Power module and method of fabricating the same

• US 7,687,903 B2
• Filed: 07/24/2008
• Issued: 03/30/2010
• Est. Priority Date: 11/16/2007
• Status: Active Grant

• Current Assignee: Semiconductor Components Industries LLC (ON Semiconductor Corporation)
• Original Assignee: Fairchild Korea Semiconductor Limited (ON Semiconductor Corporation)
• Inventors: Lim, Seung-won, Son, Joon-seo, Jeon, O-seob
• Primary Examiner(s): POTTER, ROY KARL
• Application Number:
  US12/220,638
• Publication Number:
  US 20090129028A1
• Time in Patent Office: 614 Days
• Field of Search: 257/686, 257/723, 257/E23.169, 438/123, 361/715
• US Class Current: 257/723
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/16245 the item being metallic
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/45139 Silver (Ag) as principal constituent
• CPC Class Codes: H01L 2224/48095 Kinked
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73253 Bump and layer connectors
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 23/3107 the device being completely enclosed
• CPC Class Codes: H01L 23/4334 Auxiliary members in encapsulations H01L23/49568 takes precedence
• CPC Class Codes: H01L 23/4951 Chip-on-leads or leads-on-chip techniques, i.e. inner lead fingers being used as die pad
• CPC Class Codes: H01L 23/49551 characterised by bent parts
• CPC Class Codes: H01L 23/49572 consisting of thin flexible metallic tape with or without a film carrier H01L23/49503 - H01L23/49568 and H01L23/49575 - H01L23/49579 take precedence
• CPC Class Codes: H01L 23/49575 Assemblies of semiconductor devices on lead frames
• CPC Class Codes: H01L 24/45 of an individual wire connector
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/73 Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 25/165 Containers
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00011 : Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01049 : Indium [In]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/1305 : Bipolar Junction Transistor [BJT]
• CPC Class Codes: H01L 2924/13055 : Insulated gate bipolar transistor [IGBT]
• CPC Class Codes: H01L 2924/13091 : Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
• CPC Class Codes: H01L 2924/1532 : the connection portion being formed on the die mounting surface of the substrate
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/1815 : Shape
• CPC Class Codes: H01L 2924/207 : Diameter ranges

Abstract

Provided are a power module including a power package and a control package that are provided separately and can be highly integrated, and method of fabricating the power module. The power module includes: a molded power package including at least one power device on a first lead frame; and a molded control package vertically stacked on the power package, and including at least one control device on a second lead frame. A first part of the first lead frame and a first part of the second lead frame are coupled to each other so that the power package and the control package can be electrically coupled to each other.

Claims

1. A power module comprising:

a molded power package comprising at least one power device on a first lead frame; and

a molded control package vertically stacked on the power package, and comprising at least one control device on a second lead frame,

wherein a first part of the first lead frame and a first part of the second lead frame are coupled to each other so that the power package and the control package are electrically coupled to each other,

wherein the power package further comprises one or more first wiring pads on the first part of the first lead frame, and the control package further comprises one or more second wiring pads on the first part of the second lead frame,

wherein the power module further comprising solder, and wherein the one or more first wiring pads and the one or more second wiring pads are bonded to each other with the solder.

2. The power module of claim 1, wherein the power package further comprises a first molding member covering the power device such that the first part of the first lead frame is exposed out of the first molding member.

3. The power module of claim 2, wherein the first lead frame comprises a first surface and a second surface, the power device is disposed on the first surface, and a part of the second surface is exposed out of the first molding member to bond to the first part of the second lead frame.

4. The power module of claim 3, wherein an end portion of the first lead frame is bent in a direction from the first surface to the second surface.

5. The power module of claim 2, wherein the power package further comprises a heat dissipation substrate that is disposed on a surface of the power device opposite to that disposed on the first lead frame such that a part of the heat dissipation substrate is exposed out of the first molding member.

6. The power module of claim 1, wherein the control package further comprises a second molding member covering the control device such that the first part of the second lead frame is exposed out of the second, molding member.

7. The power module of claim 6, wherein the second lead frame comprises a third surface and a fourth surface, the control device is disposed on the third surface, and a part of the fourth surface is exposed out of the second molding member to bond to the first part of the first lead frame.

8. The power module of claim 7, wherein an end portion of the second lead frame is bent in a direction from the fourth surface to the third surface.

9. The power module of claim 1, wherein the power package further comprises one or more conductive bumps between the power device and the first lead frame.

10. A power module comprising:

a first lead frame having a first surface and a second surface;

at least one power device disposed on the first surface of the first lead frame;

a first molding member covering the at least one power device, and exposing a first part of the second surface of the first lead frame;

a second lead frame having a third surface and a fourth surface, wherein a first part of the fourth surface is bonded with the exposed first part of the second surface of the first lead frame;

at least one control device disposed on the third surface of the second lead frame; and

a second molding member covering the at least one control device, and exposing the first part of the fourth surface of the second lead frame.

11. The power module of claim 10, wherein the exposed first part of the second surface of the first lead frame and the exposed first part of the fourth surface of the second lead frame are bonded to each other using soldering.

12. The power module of claim 10, further comprising:

a heat dissipation substrate disposed on a surface of the at least one power device on opposite to that disposed on the first lead frame, wherein a part of the heat dissipation substrate is exposed out of the first molding member.

13. The power module of claim 12, wherein an end portion of the first lead frame and an end portion of the second lead frame are bent in a direction opposite to that in which the heat dissipation substrate is disposed with respect to the first lead frame.

14. The power module of claim 10, wherein the power package comprises a flip-chip package structure.

15. A method of fabricating a power module, the method comprising:

forming a molded power package comprising at least one power device on a first lead frame;

forming a molded control package comprising at least one control device on a second lead frame; and

bonding a first part of the first lead frame with a first part of the second lead frame so that the power package and the control package can be electrically coupled to each other,

wherein the bonding of the first part of the first lead frame with the first page of the second lead frame is performed using a soldering process.

16. The method of claim 15, wherein the soldering process comprises:

injecting solder between the first part of the first lead frame and the first part of the second lead frame; and

reflowing the solder.

17. The method of claim 15, wherein the forming of the power package comprises:

forming one or more conductive bumps on the power device;

disposing the first lead frame on the conductive bumps;

reflowing the one or more conductive bumps; and

forming a first molding member covering the power device, whereby the first part of the first lead frame is exposed.

18. The method of claim 17, wherein the forming of the power package further comprises:

stacking the power device on a heat dissipation substrate before forming the one or more conductive bumps.

19. The method of claim 15, wherein the forming of the control package comprises:

mounting the at least one control device on the second lead frame;

electrically coupling the second lead frame to the control device; and

forming a second molding member covering the control device, whereby the first part of the second lead frame is exposed.

20. The method of claim 19, wherein the electrical coupling between the second lead frame and the control device is performed using a wire bonding or a bump connection.

21. The method of claim 15, further comprising:

trimming and bending end portions of the first lead frame and the second lead frame after performing the bonding process.