Chuck with integrated wafer support

• US 7,688,091 B2
• Filed: 03/10/2008
• Issued: 03/30/2010
• Est. Priority Date: 12/24/2003
• Status: Expired due to Fees

• Current Assignee: Cascade Microtech Incorporated (FormFactor Incorporated)
• Original Assignee: Cascade Microtech Incorporated (FormFactor Incorporated)
• Inventors: Froemke, Brad, Dunklee, John, Andrews, Peter
• Primary Examiner(s): Hollington; Jermele M
• Application Number:
  US12/075,385
• Publication Number:
  US 20080157796A1
• Time in Patent Office: 750 Days
• Field of Search: None
• US Class Current: 324/756.01
• CPC Class Codes: G01R 31/2887 involving moving the probe head or the IC under test; docking stations moving single probes G01R1/06705; moving individual probes in multiple probes G01R1/07392

Abstract

An improved chuck with lift pins within a probe station. The chuck assembly may have an outer periphery and an upper surface. The lift pins may be positioned within the periphery of the chuck assembly and may be capable of relative vertical movement with respect to the upper surface of the chuck assembly.

Claims

1. A probe station comprising:

(a) a chuck assembly having an upper surface suitable to support a wafer thereon and movable in a direction substantially parallel to said upper surface from a first chuck position to a second chuck position; and

(b) a plurality of members located within a periphery of said chuck assembly suitable to support said wafer;

said members moveable with respect to said upper surface so as to be capable of relative vertical movement with respect to said upper surface;

a range of vertical movement of at least one of said members relative to said upper surface variable as a consequence of said position of said chuck relative to said first chuck position.

2. The probe station of claim 1 further comprising a chamber that is substantially airtight and surrounds said chuck when said chuck is in one of said first chuck position and said second chuck position.

3. The probe station of claim 1 wherein said chuck includes a thermal unit to raise the temperature of said upper surface above ambient temperature.

4. The probe station of claim 1 wherein said chuck includes a thermal unit to lower the temperature of said upper surface below ambient temperature.

5. The probe station of claim 1 wherein said upper surface is substantially flat.

6. The probe station of claim 1 wherein said plurality of members are substantially evenly spaced around said chuck.

7. The probe station of claim 1 wherein said plurality of members are selectively raised or lowered.

8. The probe station of claim 1 wherein said plurality of members are capable of being maintained at different elevations above said upper surface.

9. The probe station of claim 1 wherein said plurality of members are movable in response to movement of a handle by a user.

10. A chuck assembly comprising:

(a) an upper surface suitable to support a wafer thereon; and

(b) a plurality of members, each including a pin portion located within a periphery of said upper surface and movable in a direction substantially normal to said upper surface between a first pin position where said pin portion does not project from said upper surface to a second pin position where said pin portion projects from said upper surface and said plurality of pin portions are suitable to support a wafer at a distance from said upper surface;

said chuck assembly movable in a direction substantially parallel to said upper surface from a first chuck position to a second chuck position only when said plurality of pin portions is not in said second pin position.

11. The chuck of claim 10 wherein said movement of said chuck from said first chuck position to said second chuck position is enabled only when said pin portions are in said first pin position.

12. The chuck of claim 10 wherein said movement parallel to said upper surface is not inhibited when said plurality of members are not extended.

13. The chuck of claim 10 wherein vacuum is supplied to said upper surface of said chuck while said members are between said first pin position and said second pin position.

14. The chuck of claim 10 wherein vacuum is supplied to said upper surface of said chuck while said pin portions are in said first pin position and said vacuum is reduced prior to extending said pin portions to said second pin position.

15. A chuck assembly comprising:

(a) an upper surface suitable to support a wafer thereon and including a portion defining an aperture; and

(b) a plurality of members each including a pin portion moveable substantially normal with respect to said upper surface from a first pin position where said pin portions do not project from said upper surface to a second pin position where said pin portions project from said upper surface, air pressure in said aperture increasing as said pin portions are moved to said second pin position.

16. The chuck assembly of claim 15 wherein said air pressure is not increased until at least one of said pin portions is substantially even with said upper surface of said chuck.

17. The chuck assembly of claim 15 wherein said air pressure at said aperture is substantially atmospheric pressure when said pin portions are at said second pin position.

18. A chuck assembly comprising:

(a) an upper surface suitable to support a wafer thereon;

(b) a plurality of members each including a pin portion located within the periphery of said upper surface and movable relative to said upper surface from a first position where said pin portions do not project from said upper surface to a second position where said pin portions project from said upper surface; and

(c) an interlock inhibiting movement of said chuck assembly in a direction substantially parallel to said upper surface when at least one of said pin portions projects from said upper surface.

19. A chuck assembly comprising:

(a) an upper surface suitable to support a wafer thereon and movable in a direction substantially parallel to said upper surface;

(b) a plurality of members each including a pin portion located within a periphery of said upper surface and movable relative to said upper surface from a first pin position where said pin portions do not project from said upper surface to a second pin position where said pin portions project from said upper surface; and

(c) an interlock inhibiting relative movement of said pin portions from said first pin position unless said upper surface has been moved to a position where a wafer supported on said upper surface is not accessible to a probe.