Surface planarization of thin silicon films during and after processing by the sequential lateral solidification method

• US 7,704,862 B2
• Filed: 02/06/2007
• Issued: 04/27/2010
• Est. Priority Date: 03/21/2000
• Status: Expired due to Fees

• Current Assignee: Trustees Of Columbia University In The City Of New York (Columbia University)
• Original Assignee: Trustees Of Columbia University In The City Of New York (Columbia University)
• Inventors: Sposili, Robert S., Im, James S., Crowder, Mark A.
• Primary Examiner(s): Garber; Charles D
• Assistant Examiner(s): Isaac; Stanetta D
• Application Number:
  US11/671,917
• Publication Number:
  US 20070145017A1
• Time in Patent Office: 1,176 Days
• Field of Search: 438486-489, 438/795, 257/E21.077, 257/E21.082, 257/E21.133, 216/121.6
• US Class Current: 438/487
• CPC Class Codes: B23K 2101/40 Semiconductor devices
• CPC Class Codes: B23K 26/06 Shaping the laser beam, e.g. by masks or multi-focusing
• CPC Class Codes: B23K 26/0622 by shaping pulses
• CPC Class Codes: B23K 26/066 by using masks
• CPC Class Codes: B23K 26/0853 Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
• CPC Class Codes: B23K 26/3576 Diminishing rugosity, e.g. grinding; Polishing; Smoothing
• CPC Class Codes: H01L 21/02532 Silicon, silicon germanium, germanium
• CPC Class Codes: H01L 21/02678 Beam shaping, e.g. using a mask
• CPC Class Codes: H01L 21/02686 Pulsed laser beam
• CPC Class Codes: H01L 21/02691 Scanning of a beam
• CPC Class Codes: H01L 21/302 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
• CPC Class Codes: H01L 21/32115 Planarisation
• CPC Class Codes: H01L 21/67253 Process monitoring, e.g. flow or thickness monitoring
• CPC Class Codes: Y10S 438/942 Masking

Abstract

Systems and methods for reducing a surface roughness of a polycrystalline or single crystal thin film produced by the sequential lateral solidification process are disclosed. In one arrangement, the system includes an excimer laser for generating a plurality of excimer laser pulses of a predetermined fluence, an energy density modulator for controllably modulating the fluence of the excimer laser pulses such that the fluence is below that which is required to completely melt the thin film, a beam homoginizer for homoginizing modulated laser pulses in a predetermined plane, a sample stage for receiving homoginized laser pulses to effect melting of portions of the polycrystalline or single crystal thin film corresponding to the laser pulses, translating means for controllably translating a relative position of the sample stage with respect to the laser pulses, and a computer for coordinating the excimer pulse generation and fluence modulation with the relative positions of the sample stage to thereby process the polycrystalline or single crystal thin film by sequential translation of the sample stage relative to the laser pulses.

Claims

1. A system for reducing a surface roughness of a polycrystalline or single crystal thin film produced by the sequential lateral solidification process, comprising:

(a) an excimer laser for generating a plurality of excimer laser pulses of a predetermined fluence;

(b) an energy density modulator, optically coupled to said excimer laser, for controllably modulating said fluence of said excimer laser pulses emitted by said excimer laser such that said fluence is below that which is required to completely melt said polycrystalline or single crystal thin film;

(c) a beam homoginizer, optically coupled to said energy density modulator, for homogenizing said modulated laser pulses in a predetermined plane;

(d) a sample stage, optically coupled to said mask, for receiving said homogenized laser pulses to effect partial melting of portions of said polycrystalline or single crystal thin film corresponding to said laser pulses;

(f) translating means, coupled to said sample stage, for controllably translating a relative position of said sample stage with respect to said laser pulses; and

(g) a computer, coupled to said excimer laser, said energy density modulator, and said translating means, for controlling said controllable fluence modulation of said excimer laser pulses and said controllable relative positions of said sample stage and said laser pulses, and for coordinating said excimer pulse generation and said fluence modulation with said relative positions of said sample stage and said laser pulses, to thereby process said polycrystalline or single crystal thin film by sequential translation of said sample stage relative to said laser pulses at corresponding sequential locations thereon.

2. The system of claim 1, wherein said excimer laser is a ultraviolet excimer laser for generating ultraviolet excimer laser pulses.

3. The system of claim 1, wherein said beam homoginizer is operable to shape said laser pulses with a tophat profile in both the x and y directions.

4. The system of claim 1, wherein said an energy density modulator is operable to attenuate said fluence of said excimer laser pulses to approximately 25% to 75% of the full melt threshold of said polycrystalline or single crystal thin film.

5. The system of claim 1, wherein said translating means comprises said sample stage, and wherein said sample stage includes a Y direction translation portion coupled to said computer and permitting movement in one direction orthogonal to a direction of said laser pulses and being controllable by said computer for controllably translating said polycrystalline or single crystal thin film in said translatable direction under control of said computer.

6. The system of claim 5, wherein said beam homoginizer is operable to shape said laser pulses with a tophat profile in at least said direction orthogonal to a direction of said laser pulses, and wherein said translating means is operable to translate said polycrystalline or single crystal thin film in said direction orthogonal to a direction of said laser pulses, such that sequential homogenized laser pulses are incident on slightly overlapping regions of said polycrystalline or single crystal thin film.

7. The system of claim 1, wherein said translating means comprises said sample stage, and wherein said sample stage includes an X direction translation portion and a Y direction translation portion, each being coupled to said computer and to each other, said X and Y direction translation portions permitting movement in two orthogonal directions that are perpendicular to a path formed by said laser pulses and being controllable by said computer for controllably translating said sample in both of said translatable directions under control of said computer.

8. The system of claim 7, wherein said beam homoginizer is operable to shape said laser pulses with a tophat profile in both the x and y directions, and wherein said translating means is operable to translate said polycrystalline or single crystal thin film in two directions orthogonal to a direction of said laser pulses, such that sequential homogenized laser pulses are incident on slightly overlapping regions of said polycrystalline or single crystal thin film in said two directions.