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Method for processing laser-irradiated thin films having variable thickness

  • US 7,691,687 B2
  • Filed: 01/09/2007
  • Issued: 04/06/2010
  • Est. Priority Date: 09/16/2003
  • Status: Expired due to Fees
First Claim
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1. A method for processing a film, comprising:

  • (a) generating a first laser beam pattern from a pulsed laser beam, the first laser beam pattern having an intensity that is sufficient to at least partially melt at least a portion of a first region of a film to be crystallized;

    (b) generating a second laser beam pattern from a pulsed laser beam, the second laser beam pattern having an intensity that is sufficient to at least partially melt at least a portion of a second region of the film to be crystallized,wherein the first region of the film comprises a first thickness and the second region of the film comprises a second thickness, and the first and second thicknesses are different;

    (c) irradiating the first region of the film with the first laser beam pattern to form a first crystalline region having a first grain structure; and

    (d) irradiating the second region of the film with the second laser beam pattern to form a second crystalline region having a second grain structure.

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