Method of manufacture for microelectromechanical devices
First Claim
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1. A method of manufacturing an electromechanical device, the method comprising:
- forming a first conductive layer;
forming an isolation layer on the first conductive layer;
forming a second conductive layer on the isolation layer such that the isolation layer is disposed between the first conductive layer and the second conductive layer, wherein the second conductive layer is configured to allow portions of the second conductive layer to deflect towards the first conductive layer and contact the first conductive layer after the isolation layer is removed;
prior to etching the isolation layer, electrically coupling the first conductive layer to the second conductive layer;
after the first conductive layer to the second conductive layer are electrically coupled, etching the isolation layer to form a gap between the first and second conductive layers; and
electrically decoupling the first conductive layer from the second conductive layer after removing the isolation layer.
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Abstract
A method of manufacturing a microelectromechanical device includes forming at least two conductive layers on a substrate. An isolation layer is formed between the two conductive layers. The conductive layers are electrically coupled together and then the isolation layer is removed to form a gap between the conductive layers. The electrical coupling of the layers mitigates or eliminates the effects of electrostatic charge build up on the device during the removal process.
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Citations
17 Claims
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1. A method of manufacturing an electromechanical device, the method comprising:
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forming a first conductive layer; forming an isolation layer on the first conductive layer; forming a second conductive layer on the isolation layer such that the isolation layer is disposed between the first conductive layer and the second conductive layer, wherein the second conductive layer is configured to allow portions of the second conductive layer to deflect towards the first conductive layer and contact the first conductive layer after the isolation layer is removed; prior to etching the isolation layer, electrically coupling the first conductive layer to the second conductive layer; after the first conductive layer to the second conductive layer are electrically coupled, etching the isolation layer to form a gap between the first and second conductive layers; and electrically decoupling the first conductive layer from the second conductive layer after removing the isolation layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16)
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17. A method of manufacturing a electromechanical device comprising a first conductive layer, a second conductive layer, and an isolation layer between the first and second conductive layers, the method comprising:
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prior to etching the isolation layer, electrically coupling the first conductive layer to the second conductive layer; etching the isolation layer to form a gap between the first and second conductive layers; and electrically decoupling the first conductive layer from the second conductive layer after etching the isolation layer.
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Specification