×

Iodine/iodide-containing hot melt coatable adhesive, methods and uses therefor

  • US 7,704,602 B2
  • Filed: 02/08/2007
  • Issued: 04/27/2010
  • Est. Priority Date: 04/25/2002
  • Status: Expired due to Fees
First Claim
Patent Images

1. The hot melt coatable adhesive comprisingsolubilized iodine,solubilized iodide,a preadhesive composition, anda non-volatile solubilizing liquid;

  • wherein the solubilizing liquid is selected from the group consisting of glycols, 3-methoxy-methylbutanol, polyethoxylated phenols, alkyl, aryl, and aralkyl ether glycols, polyethoxylated alkyl phenols, mono or polysubstituted polyethylene glycols, alkyl substituted N-alkyl pyrrolidones, N-butylbenzene sulfonamide, benzoate esters, polyethylene glycols, ethylene oxide propylene oxide random and block copolymers having a molecular weight less than 10,000 daltons, polypropylene glycol, polytetramethylene glycol, random and block copolymers of C2-C4 alkylene oxide groups, and a polymerizable solubilizing liquid.

View all claims
  • 0 Assignments
Timeline View
Assignment View
    ×
    ×