Wafer probe

• US 7,688,097 B2
• Filed: 04/26/2007
• Issued: 03/30/2010
• Est. Priority Date: 12/04/2000
• Status: Expired due to Fees

• Current Assignee: FormFactor Beaverton, Inc. (FormFactor Incorporated)
• Original Assignee: Cascade Microtech Incorporated (FormFactor Incorporated)
• Inventors: Andrews, Mike, Hayden, Leonard, Martin, John
• Primary Examiner(s): Karlsen; Ernest F
• Application Number:
  US11/796,237
• Publication Number:
  US 20070200580A1
• Time in Patent Office: 1,069 Days
• Field of Search: 324754-765, 297/05, 298/27
• US Class Current: 324/755.03
• CPC Class Codes: G01R 1/06772 High frequency probes
• CPC Class Codes: G01R 1/07342 the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
• CPC Class Codes: Y10T 29/49121 Beam lead frame or beam lead device
• CPC Class Codes: Y10T 29/49147 Assembling terminal to base
• CPC Class Codes: Y10T 29/49204 Contact or terminal manufacturing
• CPC Class Codes: Y10T 29/49208 by assembling plural parts

Abstract

The present invention relates to a probe tip assembly for testing of integrated circuits or other microelectronic devices. The probe tip assembly may include a plurality of independently flexible contact fingers extending from a support, each contact finger spaced apart from the other contact fingers, and each contact finger terminating in free space at an end distal from the support. A probe may be constructed by attaching the free ends of the contact fingers to electrical contacts on a circuit board and then removing the support from the contact fingers.

Claims

1. A method for constructing a probe tip assembly comprising the steps of:

(a) providing a substantially rigid support;

(b) securing a plurality of independently flexible contact fingers to said support, each contact finger spaced apart from the other ones of said plurality of contact fingers and extending from a first end portion proximate the securing point to said support and terminating in free space at a second end portion distal from said support;

wherein said contact fingers are arranged in a predetermined alignment to spatially align said second end portions with electrical contacts on a circuit board and, to spatially align said first end portions with contact pads of an electrical device to be probed;

(c) attaching said second end portions to said electrical contacts; and

(d) removing said support leaving said first end portions terminating in free space and spatially aligned for engagement with said contact pads.

2. The method for constructing a probe tip assembly of claim 1 wherein said support is a tab.

3. The method for constructing a probe tip assembly of claim 2 wherein said first end portion of each contact finger includes a first end and said tab is in contact with said first ends of said contact fingers.

4. The method for constructing a probe tip assembly of claim 1 wherein said spacing of respective contact fingers proximate said first end portions is less than said spacing of respective contact fingers proximate said second end portions.

5. The method for constructing a probe tip assembly of claim 1 wherein each end portion of each contact finger includes a first end and each second end portion includes a second end and longitudinal axes connecting respective second end portions of said contact fingers with respective first end portions intersect at a point proximate said first ends and more distant from said second ends than are said first ends, said contact fingers extending in a radial direction.

6. The method for constructing a probe tip assembly of claim 1 wherein said circuit board includes a respective trace for each of said contact fingers.

7. The method for constructing a probe tip assembly of claim 1 wherein said plurality of contact fingers is greater than three contact fingers.