Micromechanical component and method for producing a micromechanical component
First Claim
Patent Images
1. A micromechanical component, which is a micromechanical sensor, comprises:
- a first wafer having at least one structural element; and
a second wafer having at least one mating structural element;
wherein the structural element and the mating structural element are configured so that a relative displacement of the first wafer with respect to the second wafer parallel to a main extension plane of the first wafer essentially leads to one of compressive loading and tensile loading between the structural element and the mating structural element, wherein at least one of the first wafer and the second wafer includes a functional region, which is surrounded by a sealing region, wherein the functional region has at least one displaceable element, the displaceable element being provided so as to be displaceable with respect to at least one of the first wafer and the second wafer, and at least one of the first wafer and the second wafer includes a stop, which functions as mechanical delimitation of a maximum deflection of the displaceable structure perpendicular to the first main extension plane.
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Abstract
A micromechanical component, in particular a micromechanical sensor, having a first wafer and a second wafer is provided, the first wafer having at least one structural element, and the second wafer having at least one mating structural element, and, in addition, the structural element and the mating structural element are designed in such a way that a relative displacement of the first wafer relative to the second wafer parallel to a main extension plane of the first wafer essentially leads to compressive loading or tensile loading between the structural element and the mating structural element.
40 Citations
10 Claims
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1. A micromechanical component, which is a micromechanical sensor, comprises:
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a first wafer having at least one structural element; and a second wafer having at least one mating structural element; wherein the structural element and the mating structural element are configured so that a relative displacement of the first wafer with respect to the second wafer parallel to a main extension plane of the first wafer essentially leads to one of compressive loading and tensile loading between the structural element and the mating structural element, wherein at least one of the first wafer and the second wafer includes a functional region, which is surrounded by a sealing region, wherein the functional region has at least one displaceable element, the displaceable element being provided so as to be displaceable with respect to at least one of the first wafer and the second wafer, and at least one of the first wafer and the second wafer includes a stop, which functions as mechanical delimitation of a maximum deflection of the displaceable structure perpendicular to the first main extension plane. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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Specification