Imaging device

• US 7,701,026 B2
• Filed: 03/02/2007
• Issued: 04/20/2010
• Est. Priority Date: 03/20/2006
• Status: Expired due to Fees

• Current Assignee: Renesas Electronics Corporation
• Original Assignee: NEC Electronics Corporation (Renesas Electronics Corporation)
• Inventors: Abiko, Hitoshi
• Primary Examiner(s): Nguyen; Cuong Q
• Assistant Examiner(s): Lam; Cathy N
• Application Number:
  US11/712,976
• Publication Number:
  US 20070215922A1
• Time in Patent Office: 1,145 Days
• Field of Search: 257/447, 257/443, 257/228, 257/460, 257/E31.097, 257/E27.133, 438/75
• US Class Current: 257/443
• CPC Class Codes: H01L 27/14636 Interconnect structures
• CPC Class Codes: H01L 27/1464 Back illuminated imager structures
• CPC Class Codes: H01L 27/14678 Contact-type imagers

Abstract

A backside imaging device includes a bump that is disposed overlapping with a sensor array region or a photodiode in a planar view. By this configuration, the bump becomes a support, and the semiconductor substrate is prevented from being damaged because of a bending applied to the semiconductor substrate.

Claims

1. An imaging device comprising:

a semiconductor substrate having a first main surface and a second main surface, the second main surface is opposite to the first main surface and is passed by a light to be detected,

a plurality of photodiodes formed on the first main surface of the semiconductor substrate,

a wiring layer provided on the first main surface of the semiconductor substrate, and

a plurality of bumps provided on the wiring layer,

wherein at least one of the plurality of bumps is disposed overlapping with one of the plurality of photodiodes in a planar view,

wherein a peripheral circuitry is formed at a region of the first main surface of the semiconductor substrate where the plurality of photodiodes are not formed, and

at least one of the plurality of bumps is disposed overlapping with the periphery circuit in, and

wherein the peripheral circuitry includes a row decoder, a sense amplifier, and an I/O circuit.

2. The imaging device according to claim 1, wherein the plurality of photodiodes are formed at the first main surface at an equal interval.

3. The imaging device according to claim 1, wherein the plurality of bumps are provided on the wiring layer at an equal interval.

4. The imaging device according to claim 1, wherein the plurality of bumps are solder bumps.

5. The imaging device according to claim 1, wherein at least one of the plurality of bumps is disposed overlapping with a region where the periphery circuit is formed and also not overlapping with the photodiodes in.

6. The imaging device according to claim 1, wherein the bump, which is disposed overlapping with the photodiode in, is not used to output an image signal.

7. The imaging device according to claim 6, wherein the bump, which is disposed overlapping with the photodiode in, is connected to a power supply potential.

8. The imaging device according to claim 7, wherein the power supply potential is a ground potential.

9. The imaging device according to claim 6, wherein the bump, which is disposed overlapping with the photodiodes in a planar view, is set floating potential.

10. The imaging device according to claim 1, wherein the plurality of bumps are directly bonded to an electric component.

16. The imaging device according to claim 1, further comprising:

a mounting substrate having a surface that faces the semiconductor substrate, in which a plurality of electrode pads are provided on the first surface of the mounting substrate,

wherein the plurality of bumps directly connect the plurality of electrode pads to the wiring layer.

17. The imaging device according to claim 1, wherein the wiring layer is interposed directly between the first main surface of the semiconductor substrate and the plurality of bumps.

19. The imaging device according to claim 1, wherein the row decoder, the sense amplifier, and the I/O circuit are provided as separate rows on the first main surface of the semiconductor substrate.

11. An imaging device comprising:

a semiconductor substrate having a first main surface and a second main surface, the second main surface is opposite to the first main surface and is passed by a light to be detected,

a sensor array region formed on the first main surface of the semiconductor substrate,

a wiring layer provided on the first main surface of the semiconductor substrate, and

a plurality of bumps provided on the wiring layer,

wherein at least one of the plurality of bumps is disposed overlapping with the sensor array region in a planar view,

wherein a peripheral circuitry is formed at a region of the first main surface of the semiconductor substrate where the sensor array region is not formed, and

at least one of the plurality of bumps is disposed overlapping with the periphery circuit in, and

wherein the peripheral circuitry includes a row decoder, a sense amplifier, and an I/O circuit.

12. The imaging device according to claim 11, wherein the sensor array region has a plurality of photodiodes disposed two-dimensionally.

13. The imaging device according to claim 11, wherein the plurality of bumps are disposed two-dimensionally at equal interval.

20. The imaging device according to claim 11, wherein the row decoder, the sense amplifier, and the I/O circuit are provided as separate rows on the first main surface of the semiconductor substrate.

14. An imaging device comprising:

a semiconductor substrate having a first main surface, which has a first region where a plurality of photodiodes are formed, and a second main surface opposite to the first main surface and passed by a light to be detected, and

a plurality of bumps provided over the first region of the first main surface of the semiconductor substrate,

wherein a second region where the plurality of bumps are provided is not smaller than the first region where the plurality of photodiodes are formed,

wherein a peripheral circuitry is formed at a region of the first main surface of the semiconductor substrate where the plurality of photodiodes are not formed, and

at least one of the plurality of bumps is disposed overlapping with the periphery circuit in a planar view, and

wherein the peripheral circuitry includes a row decoder, a sense amplifier, and an I/O circuit.

15. The imaging device according to claim 14, further comprising a wiring layer interposed between the semiconductor substrate and the plurality of bumps.

18. The imaging device according to claim 14, further comprising

a mounting substrate having a surface that faces the semiconductor substrate, in which a plurality of electrode pads are provided on the first surface of the mounting substrate;

and

a wiring layer interposed directly between the first main surface of the semiconductor substrate and the plurality of bumps,

wherein the plurality of bumps directly connect the plurality of electrode pads to the wiring layer.