Electronic unit and method for manufacturing an electronic unit

• US 7,697,300 B2
• Filed: 07/28/2004
• Issued: 04/13/2010
• Est. Priority Date: 08/01/2003
• Status: Active Grant

• Current Assignee: Vitesco Technologies GmbH (INA-Holding Schaeffler GmbH & Co. KG)
• Original Assignee: Siemens AG
• Inventors: Kerner, Nikolaus, Brandt, Jens
• Primary Examiner(s): Vortman; Anatoly
• Application Number:
  US10/566,698
• Publication Number:
  US 20080144290A1
• Time in Patent Office: 2,085 Days
• Field of Search: 361/704, 361/705, 361/728, 361/736, 361/737, 361/720
• US Class Current: 361/736
• CPC Class Codes: B60R 16/0239 Electronic boxes
• CPC Class Codes: H05K 5/0052 characterized by joining features of the housing parts
• CPC Class Codes: Y10T 29/49128 Assembling formed circuit to base

Abstract

An electronic unit, in particular a control device for a motor vehicle, has a printed circuit board, populated with electronic components, and a housing enclosing the printed circuit board. The printed circuit board has at least one first section, arranged at a distance from the housing and equipped with electronic components on both sides thereof, and at least one second section which is connected to the housing by way of a heat-conducting adhesive layer.

Claims

1. An electronic unit, comprising:

a printed circuit board having a central region populated with electronic components on both sides thereof, and an edge region adjoining said central region;

a housing enclosing said printed circuit board, said housing having a housing floor and a housing cover connected to said housing floor, said housing floor formed with a first surface having an outer region, a continuous wall surrounding said outer region of said first surface, and a raised second surface being raised with respect to said first surface, said wall extending from said first surface to said raised second surface, said first surface extending in a first direction from said continuous wall, said raised second surface extending in a second direction from said continuous wall, said second direction being opposite the first direction;

said central region of said printed circuit board being disposed spaced apart from said housing and said edge region being connected to said raised second surface of said housing floor via a heat-conducting adhesive layer;

said housing cover having an edge formed with an annularly continuous projection engaging into a corresponding groove formed in said raised second surface of said housing floor, said projection and said groove together forming a groove-and-projection connection and being glued to one another.

2. The electronic unit according to claim 1 configured as a control device for a motor vehicle and populated with electronic components for controlling the motor vehicle.

3. The electronic unit according to claim 1, wherein a common adhesive is used for said glued groove-and-projection connection and for said adhesive layer connecting said printed circuit board and said housing.

4. The electronic unit according to claim 1, which comprises at least one plug connector integrated in said housing cover for electrically connecting said electronic unit.

5. The electronic unit according to claim 4, wherein said plug connector includes terminal pins running straight to said printed circuit board and forming direct contact with said printed circuit board.

6. The electronic unit according to claim 5, wherein said terminal pins contact said circuit board via press-in contacts.

7. The electronic unit according to claim 1, wherein said edge region is a printed circuit board section running along a large part of an edge of said printed circuit board.

8. The electronic unit according to claim 7, wherein said edge region is a printed circuit board section running in an annularly continuous manner along said edge of said printed circuit board.

9. The electronic unit according to claim 1, wherein said edge region has first side at least partly populated with the electronic components, and a second side connected with said heat-conducting adhesive layer.

10. The electronic unit according to claim 1, wherein the raised second surface of the housing floor dissipates heat away from the printed circuit board and serves as a main support for the printed circuit board.

11. A method for manufacturing an electronic unit, which comprises the following steps:

a) providing a printed circuit board with at least one first printed circuit board section in a central area thereof, being populated on both sides with electronic components, and having at least one second printed circuit board section arranged at an edge of the printed circuit board and having one side not populated with electronic components;

b) providing a contoured housing floor formed with a first surface having an outer region, a continuous wall surrounding the outer region of the first surface, and a raised second surface being raised with respect to the first surface, the wall extending from the first surface to the raised second surface, the raised second surface including an edge region having an annularly continuous groove formed therein, the first surface extending in a first direction from the continuous wall, the raised second surface extending in a second direction from the continuous wall, the second direction being opposite the first direction;

c) depositing heat-conducting adhesive on the raised second surface;

d) pressing on the printed circuit board in order to bond the printed circuit board on the raised second surface of the housing floor;

e) providing a housing cover having a projection configured to mate in annularly continuous circumferential engagement with the groove of the raised second surface of the housing floor, pressing the housing cover onto the housing floor with adhesive disposed to create a glued groove-and-projection connection between housing floor and housing cover.

12. The method according to claim 11, which comprises depositing the adhesive on the base of the circumferential groove prior to the step of pressing the housing cover onto the housing floor.

13. The method according to claim 11, wherein a common adhesive is used in the steps c) and e).

14. The method according to claim 11, which further comprises performing steps c) and d) to enable the raised second surface of the housing floor to dissipate heat away from the printed circuit board and to serve as a main support for the printed circuit board.