Electronic part and method for manufacturing the same
First Claim
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1. A method for manufacturing an electronic part, comprising:
- cutting a wiring substrate along a line intersecting with an outer circumference of a reinforcing member, the wiring substrate including a base substrate, a wiring pattern provided on a first surface of the base substrate, and the reinforcing member provided on a second surface of the base substrate;
wherein a wire, out of a plurality of wires composing the wiring pattern, arranged closest to an intersecting point of the outer circumference of the reinforcing member and the line has a widest width.
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Abstract
A method for manufacturing an electronic part, including: cutting a wiring substrate, which contains a base substrate, a wiring pattern provided on a first surface of the base substrate, and a reinforcing member provided on a second surface of the base substrate, along a line intersecting with an outer circumference of the reinforcing member; wherein a wire, out of a plurality of wires composing the wiring pattern, arranged closest to an intersecting point of the outer circumference of the reinforcing member and the line has a widest width.
11 Citations
3 Claims
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1. A method for manufacturing an electronic part, comprising:
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cutting a wiring substrate along a line intersecting with an outer circumference of a reinforcing member, the wiring substrate including a base substrate, a wiring pattern provided on a first surface of the base substrate, and the reinforcing member provided on a second surface of the base substrate; wherein a wire, out of a plurality of wires composing the wiring pattern, arranged closest to an intersecting point of the outer circumference of the reinforcing member and the line has a widest width. - View Dependent Claims (2, 3)
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Specification