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Measuring and identifying analog characteristics of a microelectronic component at a wafer level and a platform level

  • US 7,705,620 B2
  • Filed: 03/29/2006
  • Issued: 04/27/2010
  • Est. Priority Date: 03/29/2006
  • Status: Expired due to Fees
First Claim
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1. A method comprising:

  • disabling access to an operational circuit on a die, which is an integrated circuit chip that contains both the operational circuit and a test circuit, the operational circuit sharing same pads with a test circuit that includes a plurality of duplicated components that are duplicates of circuit components in the die;

    selecting, with one or more multiplexers, from the plurality of duplicated components a selected duplicated component;

    electrically connecting ends of the selected duplicated component to the pads on the die;

    applying electricity to the pads to measure characteristics of the selected duplicated component; and

    calibrating a loss in a signal path defined by the selected duplicated component.

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