the first handle, from the crystalline donor;

providing a second device component comprising a second device layer and a second handle fixed relative to the second device layer; and

laminating the first and second device components with one another.

27. A method according to claim 26, wherein said laminating of the first and second device components includes laminating the first and second device components with one another so that free surfaces of the first and second device layers face one another.

28. A method according to claim 26, wherein said laminating of the first and second device components includes laminating the first and second device components with one another so that free surfaces of the first and second device layers face away from one another.

29. A method according to claim 26, wherein said laminating of the first and second device components with one another forms a three-dimensional stacked electronic circuit.

30. A method according to claim 29, wherein said laminating of the first and second device components with one another forms a three-dimensional stacked integrated electronic circuit.

31. A method according to claim 30, wherein said laminating of the first and second device components with one another forms a three-dimensional stacked memory circuit.

32. A method according to claim 26, wherein said laminating of the first and second device components with one another forms a three-dimensional stacked opto-electronic circuit.

33. A method according to claim 26, wherein said laminating of the first and second device components with one another forms a three-dimensional stacked sensor circuit.