Surface mount optoelectronic component
First Claim
1. An optoelectronic component based on a surface mount technology, the optoelectronic component comprising:
- an electrically conductive frame forming a base including multiple separate base sections for an assembly;
an opaque plastic material forming a housing for the assembly;
a cavity formed within the plastic material;
at least one protrusion extending from a side surface of the housing to provide heat dissipation; and
at least one optoelectronic chip mounted in the cavity,wherein the base emanates from an internal middle portion and each of the base sections protrudes from a bottom surface and at least one of two other side surfaces of the housing, so as to extend past the bottom surface and the two other side surfaces of the housing, the bottom surface and the two other side surfaces of the housing providing external mounting connection terminals.
1 Assignment
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Accused Products
Abstract
The invention relates to a surface mount optoelectronic component. A thick, electrically conductive material is used to serve as a base material for the assembly. An opaque plastic material is used to provide housing for the whole component. A cavity formed on a top surface of the optoelectronic component is designed within the plastic material. An optoelectronic chip is mounted within this cavity. This cavity is filled with a hard transparent or translucent resin material so that optical radiation may be transmitted or received via this window. Electrical connection(s) between the chip and the base material is/are provided by a metallic wire (4). Subsequent connections to external sub-systems, such as PCBs, are provided by the base material itself. No extra mechanical forming processes are necessary to create the connections. The base material extends all the way from a middle portion to a bottom surface of the optoelectronic component, and to one of the side surfaces, ultimately extending and protruding outside the package. The bottom surface is used for connection when a top illuminator is required. Alternatively, one of the side surfaces could be used for connection when the optoelectronic component is used as a side illuminator.
18 Citations
20 Claims
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1. An optoelectronic component based on a surface mount technology, the optoelectronic component comprising:
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an electrically conductive frame forming a base including multiple separate base sections for an assembly; an opaque plastic material forming a housing for the assembly; a cavity formed within the plastic material; at least one protrusion extending from a side surface of the housing to provide heat dissipation; and at least one optoelectronic chip mounted in the cavity, wherein the base emanates from an internal middle portion and each of the base sections protrudes from a bottom surface and at least one of two other side surfaces of the housing, so as to extend past the bottom surface and the two other side surfaces of the housing, the bottom surface and the two other side surfaces of the housing providing external mounting connection terminals. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. An optoelectronic component based on a surface mount technology, the optoelectronic component comprising:
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an electrically conductive frame forming a base for an assembly, the base including multiple separate base sections; an opaque plastic material forming a housing for the assembly; a cavity formed within the plastic material; at least one protrusion extending from a side surface of the housing to provide heat dissipation; and at least one optoelectronic chip mounted in the cavity, wherein the electrically conductive frame emanates from an internal middle portion and each of the base sections protrudes to at least one of two other side surfaces and a bottom surface of the housing, so as to extend past the two other side surfaces and the bottom surface of the housing, the bottom surface and the two other side surfaces of the housing providing external mounting connection terminals. - View Dependent Claims (13, 14, 15, 16, 17, 18, 19, 20)
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Specification