Temperature sensing device patterned on an electro-optic transducer die

• US 7,706,421 B2
• Filed: 04/20/2005
• Issued: 04/27/2010
• Est. Priority Date: 04/20/2005
• Status: Active Grant

• Current Assignee: II-VI Delaware, Inc. (Coherent Corp.)
• Original Assignee: Finisar Corporation (II-VI Incorporated)
• Inventors: Hosking, Lucy G.
• Primary Examiner(s): Harvey; Minsun
• Assistant Examiner(s): Nguyen; Tuan N.
• Application Number:
  US11/110,580
• Publication Number:
  US 20060239315A1
• Time in Patent Office: 1,833 Days
• Field of Search: 372/34, 372/36, 250/349, 438/16, 438/7
• US Class Current: 372/36
• CPC Class Codes: H01S 5/02415 by using a thermo-electric cooler [TEC], e.g. Peltier element
• CPC Class Codes: H01S 5/0261 Non-optical elements, e.g. laser driver components, heaters H01S5/0265 takes precedence

Abstract

An optical transmit assembly having a temperature sensor patterned on an electro-optic transducer die. Due to the close proximity of the electro-optic transducer junction and the temperature sensor, the temperature sensor more accurately measures the temperature of the electro-optic transducer junction. This permits for more refined control of the frequency characteristics of optical light emitted by the electro-optic transducer junction since the emitted optical frequencies of most electro-optic transducers are heavily temperature dependent.

Claims

1. An optical transmit assembly comprising:

an electro-optic transducer die that emits light when current is passed through the electro-optic transducer die, the electro-optic transducer die including;

an optically emissive PN junction

a top surface;

at least one electrical contact patterned on the top surface for applying a control current through the PN junction to control optical emissions from the PN junction;

a bottom surface;

a temperature sensor patterned directly on a surface of the electro-optic transducer die such that the temperature sensor is closely positioned to the PN junction;

one or more electrical connections patterned on a surface of the electro-optical transducer die for establishing an electrical connection to determine a temperatures sensed by the temperature sensor; and

a substrate, wherein the electro-optic transducer is mounted on the substrate, wherein the surface of the electro-optic transducer to which the temperature sensor is patterned is most distant from the substrate.

2. An optical transmit assembly in accordance with claim 1, wherein the electro-optic transducer is a laser.

3. An optical transmit assembly in accordance with claim 2, wherein the laser is a Vertical Cavity Surface Emitting Laser (VCSEL).

4. An optical transmit assembly in accordance with claim 2, wherein the laser is an edge emitting laser.

5. An optical transmit assembly in accordance with claim 1, wherein the electro-optic transducer is a Light Emitting Diode (LED).

6. An optical transmit assembly in accordance with claim 1, wherein the temperature sensor is a thin film thermocouple.

7. An optical transmit assembly in accordance with claim 1, wherein the temperature sensor is a Resistance Temperature Detector (RTD).

8. An optical transmit assembly in accordance with claim 1, wherein the temperature sensor is a thermistor.

9. An optical transmit assembly comprising:

an electro-optic transducer die that emits light when current is passed through the electro-optic transducer die, the electro-optic transducer die including;

an optically emissive PN junction

a top surface;

at least one electrical contact patterned on the top surface for applying a control current through the PN junction to control optical emissions from the PN junction;

a bottom surface;

a temperature sensor patterned directly on a surface of the electro-optic transducer die such that the temperature sensor is closely positioned to the PN junction;

one or more electrical connections patterned on a surface of the electro-optical transducer die for establishing an electrical connection to determine a temperatures sensed by the temperature sensor; and

a substrate, wherein the electro-optic transducer is mounted on the substrate, wherein the surface of the electro-optic transducer to which the temperature sensor is patterned is most proximate to the substrate.

10. A method for manufacturing an optical transmit assembly comprising:

an act of positioning an electro-optic transducer die that emits light when current is passed through the electro-optic transducer die, the electro-optic transducer die including;

an optically emissive PN junction;

a top surface;

at least one electrical contact patterned on the top surface for applying a control current through the PN junction to control optical emissions from the PN junction;

a bottom surface;

an act of patterning a temperature sensor directly on a surface of the electro-optic transducer die such that the temperature sensor is closely positioned to the PN junction; and

one or more electrical connections patterned on a surface of the electro-optic transducer die for establishing an electrical connection to determine a temperature sensed by the temperature sensor; and

an act of mounting the electro-optic transducer on a substrate such that the surface to which the temperature sensor is patterned is most proximate to the substrate.

11. A method for manufacturing an optical transmit assembly in accordance with claim 10, wherein the electro-optic transducer is at least one of a laser and a Light Emitting Diode (LED).

12. A method for manufacturing an optical transmit assembly in accordance with claim 10, wherein the temperature sensor is a thin film thermocouple.

13. A method for manufacturing an optical transmit assembly in accordance with claim 10, wherein the temperature sensor is a Resistance Temperature Detector (RTD).

14. A method for manufacturing an optical transmit assembly in accordance with claim 10, wherein the temperature sensor is a thermistor.

15. A method for manufacturing an optical transmit assembly comprising:

an act of positioning an electro-optic transducer die that emits light when current is passed through the electro-optic transducer die, the electro-optic transducer die including;

an optically emissive PN junction;

a top surface;

at least one electrical contact patterned on the top surface for applying a control current through the PN junction to control optical emissions from the PN junction;

a bottom surface;

an act of patterning a temperature sensor directly on a surface of the electro-optic transducer die such that the temperature sensor is closely positioned to the PN junction; and

one or more electrical connections patterned on a surface of the electro-optic transducer die for establishing an electrical connection to determine a temperature sensed by the temperature sensor;

an act of mounting the electro-optic transducer on a substrate such that the surface to which the temperature sensor is patterned is most proximate the substrate;

an act of mounting the electro-optic transducer on the substrate such that the surface of the electro-optic transducer to which the temperature sensor is patterned on is most distant from the substrate.

16. An optical transmit assembly comprising:

laser die that emits light when current is passed through the laser die, wherein the laser die is a vertical cavity surface emitting laser die or an edge emitting laser die, the laser die including;

an optically emissive PN junction;

a top surface;

at least one electrical contact patterned on a surface of the vertical cavity surface emitting laser or edge emitting laser for applying a control current through the PN junction to control optical emissions form the PN junction;

a bottom surface; and

a temperature sensor selected from the set consisting of a thermister, a thin film thermocouple, and a resistance temperature detector patterned directly on a surface of the laser die

a substrate, wherein the temperature transducer is mounted on the substrate, wherein the surface of the electro-optic transducer to which the temperature sensor is patterned is most distant from, or most proximate to, the substrate.