Methods and devices for fabricating three-dimensional nanoscale structures

• US 7,704,684 B2
• Filed: 12/01/2004
• Issued: 04/27/2010
• Est. Priority Date: 12/01/2003
• Status: Active Grant

• Current Assignee: Board of Trustees of The University of Illinois
• Original Assignee: Board of Trustees of The University of Illinois
• Inventors: Jeon, Seokwoo, Park, Jangung, Rogers, John A.
• Primary Examiner(s): McPherson; John A.
• Application Number:
  US11/001,689
• Publication Number:
  US 20060286488A1
• Time in Patent Office: 1,973 Days
• Field of Search: None
• US Class Current: 430/325
• CPC Class Codes: B81C 99/00 Subject matter not provided for in other groups of this subclass
• CPC Class Codes: B82B 3/00 Manufacture or treatment of nanostructures by manipulation of individual atoms or molecules, or limited collections of atoms or molecules as discrete units
• CPC Class Codes: B82Y 10/00 Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
• CPC Class Codes: B82Y 30/00 Nanotechnology for materials or surface science, e.g. nanocomposites
• CPC Class Codes: B82Y 40/00 Manufacture or treatment of nanostructures
• CPC Class Codes: G03F 1/50 Mask blanks not covered by G03F1/20 - G03F1/34; Preparation thereof
• CPC Class Codes: G03F 7/70283 Mask effects on the imaging process
• CPC Class Codes: G03F 7/703 Non-planar pattern areas or non-planar masks, e.g. curved masks or substrates
• CPC Class Codes: G03F 7/7035 Proximity or contact printers
• CPC Class Codes: G03F 7/70408 Interferometric lithography; Holographic lithography; Self-imaging lithography, e.g. utilizing the Talbot effect
• CPC Class Codes: Y10S 430/146 Laser beam

Abstract

The present invention provides methods and devices for fabricating 3D structures and patterns of 3D structures on substrate surfaces, including symmetrical and asymmetrical patterns of 3D structures. Methods of the present invention provide a means of fabricating 3D structures having accurately selected physical dimensions, including lateral and vertical dimensions ranging from 10s of nanometers to 1000s of nanometers. In one aspect, methods are provided using a mask element comprising a conformable, elastomeric phase mask capable of establishing conformal contact with a radiation sensitive material undergoing photoprocessing. In another aspect, the temporal and/or spatial coherence of electromagnetic radiation using for photoprocessing is selected to fabricate complex structures having nanoscale features that do not extend entirely through the thickness of the structure fabricated.

Claims

1. A method for making a 3D structure, said method comprising the steps of:

providing a radiation sensitive material;

generating a relief pattern on said radiation sensitive material;

providing a substantially coherent beam of electromagnetic radiation;

directing said substantially coherent beam of electromagnetic radiation onto said relief pattern;

wherein said relief pattern generates a plurality of beams of electromagnetic radiation, thereby generating a optical interference pattern within said radiation sensitive material;

wherein interactions of said electromagnetic radiation with said radiation sensitive material generates chemically modified regions of said radiation sensitive material; and

removing at least a portion of said chemically modified regions of said radiation sensitive material or removing at least a portion of said radiation sensitive material which is not chemically modified, thereby generating said 3D structure.

2. A method for making a 3D structure, said method comprising the steps of:

providing a substantially coherent beam of electromagnetic radiation;

directing said substantially coherent beam of electromagnetic radiation onto a mask element in direct optical communication with a radiation sensitive material;

wherein said mask element has at least one contact surface comprising a relief pattern in conformal contact with a contact surface of said radiation sensitive material, wherein said relief pattern generates a plurality of beams of electromagnetic radiation, thereby generating an optical interference pattern within said radiation sensitive material;

wherein interactions of said electromagnetic radiation with said radiation sensitive material generates chemically modified regions of said radiation sensitive material,

removing at least a portion of said chemically modified regions of said radiation sensitive material or removing at least a portion of said radiation sensitive material which is not chemically modified, thereby generating said 3D structure;

wherein said relief pattern comprises an array of cylindrical posts.

3. A method for making a 3D structure, said method comprising the steps of:

providing a substantially coherent beam of electromagnetic radiation;

directing said substantially coherent beam of electromagnetic radiation onto a mask element in direct optical communication with a radiation sensitive material;

wherein said mask element has at least one contact surface comprising a relief pattern in conformal contact with a contact surface of said radiation sensitive material, wherein said relief pattern generates a plurality of beams of electromagnetic radiation, thereby generating an optical interference pattern within said radiation sensitive material;

wherein interactions of said electromagnetic radiation with said radiation sensitive material generates chemically modified regions of said radiation sensitive material,

removing at least a portion of said chemically modified regions of said radiation sensitive material or removing at least a portion of said radiation sensitive material which is not chemically modified, thereby generating said 3D structure;

wherein said relief pattern comprises an array of cylindrical posts and said cylindrical posts have diameters and heights that are independently selected from a range that is greater than or equal to 50 nm and less than or equal to 5000 nm.