Integrated back-end integrated circuit manufacturing assembly

• US 7,698,015 B1
• Filed: 03/22/2005
• Issued: 04/13/2010
• Est. Priority Date: 02/27/2001
• Status: Expired due to Fees

• Current Assignee: Monterey Research, LLC (Vector Capital Corporation)
• Original Assignee: Cypress Semiconductor Corporation (Infineon Technologies AG)
• Inventors: Chang, Bo Soon
• Primary Examiner(s): Jarrett, Ryan A
• Application Number:
  US11/087,484
• Time in Patent Office: 1,848 Days
• Field of Search: 700/121, 438/106
• US Class Current: 700/121
• CPC Class Codes: H01L 21/67276 Production flow monitoring, e.g. for increasing throughput program-control systems per se G05B19/00, e.g. total factory control G05B19/418
• CPC Class Codes: H01L 22/20 Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/014 Solder alloys

Abstract

An integrated back-end integrated circuit (IC) manufacturing assembly is disclosed. In one embodiment, the present invention has a front-of-line portion comprising a plurality of integrated sub-stations for operating on a first plurality of die-strips on an in-line basis to produce a second plurality of die-strips. The present embodiment further comprises an end-of-line portion coupled to the front-of-line portion and comprising a plurality of integrated sub-stations for operating on the second plurality of die-strips on an in-line basis to produce die-strip components. The present embodiment also comprises an in-line test portion coupled to the end-of-line portion for testing the die-strip components. The present embodiment further comprises a finish portion coupled to the in-line test portion and comprising a plurality of integrated sub-stations operating on tested die-strip components. In addition, camera systems perform automated visual inspection of dies on the die-strip and maintain a database that can be used for automated reject management.

Claims

1. An integrated semiconductor manufacturing system comprising:

a first plurality of integrated sub-stations for operating on a first plurality of die-strips on an in-line basis to produce a second plurality of die-strips, wherein a next one of said first plurality of die-strips enters said first plurality of integrated sub-stations as soon as a previous one of said first plurality of die-strips clears said first plurality of integrated sub-stations;

a second plurality of integrated sub-stations coupled to said first plurality of integrated sub-stations for operating on said second plurality of die-strips on an in-line basis to produce die-strip components;

a third plurality of integrated sub-stations coupled to said second plurality of integrated sub-stations for testing said die-strip components;

a fourth plurality of integrated sub-stations coupled to said third plurality of integrated sub-stations operating on tested die-strip components;

a manufacturing execution system coupled to said first, second, third and fourth pluralities of integrated sub-stations for managing said die strips and said die-strip components; and

a plurality of automated carriers configured to automatically provide said second plurality of die-strips from said first plurality of sub-stations to said second plurality of sub-stations in an in-line fashion, to automatically provide said die-strip components from said second plurality of sub-stations to said third plurality of sub-stations in an in-line fashion, and to automatically provide said tested die-strip components from said third plurality of sub-stations to said fourth plurality of sub-stations in an in-line fashion.

2. The system as described in claim 1 wherein one of said first plurality of sub-stations is an in-line plasma sub-station.

3. The system as described in claim 1 wherein one of said first plurality of sub-stations is a snap cure sub-station.

4. The system as described in claim 1 wherein said first plurality of sub-stations comprise:

an in-line die attach sub-station for attaching dies to a strip to produce said first plurality of die-strips;

an in-line cure sub-station;

a first in-line plasma sub-station;

an in-line wire bond sub-station; and

a

second in-line plasma sub-station.

5. The system as described in claim 4 wherein said manufacturing execution system comprises camera systems for performing automated die-strip inspection and quality assurance at said die attach and wire bond sub-stations.

6. The system as described in claim 1 wherein said second plurality of sub-stations comprise:

an in-line mold sub-station;

an in-line post mold cure sub-station;

an in-line solder ball attachment sub-station;

an in-line sawing sub-station; and

a sorting sub-station.

7. The system as described in claim 6 wherein said manufacturing execution system comprises camera systems for performing automated product inspection and quality assurance at said mold, solder ball attachment and sorting sub-stations.

8. The system as described in claim 1 wherein said fourth plurality of sub-stations comprise:

a marking sub-station;

a final visual inspection sub-station;

and a tape and reel sub-station.

16. The system as described in claim 1 wherein said fourth plurality of semiconductor processing equipment comprises:

a marking semiconductor processing equipment;

a final visual semiconductor processing equipment; and

a tape and reel semiconductor processing equipment.

9. An integrated semiconductor manufacturing system comprising:

a first plurality of semiconductor processing equipment for operating on a first plurality of die-strips on an in-line basis to produce a second plurality of die-strips, wherein a next one of said first plurality of die-strips enters a front-of-line portion as soon as a previous one of said first plurality of die-strips clears said front-of-line portion;

a second plurality of semiconductor processing equipment coupled to said first plurality of semiconductor processing equipment for operating on said second plurality of die-strips on an in-line basis to produce die-strip components;

a third plurality of semiconductor processing equipment coupled to said second plurality of semiconductor processing equipment for testing said die-strip components;

a fourth plurality of semiconductor processing equipment coupled to said third plurality of semiconductor processing equipment operating on tested die-strip components;

a manufacturing execution system coupled to said first, second, third and fourth pluralities of semiconductor processing equipment for managing said die strips and said die-strip components; and

a plurality of automated carriers configured to automatically provide said second plurality of semiconductor processing equipment from said first plurality of semiconductor processing equipment to said second plurality semiconductor processing equipment in an in-line fashion, to automatically provide said die-strip components from said second plurality of semiconductor processing equipment to said third plurality of semiconductor processing equipment in an in-line fashion, and to automatically provide said tested die-strip components from said third plurality of semiconductor processing equipment to said fourth plurality of semiconductor processing equipment in an in-line fashion.

10. The system as described in claim 9 wherein one of said first plurality of semiconductor processing equipment is an in-line plasma semiconductor processing equipment.

11. The system as described in claim 9 wherein one of said first plurality of semiconductor processing equipment is a snap cure semiconductor processing equipment.

12. The system as described in claim 9 wherein said first plurality of semiconductor processing equipment comprise:

an in-line die attach semiconductor processing equipment for attaching dies to a strip to produce said first plurality of die-strips;

an in-line cure semiconductor processing equipment;

a first in-line plasma semiconductor processing equipment;

an in-line wire bond semiconductor processing equipment;

and a second in-line plasma semiconductor processing equipment.

13. The system as described in claim 12 wherein said manufacturing execution system comprises camera systems for performing automated die-strip inspection and quality assurance at said die attach and wire bond semiconductor processing equipment.

14. The system as described in claim 9 wherein said second plurality of semiconductor processing equipment comprise:

an in-line mold semiconductor processing equipment;

an in-line post mold cure semiconductor processing equipment;

an in-line solder ball attachment semiconductor processing equipment;

an sawing semiconductor processing equipment; and

a sorting semiconductor processing equipment.

15. The system as described in claim 14 wherein said manufacturing execution system comprises camera systems for performing automated product inspection and quality assurance at said mold, solder ball attachment and sorting semiconductor processing equipment.