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Light-emitting diode arrays and methods of manufacture

  • US 7,687,812 B2
  • Filed: 06/15/2007
  • Issued: 03/30/2010
  • Est. Priority Date: 06/15/2007
  • Status: Active Grant
First Claim
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1. An LED array comprising:

  • a base substrate (BS) and a plurality of light emitting diodes, each of the light emitting diodes comprising a stack of a first contact layer, a semiconductor stack and a second contact layer,the semiconductor stack being on top of the first contact layer, the second contact layer being on top of the semiconductor stack;

    the plurality of light emitting diodes being arranged in pixel matrix on the base substrate as LEDs of at least three types (R, G, B);

    the LEDs according to their type (R, G, B) being arranged as at least a first, second and third sub-pixel in the pixel matrix for emission of radiation of a respective specific at least first, second and third color,precursor/adhesion layers on the base substrate;

    light emitting diodes of at least one type of the at least three types of LEDs being directly on the base substrate, and light emitting diodes of other type(s) of the at least three types of LEDs being arranged on the precursor/adhesion layers respectively;

    interconnection circuitry on the substrate, operative to connect to the light emitting diodes of the array for addressing each of the light emitting diodes; and

    an overcoat layer covering the plurality of light emitting diodes and filling gaps between the plurality of light emitting diodes.

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