Fluid pressure compensation for immersion lithography lens

• US 7,688,421 B2
• Filed: 12/20/2004
• Issued: 03/30/2010
• Est. Priority Date: 06/17/2004
• Status: Active Grant

• Current Assignee: Nikon Corporation
• Original Assignee: Nikon Corporation
• Inventors: Watson, Douglas C., Novak, W. Thomas
• Primary Examiner(s): Mathews; Alan A
• Application Number:
  US11/628,942
• Publication Number:
  US 20080316445A1
• Time in Patent Office: 1,926 Days
• Field of Search: 355/30, 355/53, 355/72, 355/77, 355/55
• US Class Current: 355/53
• CPC Class Codes: G03F 7/70258 Projection system adjustments, e.g. adjustments during exposure or alignment during assembly of projection system
• CPC Class Codes: G03F 7/70341 Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply chemical composition of immersion liquids G03F7/2041
• CPC Class Codes: G03F 7/70833 Mounting of optical systems, e.g. mounting of illumination system, projection system or stage systems on base-plate or ground
• CPC Class Codes: G03F 7/709 Vibration, e.g. vibration detection, compensation, suppression or isolation

Abstract

An immersion lithography system that compensating for any displacement of the optical caused by the immersion fluid. The system includes an optical assembly (14) to project an image defined by the reticle (12) onto the wafer (20). The optical assembly includes a final optical element (16) spaced from the wafer by a gap (24). An immersion element (22) is provided to supply an immersion fluid into the gap and to recover any immersion fluid that escapes the gap. A fluid compensation system is provided for the force on the final optical element of the optical assembly caused by pressure variations of the immersion fluid. The resulting force created by the varying pressure may cause final optical element to become displaced. The fluid compensation system is configured to provide a substantially equal, but opposite force on the optical assembly, to prevent the displacement of the final optical element.

Claims

1. An apparatus, comprising:

a wafer table that supports a wafer;

an optical assembly that projects an image onto the wafer supported by the wafer table, the optical assembly having a final optical element spaced from the wafer by a gap;

an immersion element that provides an immersion fluid into the gap between the final optical element and the wafer; and

a fluid compensation system that compensates for a first force applied to the final optical element of the optical assembly caused by pressure variations of the immersion fluid to minimize displacement of the final optical element, the fluid compensation system applying a second force to the final optical element, the second force having a direction opposite a direction of the first force.

2. The apparatus of claim 1, wherein the fluid compensation system comprises a chamber positioned adjacent a lens mount that holds the final optical element with respect to the optical assembly.

3. The apparatus of claim 2, further comprising passages fluidly coupled between the gap and the chamber.

4. The apparatus of claim 2, wherein the chamber passively compensates for displacement of the final optical element by exerting the second force on the lens mount to oppose the first force exerted by the immersion fluid onto the lens mount and/or the final optical element.

5. The apparatus of claim 4, wherein the second force is substantially equal but opposite the first force.

6. The apparatus of claim 2, wherein the lens mount has a first surface in contact with the immersion fluid and a second surface in contact with the chamber.

7. The apparatus of claim 2, wherein the fluid compensation system further comprises a purge device fluidly coupled to the chamber.

8. The apparatus of claim 2, wherein the chamber expands or contracts in a vertical direction but not in a horizontal direction.

9. The apparatus of claim 2, wherein the chamber is a passive pressure device.

10. The apparatus of claim 9, wherein the passive pressure device comprises one of the following:

a bellows, a piston, or a diaphragm.

11. The apparatus of claim 1, wherein the fluid compensation system further comprises:

a control system that calculates the first force exerted on the final optical element and generates a control signal commensurate with the calculated first force; and

at least one force actuator, responsive to the control signal, and that applies the second force to the final optical element, the second force is equal but opposite the first force to prevent displacement of the final optical element.

12. The apparatus of claim 11, wherein the at least one force actuator is mechanically coupled between a lens mount that holds the final optical element and the optical assembly.

13. The apparatus of claim 11, further comprising a pressure sensor that measures the pressure exerted by the immersion fluid on the final optical element and that provides a pressure signal commensurate with the measured pressure to the control system.

14. The apparatus of claim 11, further comprising a position sensor, coupled to the control system, and that measures the position of a lens mount that holds the final optical element.

15. The apparatus of claim 11, wherein the at least one force actuator is internal to a lens mount that holds the final optical element.

16. The apparatus of claim 11, wherein the at least one force actuator is one of the following types of force actuators:

a VCM, an El core, a piezo stack, a magnetic actuator, or a pressure actuator.

17. The apparatus of claim 1, further comprising a lens mount that holds the final optical element, wherein the fluid compensation system applies the second force to the lens mount.

18. A device manufacturing method comprising:

exposing a wafer through the optical assembly and the immersion fluid of the apparatus of claim 1; and

developing the exposed substrate.

19. An apparatus, comprising:

a wafer table that supports a wafer;

an optical assembly that projects an image onto the wafer held by the wafer table, the optical assembly having a final optical element spaced from the wafer by a gap;

an immersion element that provides an immersion fluid into the gap between the final optical element and the wafer, the immersion element having one or more gas nozzles that provide a flow of gas;

a pressure sensor that measures the pressure of the immersion fluid in the gap; and

a gas control system, coupled to the pressure sensor, and that controls a velocity of the flow of gas from the one or more gas nozzles based on the pressure measured by the pressure sensor.

20. The apparatus of claim 19, wherein the gas flow from the one or more gas nozzles is used to substantially contain the immersion fluid in the gap.

21. The apparatus of claim 20, wherein the gas flow from the one or more gas nozzles is used to create an air bearing used to support the immersion element.

22. The apparatus of claim 21, wherein the gas control system adjusts the gap between the immersion element and the wafer by controlling the velocity of the gas exiting the one or more gas nozzles.

23. A device manufacturing method comprising:

exposing a wafer through the optical assembly and the immersion fluid of the apparatus of claim 19; and

developing the exposed substrate.

24. An exposure method in which an optical assembly projects an image onto a wafer held by a wafer table, the optical assembly having a final optical element spaced from the wafer by a gap, the method comprising:

providing an immersion fluid into the gap between the final optical element and the wafer using an immersion element, the immersion element having one or more gas nozzles that provide a flow of gas;

measuring the pressure of the immersion fluid in the gap using a pressure sensor; and

controlling a velocity of the flow of gas from the one or more gas nozzles based on the pressure measured by the pressure sensor using a gas control system coupled to the pressure sensor.

25. The method of claim 24, wherein the gas flow from the one or more gas nozzles substantially contains the immersion fluid in the gap.

26. The method of claim 25, wherein the gas flow from the one or more gas nozzles creates an air bearing that supports the immersion element.

27. The method of claim 26, wherein the gas control system adjusts the gap between the immersion element and the wafer by controlling the velocity of the gas exiting the one or more gas nozzles.