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Housing mechanism for electronic device

  • US 7,697,269 B2
  • Filed: 12/27/2006
  • Issued: 04/13/2010
  • Est. Priority Date: 02/10/2006
  • Status: Expired due to Fees
First Claim
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1. A housing mechanism for an electronic device, comprising:

  • a cover having a cover body, a sealing element, and a sidewall, the sidewall being formed around the cover body, a surface of a distal end of the sidewall being recessed to form a receiving slot therein, the sealing element having a connecting portion and a positioning portion connected to the connecting portion, the connecting portion being fixedly received in the receiving slot; and

    a frame having a positioning slot defined therein and the positioning portion of the sealing element being configured for reception in the positioning slot of the frame when the cover is closed to the frame.

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