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Recovery of hydrophobicity of low-k and ultra low-k organosilicate films used as inter metal dielectrics

  • US 7,687,913 B2
  • Filed: 02/19/2007
  • Issued: 03/30/2010
  • Est. Priority Date: 09/03/2003
  • Status: Expired due to Fees
First Claim
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1. An article of manufacture comprising:

  • an insulating material having a plurality of electrical conductors formed therein; and

    an intermetal dielectric including an organosilicate film having hydrogen atoms or alkyl or aryl groups attached to silicon atoms;

    a surface of the organosilicate film comprising a product of reaction with an aminosilane silylating agent and an organosilicate of said film, said aminosilane having the general formula (R2N)xSiR′

    yR″

    z where X, Y and Z are integers with x varying from 1 to 3, and Y and Z varying from 3 to 0 respectively but where x+y+z is always equal to 4, and where R, R′

    , and R″

    are any hydrogen, methyl, aryl, allyl, phenyl or vinyl moiety.

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