Sawing tile corners on probe card substrates
First Claim
Patent Images
1. A probe card assembly for testing a semiconductor wafer comprising:
- a plurality of individual substrates each comprising a plurality of probes configured to contact dies of the semiconductor wafer and first electrically conductive internal paths connected to the probes, the individual substrates arranged in an away having an outer perimeter;
an electrical interface connectable to a tester configured to control testing of the dies; and
electrical connections between the electrical interface and the first electrically conductive internal paths of the individual substrate,wherein at least one of the individual substrates has a shape that comprises three approximately ninety degree angles and two obtuse angles, and a first edge of the individual substrate between the two obtuse angles is part of the outer perimeter of the array,wherein the first edge comprises a cut line wherein ones of the first electrically conductive internal paths are spaced apart from the cut line, andwherein a second plurality of electrically conductive internal paths are not connected to the probes and extend to the cut line.
3 Assignments
0 Petitions
Accused Products
Abstract
A composite substrate for testing semiconductor devices is formed by selecting a plurality of substantially identical individual substrates, cutting a corner from at least some of the individual substrates in accordance with their position in a final array configuration, and then assembling the individual substrates into the final array configuration. The final array configuration of substrates with corners cut or sawed away conforms more closely to the surface area of a wafer being tested, and can easily fit within space limits of a test environment.
12 Citations
13 Claims
-
1. A probe card assembly for testing a semiconductor wafer comprising:
-
a plurality of individual substrates each comprising a plurality of probes configured to contact dies of the semiconductor wafer and first electrically conductive internal paths connected to the probes, the individual substrates arranged in an away having an outer perimeter; an electrical interface connectable to a tester configured to control testing of the dies; and electrical connections between the electrical interface and the first electrically conductive internal paths of the individual substrate, wherein at least one of the individual substrates has a shape that comprises three approximately ninety degree angles and two obtuse angles, and a first edge of the individual substrate between the two obtuse angles is part of the outer perimeter of the array, wherein the first edge comprises a cut line wherein ones of the first electrically conductive internal paths are spaced apart from the cut line, and wherein a second plurality of electrically conductive internal paths are not connected to the probes and extend to the cut line. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
-
-
9. A probe substrate for use in a probe card assembly for testing a semiconductor wafer comprising:
-
a substrate; a plurality of probes disposed on the substrate and configured to contact dies of the semiconductor wafer; a cut line extending from a first edge of the substrate to a second edge of the substrate, the cut line defining a removable corner of the probe substrate; a plurality of electrically conductive internal traces disposed in the substrate and connected to the plurality of probes; wherein first ones of the plurality of electrically conductive internal traces are connected to ones of the plurality of probes disposed within the removable corner and the first ones of the plurality of electrically conductive internal traces cross the cut line; and wherein second ones of the plurality of electrically conductive internal traces are connected to ones of the plurality of probes not disposed within the removable corner and the second ones of the plurality of electrically conductive internal traces do not cross the cut line. - View Dependent Claims (10, 11, 12, 13)
-
Specification