Programmable matrix array with phase-change material

• US 7,706,178 B2
• Filed: 02/06/2008
• Issued: 04/27/2010
• Est. Priority Date: 11/08/2004
• Status: Active Grant

• Current Assignee: Ovonyx Memory Technology, LLC
• Original Assignee: Ovonyx Incorporated (Micron Technology, Inc.)
• Inventors: Parkinson, Ward
• Primary Examiner(s): AUDUONG, GENE NGHIA
• Application Number:
  US12/069,092
• Publication Number:
  US 20080211539A1
• Time in Patent Office: 811 Days
• Field of Search: 365/148, 365/158, 365/163, 365/171, 365/113
• US Class Current: 365/163
• CPC Class Codes: G11C 13/0004 comprising amorphous/crystalline phase transition cells
• CPC Class Codes: G11C 2213/77 Array wherein the memory element being directly connected to the bit lines and word lines without any access device being used
• CPC Class Codes: H03K 19/17736 Structural details of routing resources
• CPC Class Codes: H10B 63/80 Arrangements comprising multiple bistable or multi-stable switching components of the same type on a plane parallel to the substrate, e.g. cross-point arrays
• CPC Class Codes: H10N 70/231 based on solid-state phase change, e.g. between amorphous and crystalline phases, Ovshinsky effect
• CPC Class Codes: H10N 70/801 Constructional details of multistable switching devices
• CPC Class Codes: H10N 70/826 adapted for essentially vertical current flow, e.g. sandwich or pillar type devices
• CPC Class Codes: H10N 70/8828 Tellurides, e.g. GeSbTe
• CPC Class Codes: Y10S 438/90 Bulk effect device making

Abstract

A phase-change material is proposed for coupling interconnect lines an electrically programmable matrix array. Leakage may be reduced by optionally placing a thin insulating breakdown layer between the phase change material and at least one of the lines. The matrix array may be used in a programmable logic device. The logic portions of the programmable logic device may be tri-stated.

Claims

1. A method of operating an apparatus, said apparatus comprising a programmable interconnect matrix array, said array comprising a plurality of first conductive lines, a plurality of second conductive lines, and a plurality of programmable connections, each of said programmable connections comprising a phase-change material and having a closed connection state, an intermediate resistance connection state, and an open connection state, each of said programmable connections being electrically coupled between one of said first conductive lines and one of said second conductive lines, said electrical coupling occurring without an active selection device in series with the phase-change material between said lines, said method comprising the step of:

applying energy to a first of said programmable connections, said energy transforming said first programmable connection to a first connection state between a first of said first conductive lines and a first of said second conductive lines, said first connection state being a first closed connection or a first intermediate resistance connection; and

applying energy to a second of said programmable connections, said energy transforming said second programmable connection to a second connection state between a second of said first conductive lines and a second of said second conductive lines, said second connection state being a second closed connection or a second intermediate resistance connection;

said second connection state coexisting with said first connection state in said array.

2. The method of claim 1 further comprising configuring the first conductive lines as outputs from logic.

3. The method of claim 1 further comprising configuring the second conductive lines as inputs to logic.

4. The method of claim 1, further comprising applying energy to a third of said programmable connections, said energy transforming said third programmable connection to a third connection state between a third of said first conductive lines and a third of said second conductive lines, said third connection state being a third closed connection or a third intermediate resistance connection;

said third connection state coexisting with said first connection state and said second connection state in said array.

5. The method of claim 1, wherein said first connection state is said first closed connection.

6. The method of claim 5, wherein said second connection state is said second closed connection.

7. The method of claim 1, wherein said apparatus further comprises first circuitry connected to said first of said first conductive lines, said method further comprising transmitting a first signal from said first circuitry through said first closed connection.

8. The method of claim 7, wherein said first circuitry comprises a controller.

9. The method of claim 7, wherein said first circuitry is analog circuitry.

10. The method of claim 7, wherein said first circuitry does not program or read said first closed connection.

11. The method of claim 7, wherein said second circuitry does not program or read said first closed connection.

12. The method of claim 7, wherein said first circuitry comprises a first logic device.

13. The method of claim 12, wherein said apparatus further comprises second circuitry connected to said first of said second conductive lines, said method further comprising transmitting said first signal to said second circuitry.

14. The method of claim 13, wherein said second circuitry comprises a controller.

15. The method of claim 13, wherein said second circuitry comprises a second logic device.

16. The method of claim 13, wherein said second circuitry is analog circuitry.

17. The method of claim 7, wherein said apparatus further comprises second circuitry connected to said second of said first conductive lines, said method further comprising transmitting a second signal from said second circuitry through said second closed connection.

18. The method of claim 17, wherein said first circuitry comprises a first controller and said second circuitry comprises a second controller.

19. The method of claim 17, wherein said first circuitry comprises a first logic device.

20. The method of claim 19, wherein said second circuitry comprises a second logic device.

21. The method of claim 20, wherein said apparatus further comprises third circuitry connected to said second of said first conductive lines, said method further comprising transmitting said first signal to said third circuitry.

22. The method of claim 21, wherein said third circuitry comprises a third logic device.

23. The method of claim 21, wherein said apparatus further comprises fourth circuitry connected to said second of said second conductive lines, said method further comprising transmitting said second signal to said fourth circuitry.

24. The method of claim 23, wherein said third circuitry comprises a third logic device and said fourth circuitry comprises a fourth logic device.

25. An apparatus, comprising:

a first set of conductive lines;

a second set of conductive lines;

a plurality of programmable elements coupled between said first conductive lines and said second conductive lines, said programmable elements each comprising a phase-change material and lacking an active device in series with said phase-change material, said programmable elements having a closed connection state, an intermediate resistance connection state, and an open connection state, said programmable elements providing a first connection state between a first of said first conductive lines and a first of said second conductive lines and a second connection state between a second of said first conductive lines and a second of said second conductive lines, said first connection state being a first closed connection or a first intermediate resistance connection and said second connection state being a second closed connection or a second intermediate resistance connection.

26. The apparatus of claim 25, wherein said programmable connections further comprise a breakdown layer.

27. The apparatus of claim 25, wherein said first connection state is said first closed connection.

28. The apparatus of claim 27, wherein said second connection state is said second closed connection.

29. The apparatus of claim 25, further comprising first circuitry connected to said first of said first conductive lines and second circuitry connected to said first of said second conductive lines.

30. The apparatus of claim 29, wherein said first circuitry comprises a first controller.

31. The apparatus of claim 30, wherein said first controller comprises a microprocessor, microcontroller, or digital signal processor.

32. The apparatus of claim 30, wherein said second circuitry comprises a logic device or logic array.

33. The apparatus of claim 30, wherein said second circuitry comprises a second controller.

34. The apparatus of claim 29, wherein said first circuitry comprises a first logic device.

35. The apparatus of claim 34, wherein said second circuitry comprises a second logic device.

36. The apparatus of claim 29, wherein said first circuitry is analog circuitry.

37. The apparatus of claim 36, wherein said second circuitry is analog circuitry.

38. The apparatus of claim 29, further comprising third circuitry connected to said second of said first conductive lines and fourth circuitry connected to said second of said second conductive lines.

39. The apparatus of claim 38, wherein said first circuitry comprises a first controller and said third circuitry comprises a second controller.

40. The apparatus of claim 38, wherein said first circuitry comprises a first logic device and said third circuitry comprises a second logic device.

41. The apparatus of claim 40, wherein said third circuitry comprises a third logic device and said fourth circuitry comprises a fourth logic device.