Ultrasound imaging system

• US 7,687,976 B2
• Filed: 01/31/2007
• Issued: 03/30/2010
• Est. Priority Date: 01/31/2007
• Status: Active Grant

• Current Assignee: General Electric Company
• Original Assignee: General Electric Company
• Inventors: Haider, Bruno Hans, Fisher, Rayette Ann, Kristoffersen, Kjell, Halvorsrod, Thomas, Wodnicki, Robert
• Primary Examiner(s): Dougherty; Thomas M
• Application Number:
  US11/669,235
• Publication Number:
  US 20080183078A1
• Time in Patent Office: 1,154 Days
• Field of Search: 310/317, 310/319, 310/334, 736/25, 600/459
• US Class Current: 310/334
• CPC Class Codes: A61B 1/0005 combining images e.g. side-by-side, superimposed or tiled
• CPC Class Codes: A61B 8/00 Diagnosis using ultrasonic, sonic or infrasonic waves imaging of objects using sonar G01S15/00
• CPC Class Codes: B06B 1/0622 on one surface
• CPC Class Codes: G01S 15/8925 the array being a two-dimensional transducer configuration, i.e. matrix or orthogonal linear arrays
• CPC Class Codes: G01S 15/8927 using simultaneously or sequentially two or more subarrays or subapertures
• CPC Class Codes: G01S 7/5208 with integration of processing functions inside probe or scanhead
• CPC Class Codes: G03B 42/06 using ultrasonic, sonic or infrasonic waves

Abstract

An ultrasound imaging system (100). An exemplary system (100) includes a plurality of transducer elements (136) formed in subarrays (140) and a plurality of subarray circuit units (160′), with each circuit unit (160′) connected to a subarray (140) of the transducer elements (136). The circuitry in each unit (160′) comprises a plurality of integrated circuits (330, 340, 350), with at least a first (340) of the integrated circuits formed over a second (330) of the integrated circuits in a stacked configuration. In an example illustration the first integrated circuit (340) includes a first plurality of first bond pads (345) along a surface (342) thereof and the second integrated circuit (330) includes a second plurality of second bond pads (335) along a surface (331) thereof, with bond wires (344) extending between pairs of first and second bond pads to provide input/output signal connections therebetween.

Claims

1. An ultrasound imaging system of the type which generates an image of an object under observation, comprising:

an array of transducer elements arranged along a plane in a matrix of subarrays, with each sub array containing a plurality of the transducer elements, for generating acoustic signals and receiving reflections of the signals;

a plurality of circuit units, each subarray of transducer elements connected to a different circuit unit, circuitry in each unit comprising two or more integrated circuits in a stacked configuration, with each unit including transmission circuitry for generating the acoustic signals, receiver circuitry for processing of the reflected signals and control circuitry; and

a system console coupled to receive image information from the circuit units and including image processing circuitry for displaying an image of the object,

wherein all of the subarrays are positioned along a first plane, a first of the integrated circuits is positioned in a second plane parallel with the first plane and a second of the integrated circuits is positioned in a third plane parallel with the first plane.

2. The system of claim 1 further including a multi-wiring unit providing electrical connection between ones of the subarrays of transducer elements and ones of the subarray circuit units, and providing input/output signal connections between the one subarray circuit unit and a multi-wire cable for connection to the system console.

3. The system of claim 2 wherein the multi-wiring unit includes one or more flexible circuit boards having a plurality of electrically conductive through-flex vias.

4. The system of claim 2 wherein each subarray is a two dimensional array such that the entire array of transducer elements is arranged in rows and columns of elements and wherein the multi-wiring unit is positioned in a fourth plane parallel with the first plane.

5. The system of claim 1 wherein at least one of the subarray circuit units is formed on a routing substrate for conducting electrical signals between the integrated circuits in the subarray circuit unit and providing input/output signal connections to the subarray circuit unit.

6. The system of claim 5 wherein the routing substrate includes conductive through vias for providing signals between each circuit unit and individual elements in the transducer array.

7. The system of claim 1 wherein all of the subarray circuit units are positioned in a hand-held probe unit.

8. The system of claim 1 wherein the first integrated circuit in each circuit unit includes wiring patterns and bond wires for conducting electrical signals between the first and second integrated circuits in the circuit unit and providing input/output signal connections for the subarray circuit unit.

