Micro-electro-mechanical-system package and method for manufacturing the same

• US 7,706,149 B2
• Filed: 05/23/2008
• Issued: 04/27/2010
• Est. Priority Date: 08/17/2007
• Status: Active Grant

• Current Assignee: Advanced Semiconductor Engineering Inc (ASE Technology Holding Co., Ltd.)
• Original Assignee: Advanced Semiconductor Engineering Inc (ASE Technology Holding Co., Ltd.)
• Inventors: Wang, Wei Chung, Lee, Ming Chiang, Wang, Meng Jen, Cheng, Feng Chen, Huang, Wei Pin, Yang, Hsueh An
• Primary Examiner(s): Lee; Jinhee J
• Assistant Examiner(s): Chen; Xiaoliang
• Application Number:
  US12/126,043
• Publication Number:
  US 20090046436A1
• Time in Patent Office: 704 Days
• Field of Search: 361/792, 361/748, 737/54, 737/80, 257/723, 257/678
• US Class Current: 361/792
• CPC Class Codes: B81B 2201/0257 Microphones or microspeakers
• CPC Class Codes: B81C 1/0023 Packaging together an electronic processing unit die and a micromechanical structure die MEMS packages B81B7/0032; MEMS packaging processes B81C1/00261
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/1461 MEMS
• CPC Class Codes: H01L 2924/3025 Electromagnetic shielding
• CPC Class Codes: Y10T 29/49162 by using wire as conductive path

Abstract

A MEMS package includes a first board, a second board and a laminate material. The first board includes a lower metallic trace, a metallic diaphragm and a through opening. The lower metallic trace is located on the lower surface of the first board, and the metallic diaphragm is disposed on the lower metallic trace. The second board includes an upper metallic trace and a metallic electrode. The upper metallic trace is located on the upper surface of the second board, the metallic electrode is disposed on the upper metallic trace, and the metallic electrode is corresponding to the metallic diaphragm. The laminate material is disposed between the lower and upper metallic traces, and includes a hollow portion for accommodating the metallic electrode and metallic diaphragm, wherein a sensing unit is formed by the metallic electrode, the hollow portion and the metallic diaphragm, and is corresponding to the through opening.

Claims

1. A micro-electro-mechanical-system (MEMS) package comprising:

a first board having an upper surface and a lower surface and comprising a first lower metallic trace, a metallic diaphragm and a first through opening, wherein the lower surface is opposite to the upper surface, the first lower metallic trace is located on the lower surface of the first board, the metallic diaphragm is disposed on the first lower metallic trace, and the first through opening is extended from the upper surface to the lower surface;

a second board having an upper surface and a lower surface and comprising a second upper metallic trace and a metallic electrode, wherein the lower surface is opposite to the upper surface, the second upper metallic trace is located on the upper surface of the second board, the metallic electrode is disposed on the second upper metallic trace, and the metallic electrode is corresponding to the metallic diaphragm;

a laminate material disposed between the first lower metallic trace and the second upper metallic trace, and comprising a hollow portion for accommodating the metallic diaphragm and the metallic electrode, wherein a sensing unit is formed by the metallic diaphragm, the hollow portion and the metallic electrode and is corresponding to the first through opening;

a chip mounted on the upper surface of the first board and electrically connected to the metallic diaphragm and the metallic electrode; and

an encapsulant adapted to seal the chip and have a second through opening, wherein the second through opening is corresponding to the first through opening.

2. The MEMS package as claimed in claim 1, further comprising:

a third board mounted on the encapsulant and comprising a through hole corresponding to the second through opening, wherein the third board has an upper surface and a lower surface, the lower surface is opposite to the upper surface, and the third board comprises a third upper metallic layer located on the upper surface and a third lower metallic layer located on the lower surface respectively.

3. The MEMS package as claimed in claim 2, wherein the third upper metallic layer and the third lower metallic layer are made of copper.

4. The MEMS package as claimed in claim 1, wherein the first board further comprises a first upper metallic trace and a first plating through hole, and the chip is electrically connected to the metallic diaphragm through the first upper metallic trace, the first plating through hole and the first lower metallic trace in sequence.

5. The MEMS package as claimed in claim 4, further comprising:

a second plating through hole, wherein the chip is electrically connected to the metallic electrode through the first upper metallic trace, the second plating through hole and the second upper metallic trace in sequence.

6. The MEMS package as claimed in claim 4, wherein the first upper metallic trace, the first lower metallic trace and the second upper metallic trace are made of copper.

7. The MEMS package as claimed in claim 1, wherein the metallic diaphragm and the metallic electrode are made of nickel (Ni) and gold (Au).

8. The MEMS package as claimed in claim 1, wherein the value of the gap between the metallic diaphragm and the metallic electrode is less than 25 μ

m.

9. The MEMS package as claimed in claim 1, wherein the metallic diaphragm comprises a plurality of through holes.

10. A micro-electro-mechanical-system (MEMS) package comprising:

a first board comprising a metallic diaphragm and a first through opening;

a second board comprising a metallic electrode, wherein the metallic electrode is corresponding to the metallic diaphragm;

a laminate material disposed between the first board and the second board, and comprising a hollow portion for accommodating the metallic diaphragm and the metallic electrode, wherein a sensing unit is formed by the metallic diaphragm, the hollow portion and the metallic electrode and is corresponding to the first through opening;

a chip mounted on the first board and electrically connected to the metallic diaphragm and the metallic electrode;

an encapsulant adapted to seal the chip and has a second through opening, wherein the second through opening is corresponding to the first through opening; and

a third board mounted on the encapsulant and comprising a through hole corresponding to the second through opening, wherein the third board has an upper surface and a lower surface, the lower surface is opposite to the upper surface, and the third board comprises a third upper metallic layer located on the upper surface and a third lower metallic layer located on the lower surface respectively.

11. The MEMS package as claimed in claim 10, wherein the third upper metallic layer and the third lower metallic layer are made of copper.

12. The MEMS package as claimed in claim 10, wherein the metallic diaphragm and the metallic electrode are made of nickel (Ni) and gold (Au).

13. The MEMS package as claimed in claim 10, wherein the value of the gap between the metallic diaphragm and the metallic electrode is less than 25 μ

m.

14. The MEMS package as claimed in claim 10, wherein the metallic diaphragm comprises a plurality of through holes.