Insulated gate type thyristor
First Claim
1. An insulated gate type three terminal thyristor comprising:
- a first current terminal semiconductor region of a first conductivity type having a first impurity concentration;
a first base semiconductor region of a second conductivity type opposite to the first conductivity type having a second impurity concentration and formed on said first current terminal semiconductor region;
a second base semiconductor region of the first conductivity type having a third impurity concentration lower than the first impurity concentration and formed on said first base semiconductor region;
a second current terminal semiconductor region of the second conductivity type having a fourth impurity concentration higher than the second impurity concentration and formed on said second base semiconductor region;
a trench structure passing through said second current terminal semiconductor region and entering said second base semiconductor region without reaching the first base semiconductor region;
a first electrode connected to the first current terminal semiconductor region;
a second electrode connected to the second current terminal semiconductor region; and
a third electrode having an insulated gate electrode structure formed in said trench structure,wherein said trench structure divides an upper portion of said second base semiconductor region into a plurality of regions, and is formed surrounding each divided region,wherein said first base, second base, first current terminal and second current terminal semiconductor regions are made of silicon,wherein the divided upper portions of said second base semiconductor region have stripe-shaped portions as viewed in plan, andwherein said trench structure surrounding said stripe-shaped portion defines a common contact recess at one end along a stripe longitudinal direction, and said insulating gate electrode structure includes a gate electrode portion surrounding said stripe-shaped portion in the upper position of said second base semiconductor region and a contact portion formed in said common contact recess.
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Accused Products
Abstract
An insulated gate type thyristor includes: a first current terminal semiconductor region of a first conductivity type having a high impurity concentration; a first base semiconductor region of a second conductivity type opposite to the first conductivity type having a low impurity concentration and formed on the first current terminal semiconductor region; a second base semiconductor region of the first conductivity type having a low impurity concentration and formed on the first base semiconductor region; a second current terminal semiconductor region of the second conductivity type having a high impurity concentration and formed on the second base semiconductor region; a trench passing through the second current terminal semiconductor region and entering the second base semiconductor region leaving some depth thereof, along a direction from a surface of the second current terminal semiconductor region toward the first base semiconductor region; and an insulated gate electrode structure formed in the trench.
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Citations
11 Claims
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1. An insulated gate type three terminal thyristor comprising:
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a first current terminal semiconductor region of a first conductivity type having a first impurity concentration; a first base semiconductor region of a second conductivity type opposite to the first conductivity type having a second impurity concentration and formed on said first current terminal semiconductor region; a second base semiconductor region of the first conductivity type having a third impurity concentration lower than the first impurity concentration and formed on said first base semiconductor region; a second current terminal semiconductor region of the second conductivity type having a fourth impurity concentration higher than the second impurity concentration and formed on said second base semiconductor region; a trench structure passing through said second current terminal semiconductor region and entering said second base semiconductor region without reaching the first base semiconductor region; a first electrode connected to the first current terminal semiconductor region; a second electrode connected to the second current terminal semiconductor region; and a third electrode having an insulated gate electrode structure formed in said trench structure, wherein said trench structure divides an upper portion of said second base semiconductor region into a plurality of regions, and is formed surrounding each divided region, wherein said first base, second base, first current terminal and second current terminal semiconductor regions are made of silicon, wherein the divided upper portions of said second base semiconductor region have stripe-shaped portions as viewed in plan, and wherein said trench structure surrounding said stripe-shaped portion defines a common contact recess at one end along a stripe longitudinal direction, and said insulating gate electrode structure includes a gate electrode portion surrounding said stripe-shaped portion in the upper position of said second base semiconductor region and a contact portion formed in said common contact recess. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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Specification