RFID tag packaging system

• US 7,696,621 B2
• Filed: 07/05/2007
• Issued: 04/13/2010
• Est. Priority Date: 07/05/2006
• Status: Active Grant

• Current Assignee: Hottinger Bruel & Kjaer Incorporated
• Original Assignee: MicroStrain, Inc. (Spectris PLC)
• Inventors: Arms, Steven W., Hamel, Michael J.
• Primary Examiner(s): Paumen; Gary F.
• Application Number:
  US11/825,404
• Publication Number:
  US 20080009149A1
• Time in Patent Office: 1,013 Days
• Field of Search: 428/68, 428/76, 257/701, 257/728, 257/7
• US Class Current: 257/728
• CPC Class Codes: H01Q 1/2208 associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems methods or arrangements for sensing record carriers, e.g. for reading patterns G06K7/00; record carrier for use with machines and with at least a part designed to carry digital markings G06K19/00
• CPC Class Codes: Y10T 428/23 Sheet including cover or casing
• CPC Class Codes: Y10T 428/239 Complete cover or casing

Abstract

An electronic packaging system includes an electronic device. The electronic packaging system also includes a flexible material located adjacent a plurality of sides of the electronic device. The electronic device is located in a cavity in the flexible material. The flexible material has a first height and a first width. The electronic device has a second height. The first height is greater than the second height and the first width is greater than the first height so the flexible material protects the electronic device from loading.

Claims

1. An electronic packaging system, comprising:

an electronic device having a top surface and sides; and

a flexible material located adjacent a plurality of said sides of said electronic device, wherein said electronic device is located in a cavity in said flexible material, wherein said top surface is free of said flexible material, wherein said flexible material has a first height and a first width, wherein said electronic device has a second height, wherein said first height is greater than said second height and wherein said first width is greater than said first height so said flexible material protects said electronic device from loading.

2. An electronic packaging system as recited in claim 1, wherein said electronic device includes an RFID chip.

3. An electronic packaging system as recited in claim 1, wherein said electronic device includes an RF transmitter.

4. An electronic packaging system as recited in claim 1, wherein said electronic device includes at least one from the group consisting of a sensor and an actuator.

5. An electronic packaging system as recited in claim 1, wherein said electronic device includes at least one from the group consisting of a transceiver, a microprocessor, and a memory.

6. An electronic packaging system as recited in claim 1, wherein said electronic device includes at least one from the group consisting of an optical transmitter and an acoustic transmitter.

7. An electronic packaging system as recited in claim 1, further comprising a gel, wherein said gel covers said electronic device for protecting said electronic device.

8. An electronic packaging system as recited in claim 1, further comprising a substrate, wherein said electronic device is mounted to said substrate, wherein said substrate includes at least one from the group consisting of a pipe, a girder, an I-beam, a vehicle, a bridge, a building, and machinery.

9. An electronic packaging system as recited in claim 1, further comprising a substrate, wherein said electronic device is mounted to said substrate, wherein said substrate includes a living being.

10. An electronic packaging system as recited in claim 1, further including a moisture barrier positioned to protect said electronic device.

11. An electronic packaging system as recited in claim 10, wherein said moisture barrier includes at least one from the group including wax and a butyl rubber.

36. An electronic packaging system as recited in claim 1, further comprising a hard cap, wherein said hard cap covers said electronic device.

37. An electronic packaging system as recited in claim 36, wherein said hard cap includes an opening, further comprising a gel within said hard cap, wherein said gel can be displaced through said opening if said hard cap is subjected to a force.

12. An electronic packaging system, comprising:

an electronic device having a top surface and sides; and

a flexible material located adjacent a plurality of said sides of said electronic device, wherein said flexible material includes an array of surface elements, wherein said electronic device is located in a cavity in said flexible material, wherein said flexible material has a first height and a first width, wherein said electronic device has a second height, wherein said first height is greater than said second height and wherein said first width is greater than said first height so said flexible material protects said electronic device from loading.

13. An electronic packaging system as recited in claim 12, further comprising a first flexible member, said first flexible member including a first portion of said array of surface elements and a first flexible backing, wherein said first portion of said array of surface elements is integral with said first flexible backing.

14. An electronic packaging system as recited in claim 13, further comprising a substrate and an adhesive, wherein said first flexible backing is mounted to said substrate with said adhesive.

15. An electronic packaging system as recited in claim 14, wherein said adhesive includes a UV curable adhesive.

16. An electronic packaging system as recited in claim 13, further comprising a second flexible member, wherein said second flexible member includes a second portion of said array of surface elements and a second flexible backing, wherein said second portion of said array of surface elements is integral with said second flexible backing.

17. An electronic packaging system as recited in claim 16, wherein said first flexible member interlocks with said second flexible member.

18. An electronic packaging system as recited in claim 17, further comprising an adhesive for permanently bonding said first flexible member to said second flexible member.

19. An electronic packaging system as recited in claim 16, wherein surface elements of said first portion of said array of surface elements include a stem and wherein surface elements of said second portion of said array of surface elements include a stem.

20. An electronic packaging system as recited in claim 19, wherein surface elements of said first portion of said array of surface elements include a stem having a mushroom top, and wherein surface elements of said second portion of said array of surface elements include a stem having a mushroom top, wherein said mushroom tops of said first portion of said array interlock with said mushroom tops of said second portion of said array.

