Method for producing a semiconductor wafer with profiled edge
First Claim
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1. A method for producing a semiconductor wafer with front and back sides and a profiled edge, comprising the following steps, in the order given:
- selecting a target profile for the profiled edge;
separating a semiconductor wafer from a crystal;
producing an edge profile in an edge profile producing step by a first grinding of the edge to acquire a profile that is true to scale with respect to the target profile, wherein the first grinding is performed with a grinding tool with rough grit;
machining at least one side of the wafer in a mechanical machining step, in which a thickness of the semiconductor wafer is reduced; and
further machining the edge in an edge profile machining step by a second grinding of the edge to acquire the target profile, wherein the second grinding is performed with a grinding tool with fine grit and the edge is smoothed thereby; and
etching and polishing the semiconductor wafer, wherein a chemical mechanical polishing of the edge is dispensed with after the edge profile machining step.
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Abstract
Semiconductor wafers with profiled edges, are produced with decreased losses due to edge or other damage by separating a semiconductor wafer from a crystal; profiling the edge in a profile producing step wherein the edge is mechanically machined to a profile that is true to scale with respect to a predefined target profile; mechanically machining the wafer to reduce the a thickness of the semiconductor wafer; and machining the edge profile to acquire the target profile.
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8 Claims
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1. A method for producing a semiconductor wafer with front and back sides and a profiled edge, comprising the following steps, in the order given:
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selecting a target profile for the profiled edge; separating a semiconductor wafer from a crystal; producing an edge profile in an edge profile producing step by a first grinding of the edge to acquire a profile that is true to scale with respect to the target profile, wherein the first grinding is performed with a grinding tool with rough grit; machining at least one side of the wafer in a mechanical machining step, in which a thickness of the semiconductor wafer is reduced; and further machining the edge in an edge profile machining step by a second grinding of the edge to acquire the target profile, wherein the second grinding is performed with a grinding tool with fine grit and the edge is smoothed thereby; and etching and polishing the semiconductor wafer, wherein a chemical mechanical polishing of the edge is dispensed with after the edge profile machining step. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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Specification