Method for manufacturing metal chips by plasma from a layer comprising several elements
First Claim
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1. A method for manufacturing chips composed of at least one electrically conductive material, the method comprising:
- depositing, on a support, an alloy comprising at least the electrically conductive material and a second material;
exposing the alloy to plasma etching, in order to cause the desorption of the materials of the alloy not forming part of the composition of the chips, that is at least the second material but not the electrically conductive material; and
forming chips composed of at least said electrically conductive material.
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Abstract
The invention relates to a method for manufacturing chips composed of at least one electrically conductive material. Such a method comprises the following steps:
- deposition, on a support, of an alloy comprising at least the electrically conductive material and a second material;
- exposure of the alloy to plasma etching, in order to cause the desorption of the materials of the alloy not forming part of the composition of the chips, that is at least the second material but not the electrically conductive material;
- formation of chips composed of at least said electrically conductive material.
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Citations
9 Claims
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1. A method for manufacturing chips composed of at least one electrically conductive material, the method comprising:
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depositing, on a support, an alloy comprising at least the electrically conductive material and a second material; exposing the alloy to plasma etching, in order to cause the desorption of the materials of the alloy not forming part of the composition of the chips, that is at least the second material but not the electrically conductive material; and forming chips composed of at least said electrically conductive material. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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