Method for forming a composite structure of backing material for use in a transducer assembly
First Claim
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1. A method for forming a composite structure of backing material for use in a transducer assembly, the method comprising:
- dicing a block of backing material to form a plurality of layers of backing material; and
alternatingly disposing the plurality of layers of backing material between a plurality of thermal conductive elements to form the composite structure of backing material,wherein a volume of the thermal conductive elements comprises up to about 5 volume percent of a volume of the backing material.
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Abstract
A composite structure of a backing material with enhanced conductivity for use in a transducer is presented. The composite structure includes a plurality of layers of backing material alternatingly arranged with a plurality of thermal conductive elements, wherein the plurality of thermal conductive elements are configured to transfer heat from a center of the transducer to a plurality of points on the composite structure of backing material.
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Citations
18 Claims
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1. A method for forming a composite structure of backing material for use in a transducer assembly, the method comprising:
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dicing a block of backing material to form a plurality of layers of backing material; and alternatingly disposing the plurality of layers of backing material between a plurality of thermal conductive elements to form the composite structure of backing material, wherein a volume of the thermal conductive elements comprises up to about 5 volume percent of a volume of the backing material. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A method for forming a composite structure of backing material for use in a transducer assembly, the method comprising:
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dicing a block of backing material to form a plurality of layers of backing material; and alternatingly disposing the plurality of layers of backing material between a plurality of thermal conductive elements to form the composite structure of backing material, wherein the plurality of thermal conductive elements is more dense at a central area of the transducer than at a peripheral area of the transducer. - View Dependent Claims (11, 12, 13, 14, 15, 16, 17, 18)
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Specification