9. The system of claim 8 including a third integrated circuit and additional bond wires extending from bond pads on the first integrated circuit to effect connections between the second and third integrated circuits.

10. The system of claim 1 wherein the second plane is positioned between the first and third planes and the first integrated circuit, includes conductive through vias for providing signals between each circuit unit and individual elements in the transducer array.

11. An ultrasound imaging system including a transducer array probe unit and a system console for processing and displaying image data, the probe unit comprising:

an array of transducer elements arranged along a plane;

a plurality of subarray circuit units each comprising a plurality of integrated circuits formed over one another in a stacked configuration, each circuit unit connected to multiple ones of the transducer elements;

a multi-wiring unit providing electrical connections between transducer elements and circuit units and providing input/output signal connections between at least the one circuit unit and the system console; and

a plurality of removable clamps, each clamp providing connections between one or more flexible circuits and the circuit board,

wherein a first of the integrated circuits is positioned in a first plane and a second of the integrated circuits is positioned in a second plane parallel with the first plane, with the first integrated circuit including a plurality of bond pads formed along a surface thereof, with the circuit unit including bond wires extending from some of the bond pads on the first integrated circuit to the second circuit to provide connections between the first and second integrated circuits.

12. The system of claim 11 wherein the transducer elements are each taken from the group consisting of a lead zirconate titanate transducer (PZT), a capacitive Micromachined Ultrasonic Transducer (cMUT), a piezoelectric Micromachined Ultrasonic Transducer (pMUT), and a PolyVinylidine DiFluoride (PVDF) transducer.

13. The probe of claim 11 further including a third integrated circuit positioned in a plane parallel with the second plane, with the first integrated circuit including bond pads connected with bond wires to provide connections between the second and third integrated circuits.

14. The system of claim 11 wherein each circuit unit is a multi-chip module having a controller integrated circuit formed over a receiver integrated circuit formed over a transmitter integrated circuit, the transmitter integrated circuit providing signal routing between the controller integrated circuit and the receiver integrated circuit in each subarray circuit unit.

15. The system of claim 11 wherein the multi-wiring unit includes multiple flexible circuit boards and multiple printed circuit boards with each circuit unit mounted on one of the printed circuit boards with electrical connection through the one of the printed circuit boards and through electrically conductive through-flex vias in one of the flexible circuit boards to effect connection with the transducer elements.

22. The system of claim 11 wherein the transducer elements are formed in a matrix of subarrays with each subarray containing a plurality of the transducer elements and with each of the circuit units of integrated circuits connected to one of the sub arrays of transducer elements, and wherein the multi-wiring unit provides electrical connections between subarrays of the transducer elements and subarrays of the circuit units.

16. An ultrasound imaging system of the type having a probe unit and a system console connected to the probe unit through a cable, the system comprising:

a plurality of transducer elements;

a plurality of circuit units, each connected to multiple ones of the transducer elements, circuitry in each unit comprising a plurality of integrated circuits, with at least a first of the integrated circuits formed over a second of the integrated circuits in a stacked configuration; and

a plurality of circuit board structures providing electrical connections between the transducer elements and the circuit units,

with, for at least one of the circuit units, the first integrated circuit including a first plurality of first bond pads along a surface thereof and the second integrated circuit including a second plurality of second bond pads along a surface thereof, bond wires extending between pairs of first and second bond pads to provide input/output signal connections therebetween.

17. The ultrasound imaging system of claim 16 wherein each circuit unit includes at least three integrated circuits with one of the first integrated circuits comprising transmission circuitry for generating the acoustic signals, one of the integrated circuits comprising receiver circuitry for processing of the reflected signals and one of the integrated circuits comprising control circuitry for pulse timing.

18. The ultrasound imaging system of claim 16 wherein the plurality of circuit units and the plurality of circuit board structures are positioned in the probe unit.

19. The ultrasound imaging system of claim 16 wherein at least some of the plurality of circuit units are positioned in the system console.

20. The ultrasound imaging system of claim 18 including a third integrated circuit and additional bond wires extending from bond pads on the first integrated circuit to effect connections between the second and third integrated circuits.

21. The system of claim 16 wherein the transducer elements are arranged in rows and columns and are formed in adjoining subarrays such that each circuit unit is a subarray circuit unit connected to a subarray of the transducer elements.