Light-emitting element mounting board, light-emitting element module, lighting device, display device, and traffic signal equipment

• US 7,699,500 B2
• Filed: 12/05/2007
• Issued: 04/20/2010
• Est. Priority Date: 06/07/2005
• Status: Expired due to Fees

• Current Assignee: Fujikura Limited
• Original Assignee: Fujikura Limited
• Inventors: Ohashi, Masakazu, Suzuki, Ryuji, Takemoto, Kyosuke
• Primary Examiner(s): BRUCE, DAVID VERNON
• Application Number:
  US11/950,884
• Publication Number:
  US 20080130289A1
• Time in Patent Office: 867 Days
• Field of Search: 362/294, 362/296
• US Class Current: 362/294
• CPC Class Codes: F21K 9/00 Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 33/641 characterized by the materials
• CPC Class Codes: H05K 1/021 Components thermally connected to metal substrates or heat-sinks by insert mounting
• CPC Class Codes: H05K 1/053 the metal substrate being covered by an inorganic insulating layer
• CPC Class Codes: H05K 1/183 Components mounted in and supported by recessed areas of the printed circuit board
• CPC Class Codes: H05K 2201/0373 Conductors having a fine structure, e.g. providing a plurality of contact points with a structured tool providing micro- or nanometer scale roughness on a metal surface H05K2203/0307
• CPC Class Codes: H05K 2201/10106 Light emitting diode [LED]
• CPC Class Codes: H05K 3/0061 onto a metallic substrate, e.g. a heat sink heat sinks for electric apparatus H05K7/20

Abstract

In accordance with the present invention, a light-emitting element mounting board is provided including an enamel layer which covers the surface of a core metal, wherein reflective cup portions for mounting light-emitting elements are provided on one face of the board, and wherein a heat radiating part is formed by at least partially removing the enamel layer on the other face of the board, and exposing the core metal. Further, a light-emitting element module including light-emitting elements mounted thereon, a lighting device including the light-emitting element, a display device, and traffic signal equipment are provided.

Claims

1. A light-emitting element mounting board comprising:

a core metal;

an enamel layer which covers the surface of the core metal;

reflective cup portions for mounting light-emitting elements which are provided on one face of the board; and

a heat radiating part which is formed by at least partially removing the enamel layer on the other face of the board, and exposing the core metal.

2. The light-emitting element mounting board according to claim 1, wherein electrodes are pattern formed on the light-emitting element mounting face which is provided with said reflective cup portions.

3. The light-emitting element mounting board according to claim 1, wherein indentations are provided in said heat radiating part.

4. The light-emitting element mounting board according to claim 1, wherein a heat radiating structure which includes fins is connected to said heat radiating part.

5. A light-emitting element module comprising:

the light-emitting element mounting board according to claim 1, and

light-emitting elements mounted in the reflective cup portions of the board.

6. The light-emitting element module according to claim 5, wherein said reflective cup portions are resin sealed with transparent resin.

7. The light-emitting element module according to claim 5, wherein said reflective cup portions are resin sealed with transparent resin that intermixes fluorescent material.

8. The light-emitting element module according to claim 7, wherein said light-emitting elements include white light-emitting elements which are configured by combining blue light-emitting diodes and yellow light-emitting fluorescent material.

9. A lighting device which comprises the light-emitting element module according to claim 5.

10. A display device which comprises the light-emitting element module according to claim 5.

11. Traffic signal equipment which comprises the light-emitting element module according to claim 5.

12. A light-emitting element mounting board comprising:

(i) a metal substrate which comprises a board body with a flat face on the front side where light-emitting elements are mounted, and a heat radiating part composed of one or more fins projecting from the rear face of this board body;

(ii) an enamel layer which covers at least the front side of said metal substrate.

13. The light-emitting element mounting board according to claim 12, wherein cup structures are formed which reflect the light emitted from the light-emitting elements in a predetermined direction.

14. The light-emitting element mounting board according to claim 12, wherein said heat radiating part is configured from at least two plate-shaped fins.

15. The light-emitting element mounting board according to claim 14, wherein said plate-shaped fins are provided in a mutually parallel manner in the lengthwise direction of the board body.

16. The light-emitting element mounting board according to claim 12, wherein said heat radiating part is configured from at least two pin-shaped fins.

17. The light-emitting element mounting board according to claim 14, wherein said fins are provided on the rear side of the mounting positions of the light-emitting elements.

18. The light-emitting element mounting board according to claim 14, wherein at least one hole is provided in said fins.

19. A light-emitting element module comprising:

the light-emitting element mounting board according to claim 12, and

light-emitting elements mounted on the board.

20. The light-emitting element mounting board according to claim 13, wherein the fins and the cup structures face each other on the front and rear faces of the board body.