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Cooling system for rack-mounted electronics equipment

  • US 7,688,584 B1
  • Filed: 10/02/2008
  • Issued: 03/30/2010
  • Est. Priority Date: 10/02/2008
  • Status: Active Grant
First Claim
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1. A rack-mount case system comprising:

  • a case;

    a frame located within the case and configured to receivably secure electronics equipment;

    a cooling unit coupled to the frame, the cooling unit having at least one heat sink in fluid communication with a first blower and at least one manifold in fluid communication with a second blower;

    a thermoelectric component located between the at least one heat sink and the manifold; and

    a first vent opening located in at least one portion of the case, the first vent opening in fluid communication with the cooling unit,wherein at least the second blower is configured to move air at a desired flow rate within the case.

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