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RFID tag packaging system

  • US 7,696,621 B2
  • Filed: 07/05/2007
  • Issued: 04/13/2010
  • Est. Priority Date: 07/05/2006
  • Status: Active Grant
First Claim
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1. An electronic packaging system, comprising:

  • an electronic device having a top surface and sides; and

    a flexible material located adjacent a plurality of said sides of said electronic device, wherein said electronic device is located in a cavity in said flexible material, wherein said top surface is free of said flexible material, wherein said flexible material has a first height and a first width, wherein said electronic device has a second height, wherein said first height is greater than said second height and wherein said first width is greater than said first height so said flexible material protects said electronic device from loading.

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