Soldering tip, soldering iron, and soldering system

• US 7,699,208 B2
• Filed: 11/30/2007
• Issued: 04/20/2010
• Est. Priority Date: 11/30/2007
• Status: Expired due to Fees

• Current Assignee: Nordson Corporation
• Original Assignee: Nordson Corporation
• Inventors: Forti, Michael S., Gaugler, Kevin W., Vivari, John A. Jr., Wheeler, Keith
• Primary Examiner(s): STONER, KILEY SHAWN
• Application Number:
  US11/948,544
• Publication Number:
  US 20090140028A1
• Time in Patent Office: 872 Days
• Field of Search: None
• US Class Current: 228/51
• CPC Class Codes: B23K 1/0016 Brazing of electronic components
• CPC Class Codes: B23K 2101/40 Semiconductor devices
• CPC Class Codes: B23K 3/025 Bits or tips
• CPC Class Codes: B23K 3/047 electric
• CPC Class Codes: B23K 3/063 for wire feeding

Abstract

A soldering system for melting a solder to form a joint between a first workpiece and a second workpiece is described. The system may comprise an energy generating system, a soldering tip, and a dispenser adapted to dispense controlled amounts of the solder. The soldering tip includes a non-wetting solder contact layer in operative communication with the energy generating system. The energy generating system may include induction, electrical, or heat generating systems in communication with the soldering tip. The non-wetting solder contact layer comprises a material that is not wettable by the molten solder. The system permits control of an amount of the solder in the joint.

Claims

1. A soldering tip comprising:

a non-wetting solder contact layer adapted to conduct heat to a solder, to melt the solder, and to be in contact with the molten solder, wherein the non-wetting solder contact layer comprises a material that is not wettable by the molten solder and is configured to be in communication with an energy generating system that causes the non-wetting solder contact layer to generate heat;

a support structure, wherein the non-wetting solder contact layer covers at least a portion of the support structure and is in thermal communication therewith; and

a protective layer between the support structure and the non-wetting solder contact layer.

2. The soldering tip of claim 1 wherein the non-wetting solder contact layer comprises at least one of a nonfusible metal, a metal nitride, a metal oxide, a metal phosphate, a refractory metal or combinations thereof.

3. The soldering tip of claim 1 wherein the non-wetting solder contact layer comprises at least one of chromium, titanium, niobium, molybdenum, tungsten, chromium nitride, aluminum nitride, titanium nitride, an aluminum phosphate compound, or a refractory metal or combinations thereof.

4. The soldering tip of claim 1 wherein the non-wetting solder contact layer consists essentially of chromium, chromium nitride, titanium, titanium nitride, or combinations thereof.

5. The soldering tip of claim 1 wherein the protective layer comprises iron.

6. A soldering iron comprising:

a non-wetting solder contact layer adapted to conduct heat to a solder, to melt the solder, and to be in contact with the molten solder, wherein the non-wetting solder contact layer comprises a material that is not wettable by the molten solder; and

an energy generating system in operative communication with the non-wetting solder contact layer, wherein the energy generating system is adapted to cause the non-wetting solder contact layer to generate heat to melt the solder;

wherein the energy generating system includes an electrical power supply in electrical communication with the non-wetting solder contact layer such that heat is generated when electricity flows through the non-wetting solder contact layer.

7. The soldering iron of claim 6 further comprising a support structure, wherein the non-wetting solder contact layer covers at least a portion of the support structure.

8. A soldering system for melting a solder to form a joint between a first workpiece and a second workpiece, the system comprising:

an energy generating system;

a soldering tip in operative communication with the energy generating system, the soldering tip comprising a non-wetting solder contact layer adapted to conduct heat to a solder, to melt the solder, and to be in contact with the molten solder, wherein the energy generating system is configured to cause the non-wetting solder contact layer to generate heat and the non-wetting solder contact layer comprises a material that is not wettable by the molten solder; and

a dispenser adapted to dispense controlled amounts of the solder to a location proximate the soldering tip or the first workpiece and optionally the second workpiece;

wherein the energy generating system includes an electrical power supply in electrical communication with the non-wetting solder contact layer such that heat is generated when electricity flows through the non-wetting solder contact layer.

9. The soldering system of claim 8 further comprising a support structure, wherein the non-wetting solder contact layer covers at least a portion of the support structure.