21. An electronic packaging system as recited in claim 19, wherein surface elements of said first portion of said array includes a stem having an extension, and wherein surface elements of said second portion of said array include a stem having a receptacle, wherein said extensions of said first portion of said array interlock with said receptacles of said second portion of said array.

22. An electronic packaging system as recited in claim 17, wherein surface elements of said first portion of said array of surface elements include a structure connected to surface elements of said second portion of said array of surface elements.

23. An electronic packaging system as recited in claim 22, wherein surface elements of said first portion of said array of surface elements include a first latching structure and wherein surface elements of said second portion of said array of surface elements include a second latching structure, wherein said first latching structure latches to said second latching structure.

24. An electronic packaging system as recited in claim 13, wherein said flexible member is capable of conforming to a surface curved in a first direction.

25. An electronic packaging system as recited in claim 24, wherein said flexible package is capable of conforming to a surface curved in a second direction perpendicular to said first direction.

26. An electronic packaging system as recited in claim 12, further comprising a substrate and an adhesive, wherein said array of surface elements is mounted to said substrate with said adhesive.

27. An electronic packaging system as recited in claim 26, wherein said adhesive includes a UV curable adhesive.

28. An electronic packaging system as recited in claim 12, further comprising an antenna, wherein said antenna extends through said array of surface elements.

29. An electronic packaging system as recited in claim 13, further comprising a sheet of insulating carrier, wherein said electronic device is mounted to said sheet of insulating carrier.

30. An electronic packaging system as recited in claim 29, wherein said first flexible member includes a hole, wherein said electronic device extends through said hole and wherein said sheet of insulating carrier adheres to said first flexible member.

31. An electronic packaging system as recited in claim 29, wherein said sheet of insulating carrier includes polyimide.

32. An electronic packaging system as recited in claim 29, wherein said sheet of insulating carrier includes patterned metalization.

33. An electronic packaging system as recited in claim 32, wherein said patterned metalization includes a patterned antenna.

34. An electronic packaging system as recited in claim 12, further including a plurality of said electronic devices.

35. An electronic packaging system as recited in claim 34, wherein an array of surface elements surrounds each of said plurality of electronic devices.

38. An electronic packaging system as recited in claim 12, wherein said array is one dimensional, wherein said array includes ribs.

39. A protective system, comprising a hard cap and a gel, wherein said hard cap has an opening, wherein said gel is within said hard cap and wherein a portion of said gel extends to said opening before pressure is applied to said hard cap, wherein said portion can leave through said opening when a pressure is applied to said hard cap.

40. A protective system as recited in claim 39, wherein said cap has a plurality of openings.

41. A protective system as recited in claim 39, wherein said gel includes at least one from the group consisting of vulcanized rubber and polyurethane.

42. A protective system as recited in claim 39, wherein said gel is colored.

43. A protective system as recited in claim 39, wherein said gel fills space between said device and said hard cap.

44. A protective system as recited in claim 39, wherein when said pressure is applied to said hard cap departure of said gel through said opening reduces force transmitted to said device.

45. A protective system as recited in claim 39, wherein said device includes an electronic device.

46. An electronic packaging system, comprising:

an electronic device;

a first flexible backing;

a second flexible backing;

first surface elements mounted to said first flexible backing, wherein said first surface elements extend adjacent sides of said electronic device, wherein said electronic device is located in an area that is free of said first surface elements; and

second surface elements mounted to said second flexible backing, wherein said first surface elements are interlocked with said second surface elements, wherein said second surface elements extend adjacent sides of said electronic device.

47. An electronic packaging system as recited in claim 46, wherein each said first surface element and each said second surface element includes a rib.

48. An electronic packaging system as recited in claim 46, wherein each said first surface element and each said second surface element includes a stem.

49. An electronic packaging system as recited in claim 46, wherein said electronic device is located in an area that is free of said second surface elements.

50. An electronic packaging system, comprising:

an electronic device;

a first flexible member, said first flexible member including a first portion of an array of surface elements and a first flexible backing, wherein said first portion of said array of surface elements is integral with said first flexible backing, wherein surface elements of said first portion of said array of surface elements extend from said backing adjacent sides of said electronic device, wherein said electronic device is located in an area that is free of said surface elements.

51. An electronic packaging system as recited in claim 50, wherein each element of said array includes a rib.

52. An electronic packaging system as recited in claim 50, wherein each element of said array includes a stem.

53. An electronic packaging system, comprising:

an electronic device;

a flexible material located adjacent a plurality of sides of said electronic device, wherein said electronic device includes a top surface, wherein said flexible material is located so said top surface is free of said flexible material; and

a layer covering said electronic device, wherein said flexible material is configured to prevent loading of said electronic device when said layer is subject to loading.

54. An electronic packaging system as recited in claim 53, wherein said flexible material has a thickness greater than thickness of said electronic device.

55. An electronic packaging system, comprising:

an electronic device;

a flexible material located adjacent a plurality of sides of said electronic device, wherein said electronic device includes a top surface, wherein at least one substance coats said top surface, wherein said at least one substance has a substance thickness, wherein said electronic device has an electronic device thickness wherein said flexible material has a thickness greater than said electronic device thickness plus said substance thickness; and

a layer covering said electronic device, wherein said flexible material is configured to prevent loading of said electronic device when said layer is subject to loading.