Method for production of a film

• US 7,700,402 B2
• Filed: 10/19/2004
• Issued: 04/20/2010
• Est. Priority Date: 10/24/2003
• Status: Expired due to Fees

• Current Assignee: Leonhard KURZ Stiftung & Company KG
• Original Assignee: Leonhard KURZ Stiftung & Company KG
• Inventors: Brehm, Ludwig, Wild, Heinrich, Hansen, Achim
• Primary Examiner(s): Parker; Kenneth A
• Assistant Examiner(s): Ho; Anthony
• Application Number:
  US10/576,098
• Publication Number:
  US 20070077679A1
• Time in Patent Office: 2,009 Days
• Field of Search: 438/99
• US Class Current: 438/99
• CPC Class Codes: C09J 2301/204 the adhesive coating being discontinuous
• CPC Class Codes: C09J 2467/006 in the substrate
• CPC Class Codes: C09J 7/38 Pressure-sensitive adhesives [PSA]
• CPC Class Codes: H01L 21/6835 using temporarily an auxiliary support
• CPC Class Codes: H01L 2221/68359 used as a support during manufacture of interconnect decals or build up layers
• CPC Class Codes: H10K 71/18 using non-liquid printing techniques, e.g. thermal transfer printing from a donor sheet
• CPC Class Codes: H10K 71/60 Forming conductive regions or layers, e.g. electrodes

Abstract

The invention concerns a film having at least one electrical component and a process for the production of such a film. An adhesive layer comprising a radiation-cross-linkable adhesive is applied to a base film. The adhesive layer is applied to the base film in a form of being structured in pattern form and/or is irradiated in pattern form in such a way that the adhesive layer hardens with structuring in pattern form. A transfer film which comprises a carrier film and an electrical functional layer is applied to the adhesive layer. The carrier film is pulled off the film body comprising the base film, the adhesive layer and the electrical functional layer, wherein in a first region structured in pattern form the electrical functional layer remains on the base film and in a second region structured in pattern form the electrical functional layer remains on the carrier film and is pulled off the base film with the carrier film.

Claims

1. A process for the production of a film having at least one electrical component, in particular of organic semiconductor technology, wherein an adhesive layer comprising a radiation-cross-linkable adhesive is applied to a base film, the adhesive layer of the radiation-cross-linkable adhesive is applied in a form structured in pattern form to the base film and/or is irradiated in the form of a pattern in such a way that the adhesive layer hardens structured in a pattern form, a transfer film which comprises a carrier film and an electrical functional layer is applied to the adhesive layer with an orientation of the electrical functional layer to the adhesive layer, and the carrier film is removed from the film body including the base film, the adhesive layer and the electrical functional layer, wherein in a first region which is structured in pattern form the electrical functional layer remains as part of the electrical component on the adhesive layer and on the base film and in a second region which is structured in pattern form the electrical functional layer remains on the carrier film and is removed with the carrier film from the base film, wherein the adhesive layer comprising a radiation-cross-linkable adhesive is irradiated in pattern form after application of the transfer film, whereby the adhesive layer hardens in a region structured in pattern form, and the carrier film is removed from the film body including the base film, the adhesive layer and the electrical functional layer, so that the electrical functional layer remains on the base film in the first region which is structured in pattern form and in which the adhesive layer is hardened and is removed with the carrier film in the second region in which the adhesive layer is not hardened.

2. A process according to claim 1, wherein the adhesive layer comprising the radiation-cross-linkable adhesive is applied to the base film by means of a printing process with structuring in pattern form.

3. A process according to claim 2, wherein the transfer film is radiation-transparent and the adhesive layer is exposed from the side of the transfer film through the transfer film.

4. A process according to claim 2, wherein the base film is radiation-transparent and the adhesive layer is exposed from the side of the base film through the base film.

5. A process according to claim 1, wherein the adhesive layer is printed on to the base film by means of intaglio printing.

6. A process according to claim 1, wherein the adhesive layer is printed on to the base film by means of offset printing or flexoprinting.

7. A process according to claim 1, wherein a radiation cross-linkable adhesive is used, which in the non-hardened condition has a lower adhesion force with respect to the electrical functional layer than the adhesion force between the electrical functional layer and the carrier film.

8. A process according to claim 1, wherein a mask exposure device, in particular a drum exposure device or a mask exposure device with a mask belt is used for the exposure operation.

9. A process according to claim 1, wherein a transfer film is used, which has a release layer between the carrier film and the electrical functional layer.

10. A process according to claim 1, wherein the electrical functional layer is an electrically conductive layer.

11. A process according to claim 10, wherein the electrical functional layer contains conductive nanoparticles, in particular metal, carbon black or graphite particles.

12. A process according to claim 11, wherein the electrical functional layer comprises conductive nanoparticles and binding agent.

13. A process according to claim 11, wherein the electrical functional layer is compressed upon being applied to the base film, whereby the electrical conductivity of the functional layer is increased.

14. A process according to claim 10, wherein the electrical functional layer contains conductive polymers.

15. A process according to claim 10, wherein the electrical functional layer contains inorganic substances, for example ITO material.

16. A process according to claim 10, wherein the electrical functional layer is a metal layer or a layer of a metal alloy.

17. A process according to claim 1, wherein the electrical functional layer is an electrical semiconducting layer which has in particular semiconducting polymers.

18. A process according to claim 1, wherein the adhesive layer comprises an electrically non-conductive adhesive.

19. A process according to claim 1, wherein the adhesive layer comprises an electrically conductive adhesive.

20. A process for the production of a film having at least one electrical component, in particular of organic semiconductor technology, wherein an adhesive layer comprising a radiation-cross-linkable adhesive is applied to a base film, the adhesive layer is applied in a form structured in pattern form to the base film and/or is irradiated in the form of a pattern in such a way that the adhesive layer hardens structured in a pattern form, a transfer film which comprises a carrier film and an electrical functional layer is applied to the adhesive layer with an orientation of the electrical functional layer to the adhesive layer and the carrier film is removed from the film body including the base film, the adhesive layer and the electrical functional layer, wherein in a first region which is structured in pattern form the electrical functional layer remains as part of the electrical component on the adhesive layer and on the base film and in a second region which is structured in pattern form the electrical functional layer remains on the carrier film and is removed with the carrier film from the base film, wherein the adhesive layer comprising the radiation-cross-linkable adhesive is irradiated in pattern form prior to the application of the transfer film in such a way that the adhesive layer hardens in a region structured in pattern form, the transfer film is applied to the adhesive layer which is hardened structured in pattern form and the carrier film is removed from the film body including the base film, the adhesive layer and the electrical functional layer, so that the electrical functional layer remains on the base film in the first region which is structured in pattern form and in which the adhesive layer is not hardened and is removed with the carrier film in the second region which is structured in pattern form and in which the adhesive layer is hardened.

21. A process according to claim 20, wherein the adhesive layer is then irradiated in a second exposure step for hardening the regions of the adhesive layer, which are not yet hardened.