Method of making a bottomless via
First Claim
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1. A method comprising:
- forming an opening in a dielectric layer disposed on a substrate;
forming a barrier layer on the opening, the barrier layer comprising a material that prevents the diffusion of a metal across the barrier layer; and
forming a seed layer on the barrier layer, the seed layer having a noble metal-copper alloy, the copper having less than 50% weight of the noble metal-copper alloy.
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Abstract
A method for forming a copper interconnect is described. An opening in a dielectric layer disposed on a substrate is formed. A barrier layer is formed on the opening. A seed layer is formed on the barrier layer. The seed layer includes a noble metal copper alloy, the copper having less than 50% of the atomic weight of the noble metal copper alloy.
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Citations
20 Claims
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1. A method comprising:
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forming an opening in a dielectric layer disposed on a substrate; forming a barrier layer on the opening, the barrier layer comprising a material that prevents the diffusion of a metal across the barrier layer; and forming a seed layer on the barrier layer, the seed layer having a noble metal-copper alloy, the copper having less than 50% weight of the noble metal-copper alloy. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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13. A method comprising:
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forming an opening in a dielectric layer disposed on a copper interconnect of a substrate; forming a barrier layer on the opening, the barrier layer comprising a material that prevents the diffusion of a metal across the barrier layer; forming a seed layer on the barrier layer, the seed layer comprising a noble metal; and etching the barrier layer and the seed layer at the bottom of the opening to expose the underlying copper interconnect. - View Dependent Claims (14, 15, 16, 17, 18, 19, 20)
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Specification