Pick and place machine with workpiece motion inspection

• US 7,706,595 B2
• Filed: 11/01/2004
• Issued: 04/27/2010
• Est. Priority Date: 11/07/2003
• Status: Expired due to Fees

• Current Assignee: CyberOptics Corporation (Nordson Corporation)
• Original Assignee: CyberOptics Corporation (Nordson Corporation)
• Inventors: Case, Steven K., Bushman, Thomas W., Madsen, David D., Madsen, M. Hope, Haugen, Paul R., Gaida, John D.
• Primary Examiner(s): Ahmed; Samir A.
• Assistant Examiner(s): Fitzpatrick; Atiba O
• Application Number:
  US10/978,687
• Publication Number:
  US 20050123187A1
• Time in Patent Office: 2,003 Days
• Field of Search: 382/100, 382/141, 382144-152, 382/153, 348 86- 90, 348125-130, 29833-840, 438 16- 20, 702 34- 40
• US Class Current: 382/141
• CPC Class Codes: H05K 13/0812 the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement

Abstract

Embodiments include measuring motion characteristics of the workpiece through the placement process. Since the component is placed on the workpiece with some force to ensure proper adhesion to the workpiece, some deflection of the workpiece is expected during the placement cycle. The placement force is adjusted to ensure that the component is safely placed into the solder paste or adhesive. Placement force is adjusted through a number of characteristics including: choice of spring tension in the nozzle; the length of the nozzle and the amount of over-travel into the board; the rigidity of the board and design; and the placement of the board support mechanisms. With proper adjustment of these characteristics and parameters, high quality placements onto the workpiece can be ensured.

Claims

1. A pick and place machine for placing a component upon a workpiece, the machine comprising:

a placement head having at least one nozzle for releasably holding the component, the placement head being configured to deliver the component to a placement location on the workpiece during a placement cycle;

a robotic system for generating relative movement between the placement head and the workpiece;

an image acquisition device disposed to obtain a plurality of images including the placement location of the component;

an image processing device for analyzing the images generated by the image acquisition device, the image processing device being configured to segment each image to have an image portion that contains neither the placement location nor the component; and

wherein the image processing device is configured to compare the segmented image portion in each of the plurality of images to measure vertical oscillation of the workpiece during the placement cycle.

2. The pick and place machine of claim 1, wherein the image processing device measures vertical oscillation by applying image correlation to the plurality of images.

3. The pick and place machine of claim 2, wherein a position of a correlation peak is indicative of the workpiece oscillation.

4. The pick and place machine of claim 1, wherein the pick and place machine is a Cartesian pick and place machine.

5. The pick and place machine of claim 1, wherein the pick and place machine is a turret pick and place machine.

6. The pick and place machine of claim 1, wherein at least one of the plurality of images is a blurred image acquired using an exposure time that is longer than a period of a natural frequency of the workpiece.

7. The pick and place machine of claim 6, wherein the measured vertical oscillation is a function of a blur length in the blurred image.