Sensor component and panel used for the production thereof

• US 7,700,956 B2
• Filed: 06/04/2004
• Issued: 04/20/2010
• Est. Priority Date: 06/23/2003
• Status: Active Grant

• Current Assignee: Infineon Technologies AG
• Original Assignee: Infineon Technologies AG
• Inventors: Jerebic, Simon, Woerner, Holger, Fuergut, Edward, Pohl, Jens, Strobel, Peter, Goller, Bernd, Hagen, Robert-Christian
• Primary Examiner(s): LOUIE, WAI SING
• Application Number:
  US10/561,819
• Publication Number:
  US 20070128754A1
• Time in Patent Office: 2,146 Days
• Field of Search: 257/226, 257/723, 257/678, 257/E31.117, 257/E31.127, 257431-434, 257/80, 257/81, 257/184, 257/444
• US Class Current: 257/80
• CPC Class Codes: G01J 1/02 Details
• CPC Class Codes: G01J 1/0204 Compact construction
• CPC Class Codes: G01J 1/0411 using focussing or collimating elements, i.e. lenses or mirrors; Aberration correction
• CPC Class Codes: H01L 2224/04105 Bonding areas formed on an encapsulation of the semiconductor or solid-state body, e.g. bonding areas on chip-scale packages
• CPC Class Codes: H01L 2224/12105 Bump connectors formed on an encapsulation of the semiconductor or solid-state body, e.g. bumps on chip-scale packages
• CPC Class Codes: H01L 2224/24195 the item being a discrete passive component
• CPC Class Codes: H01L 2224/24227 the HDI interconnect not connecting to the same level of the item at which the semiconductor or solid-state body is mounted, e.g. the semiconductor or solid-state body being mounted in a cavity or on a protrusion of the item
• CPC Class Codes: H01L 2224/32145 the bodies being stacked
• CPC Class Codes: H01L 2224/73267 Layer and HDI connectors
• CPC Class Codes: H01L 2224/96 the devices being encapsulated in a common layer, e.g. neo-wafer or pseudo-wafer, said common layer being separable into individual assemblies after connecting
• CPC Class Codes: H01L 23/5389 the chips being integrally enclosed by the interconnect and support structures
• CPC Class Codes: H01L 24/24 of an individual high density interconnect connector
• CPC Class Codes: H01L 24/82 by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI] interconnection structure between a plurality of semiconductor chips H01L23/5389
• CPC Class Codes: H01L 25/16 the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
• CPC Class Codes: H01L 2924/01004 Beryllium [Be]
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/0101 Neon [Ne]
• CPC Class Codes: H01L 2924/01032 Germanium [Ge]
• CPC Class Codes: H01L 2924/01052 Tellurium [Te]
• CPC Class Codes: H01L 2924/01057 : Lanthanum [La]
• CPC Class Codes: H01L 2924/01058 : Cerium [Ce]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H04N 23/54 : Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
• CPC Class Codes: H04N 23/55 : Optical parts specially adapted for electronic image sensors; Mounting thereof
• CPC Class Codes: H04N 23/57 : Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices

Abstract

A sensor component and a panel used for the production thereof is disclosed. The sensor component has, in addition to a sensor chip with a sensor region, a rear side and passive components. These are embedded jointly in a plastics composition, in such a way that their respective electrodes can be wired from an overall top side of a plastic plate.

Claims

1. A sensor component comprising:

a sensor chip with a sensor region, conductor tracks and contact areas on an active top side of the sensor chip;

a plastic plate, in which the sensor chip is embedded by its rear side and its edge sides, the active top side of the sensor chip and top sides of the contact areas, together with a top side of the plastic plate having a planar overall top side; and

a rewiring structure with a rewiring layer having flat rewiring lines from the contact areas to external contact areas of the sensor components, the rewiring structure being arranged on the planar overall top side.

2. The sensor component of claim 1, comprising:

wherein the overall top side comprises electrode areas of passive components embedded in the plastic plate, rewiring lines extending from the electrode areas to contact areas and/or to external contact areas.

3. The sensor component of claim 2, comprising:

wherein the overall top side comprises contact areas of a semiconductor chip with integrated circuit, rewiring lines extending from the contact areas of the semiconductor chip to contact areas of the sensor chip and/or to electrode areas and/or to external contact areas.

4. The sensor component of claim 1, comprising wherein the sensor chip and a semiconductor chip with integrated circuit are embedded in a manner stacked one above the other in the plastic plate, the sensor region forming a part of the overall top side.

5. The sensor component of claim 1, comprising wherein the sensor region is radiation-sensitive and comprises a lens.

6. The sensor component of claim 1, comprising wherein the plastic plate comprises through contacts, the through contacts being connected to external contact areas on a plastic plate rear side and being electrically connected to the rewiring lines on the overall top side.

7. A sensor component comprising:

a sensor chip with a sensor region, conductor tracks and contact areas on an active top side of the sensor chip;

a plastic plate, in which the sensor chip is embedded by its rear side and its edge sides, the active top side of the sensor chip and top sides of the contact areas, together with a top side of the plastic plate having a planar overall top side; and

means for connecting the contact areas to the external contact areas of the sensor components.

8. The sensor component of claim 7, comprising:

wherein the overall top side comprises electrode areas of passive components embedded in the plastic plate, rewiring lines extending from the electrode areas to contact areas and/or to external contact areas.