Bandage type sensor arrangement and carrier assembly therefore, and method of manufacture

• US 7,703,334 B2
• Filed: 10/04/2007
• Issued: 04/27/2010
• Est. Priority Date: 10/04/2007
• Status: Expired due to Fees

• Current Assignee: Medility, LLC
• Original Assignee: Medility, LLC
• Inventors: Cochran, William T.
• Primary Examiner(s): Caputo; Lisa M
• Assistant Examiner(s): DAVIS-HOLLINGTON, OCTAVIA L
• Application Number:
  US11/906,851
• Publication Number:
  US 20090090193A1
• Time in Patent Office: 936 Days
• Field of Search: 738/55
• US Class Current: 73/855
• CPC Class Codes: A61B 2562/02 Details of sensors specially adapted for in-vivo measurements
• CPC Class Codes: A61B 5/1126 using a particular sensing technique
• CPC Class Codes: G01B 7/24 using change in magnetic properties
• CPC Class Codes: G01D 11/245 Housings for sensors
• CPC Class Codes: G01D 11/30 Supports specially adapted for an instrument; Supports specially adapted for a set of instruments

Abstract

A bandage type sensor arrangement wherein the sensor includes two parts movable with respect to each other, a carrier assembly is connected to the sensor parts for maintaining the sensor parts in place prior to use, and that is readily detachable for releasing the sensor parts while providing a connection of the sensor parts to a surface to be monitored. A cover is included as part of the carrier assembly to protect the operation of the sensor.

Claims

1. A bandage type sensor for application to a flexible substrate for monitoring deformation of the substrate comprising:

a sensor having at least two movable parts relative to each other to provide indications of displacements there between;

a carrier assembly comprising a thin flexible material including at least first and second pads having a readily detachable connection to the substrate, each pad being adapted to receive an adhesive for attachment of the pads to separate sensor parts, and a cover extending over the sensor and portions of the carrier assembly, and secured to parts of the carrier assembly,

wherein the cover includes an adhesive for attaching to portions of the carrier assembly excluding the pads, and that portions of the carrier assembly include an adhesive for connection of the bandage type sensor to the substrate to be monitored, and wherein the carrier assembly includes flanges on one end thereof and adjacent to one pad and includes tear lines for detaching the flanges from the rest of the carrier assembly.

2. A bandage type sensor for application to a flexible substrate for monitoring deformation of the substrate comprising:

a sensor having at least two movable parts relative to each other to provide indications of displacements there between;

a carrier assembly comprising a thin flexible material including at least first and second pads having a readily detachable connection to the substrate, each pad being adapted to receive an adhesive for attachment of the pads to separate sensor parts, and a cover extending over the sensor and portions of the carrier assembly, and secured to parts of the carrier assembly,

wherein the cover includes an adhesive for attaching to portions of the carrier assembly excluding the pads, and that portions of the carrier assembly include an adhesive for connection of the bandage type sensor to the substrate to be monitored and wherein the carrier assembly includes flanges on one end thereof and adjacent to one pad and includes tear lines for detaching the flanges from the rest of the carrier assembly, and wherein the carrier assembly includes first and second wings extending from the carrier assembly adjacent to the other pad and including tear lines for detaching the wings from the carrier assembly and wherein the wings are significantly smaller than the flanges.