Packaging designs for LEDs

• US 7,692,207 B2
• Filed: 08/23/2005
• Issued: 04/06/2010
• Est. Priority Date: 01/21/2005
• Status: Active Grant

• Current Assignee: Luminus Devices Incorporated (Sanan Optoelectronics Company Limited)
• Original Assignee: Luminus Devices Incorporated (Sanan Optoelectronics Company Limited)
• Inventors: Hoepfner, Christian, Panaccione, Paul, Karlicek, Robert F. Jr., Lim, Michael, Erchak, Alexei A., Lidorikis, Elefterios, Venezia, Jo A.
• Primary Examiner(s): PERT, EVAN T
• Application Number:
  US11/210,013
• Publication Number:
  US 20060163590A1
• Time in Patent Office: 1,687 Days
• Field of Search: 257/99, 257/680, 257/E23.002, 257/E23.191
• US Class Current: 257/99
• CPC Class Codes: F21K 9/00 Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 24/24 of an individual high density interconnect connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01012 Magnesium [Mg]
• CPC Class Codes: H01L 2924/01013 Aluminum [Al]
• CPC Class Codes: H01L 2924/01029 Copper [Cu]
• CPC Class Codes: H01L 2924/01032 Germanium [Ge]
• CPC Class Codes: H01L 2924/01033 Arsenic [As]
• CPC Class Codes: H01L 2924/01046 Palladium [Pd]
• CPC Class Codes: H01L 2924/01047 Silver [Ag]
• CPC Class Codes: H01L 2924/01051 Antimony [Sb]
• CPC Class Codes: H01L 2924/01078 Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/01082 Lead [Pb]
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: H01L 2924/12044 OLED
• CPC Class Codes: H01L 33/385 the electrode extending at least partially onto a side surface of the semiconductor body
• CPC Class Codes: H01L 33/56 : Materials, e.g. epoxy or silicone resin
• CPC Class Codes: H01L 33/62 : Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

Light-emitting devices, and related components, processes, systems and methods are disclosed.

Claims

1. A system comprising:

an LED having an edge, the LED being capable of emitting light; and

a layer positioned at a distance from a surface of the LED, the distance being at most about 10% of the length of the edge, the layer being configured so that at least about 75% of the light that emerges from the LED and impinges on the layer passes through the layer,

wherein the layer is a window of a package and includes an electrical contact, and

the package further comprises a substrate and a conductive pad on the substrate,

wherein the electrical contact of the layer is electrically connected to the conductive pad of the package via a metal spring or clip.

2. The system of claim 1, wherein the LED comprises a multi-layer stack of materials comprising a first layer supported by a light generating region, a surface of the first layer being configured so that light generated by the light generating region can emerge from the LED via a surface of the first layer.

3. The system of claim 2, wherein the surface of the first layer includes a plurality of holes arranged according to a nonperiodic pattern.

4. The system of claim 1, wherein the LED has an edge that is at least about one millimeter long.

5. The system of claim 1, wherein an aspect ratio of the surface of the LED is about 4×

3.

6. The system of claim 1, wherein an aspect ratio of the surface of the LED is about 16×

9.

7. The system of claim 1, further comprising a cooling system configured so that, during use, the cooling system regulates a temperature of the LED.

8. The system of claim 1, wherein the LED includes an electrical contact and the electrical contact of the layer is electrically connected to the electrical contact of the LED.

9. The system of claim 8, wherein the electrical contact of the layer is patterned.

10. The system of claim 8, wherein the electrical contact of the layer is electrically connected to the electrical contact of the LED via conductive supports.

11. The system of claim 10, wherein the conductive supports comprise solder.

12. The system of claim 1, wherein the layer comprises glass.

13. The system of claim 1, wherein the LED is free of wire bonds.

14. The system of claim 1, wherein the LED includes a light generating region comprising quantum wells.