Radio frequency identification transponder antenna

• US 7,696,947 B2
• Filed: 09/23/2005
• Issued: 04/13/2010
• Est. Priority Date: 09/06/2005
• Status: Active Grant

• Current Assignee: Smartrac Technology GmbH (Avery Dennison Corporation)
• Original Assignee: SMARTRAC TECHNOLOGY Dresden GmbH (OEP Technologie BV)
• Inventors: Ruprecht, Harald, Gallschuetz, Sebastian
• Primary Examiner(s): Ho; Tan
• Application Number:
  US11/234,427
• Publication Number:
  US 20070052613A1
• Time in Patent Office: 1,663 Days
• Field of Search: 343/860, 343/741, 340/572.1, 340/572.5
• US Class Current: 343/860
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06K 19/07756 the connection being non-galvanic, e.g. capacitive
• CPC Class Codes: H01Q 1/2208 associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems methods or arrangements for sensing record carriers, e.g. for reading patterns G06K7/00; record carrier for use with machines and with at least a part designed to carry digital markings G06K19/00
• CPC Class Codes: H01Q 1/38 formed by a conductive layer on an insulating support patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142

Abstract

A RFID transponder having a microchip or integrated circuit, an impedance-matching structure and a resonant structure mounted on at least one substrate and connected to each other by an electric field.

Claims

1. A RFID transponder, comprising:

a microchip comprising a real component;

an impedance-matching structure of looped configuration electrically connected to the microchip;

a resonant structure connected to the microchip and impedance-matching structure by an electric field and positioned relative to the impedance-matching structure so as to match the termination impedance of the antenna to the real component of the microchip.

2. The transponder of claim 1, further comprising a first substrate for mounting at least the impedance-matching component.

3. The transponder of claim 2, wherein the microchip is mounted on the first substrate.

4. The transponder of claim 3, wherein the resonant component is mounted on the first substrate.

5. The transponder of claim 2, wherein the first substrate comprises first and second surfaces and wherein the impedance-matching structure is mounted on the first surface and the resonant structure is mounted on the second surface.

6. The transponder of claim 5, wherein the first and second surfaces are disposed on opposite sides of the substrate.

7. The transponder of claim 2, further comprising a second substrate for mounting the resonant structure.

8. The transponder of claim 2, wherein the substrate is flexible.

9. The transponder of claim 8, wherein the entire transducer is flexible.

10. The transponder of claim 8, wherein the substrate consists of one of polymer film, paper, textile, rubber, leather and flexible polymer laminate.

11. The transponder of claim 1, further comprising a substrate forming the resonant structure and wherein the impedance-matching structure is mounted on the substrate.

12. The transponder of claim 11, wherein the impedance-matching structure is deposited on the substrate as one of a metallic stamped component, a stamped and bent component, and a wire.

13. The transponder of claim 11, wherein the substrate is provided with a cavity and wherein the impedance-matching structure is provided in the cavity.

14. The transponder of claim 1, wherein the resonant structure is structured as an element of an article to be marked and wherein the impedance-matching structure is arranged on the article.

15. The transponder of claim 1, wherein at least one of the resonant structure and the impedance-matching structure are made of one of metal, electrically conductive polymer, electrically conductive dyes and electrically conductive particles.

16. The transponder of claim 1, wherein the resonant structure is of a substantially M-shaped configuration.

17. The transponder of claim 1, wherein the microchip is connected to the impedance-matching structure by one of flip chip mounting, wire, printed contacts and contacts fabricated by an additive process.