Systems, masks, and methods for photolithography
First Claim
1. A computer-implemented method for determining a mask pattern to be used on a photo-mask in a photolithographic process, wherein the photo-mask has a plurality of distinct types of regions having distinct optical properties, comprising:
- partitioning a target pattern into subsets of the target pattern;
distributing the subsets of the target pattern to a plurality of processors; and
determining a set of second mask patterns each of which corresponding to one of the subsets of the target pattern, wherein at least one of the second set of mask patterns is determined by performing operations including;
providing a first mask pattern that includes a plurality of distinct types of regions corresponding to the distinct types of regions of the photo-mask;
calculating, by a computer, a gradient of a function, wherein the function depends on the first mask pattern and an estimate of a wafer pattern that results from the photolithographic process utilizing at least a portion of the first mask pattern, and wherein the gradient is calculated in accordance with a formula obtained by taking a derivative of the function; and
determining a second mask pattern based, at least in part, on the gradient.
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Accused Products
Abstract
A method for determining a mask pattern to be used on a photo-mask in a photolithographic process is described. During the method, a target pattern is partitioning into subsets, which are distributed to processors. Then, a set of second mask patterns, each of which corresponds to one of the subsets, is determined. Moreover, at least one of the second set of mask patterns may be determined by: providing a first mask pattern that includes distinct types of regions corresponding to distinct types of regions of the photo-mask, calculating a gradient of a function, and determining a second mask pattern based, at least in part, on the gradient. Note that the function may depend on the first mask pattern and an estimate of a wafer pattern that results from the photolithographic process, and that the gradient may be calculated in accordance with a formula obtained by taking a derivative of the function.
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Citations
24 Claims
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1. A computer-implemented method for determining a mask pattern to be used on a photo-mask in a photolithographic process, wherein the photo-mask has a plurality of distinct types of regions having distinct optical properties, comprising:
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partitioning a target pattern into subsets of the target pattern; distributing the subsets of the target pattern to a plurality of processors; and determining a set of second mask patterns each of which corresponding to one of the subsets of the target pattern, wherein at least one of the second set of mask patterns is determined by performing operations including; providing a first mask pattern that includes a plurality of distinct types of regions corresponding to the distinct types of regions of the photo-mask; calculating, by a computer, a gradient of a function, wherein the function depends on the first mask pattern and an estimate of a wafer pattern that results from the photolithographic process utilizing at least a portion of the first mask pattern, and wherein the gradient is calculated in accordance with a formula obtained by taking a derivative of the function; and determining a second mask pattern based, at least in part, on the gradient. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A computer-program product for use in conjunction with a computer system, the computer-program product comprising a computer-readable storage medium and a computer-program mechanism embedded therein for determining a mask pattern to be used on a photo-mask in a photolithographic process, wherein the photo-mask has a plurality of distinct types of regions having distinct optical properties, the computer-program mechanism including:
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instructions for partitioning a target pattern into subsets of the target pattern; instructions for distributing the subsets of the target pattern to a plurality of processors; and instructions for determining a set of second mask patterns each of which corresponding to one of the subsets of the target pattern, wherein at least one of the second set of mask patterns is determined by performing operations including; instructions for providing a first mask pattern that includes a plurality of distinct types of regions corresponding to the distinct types of regions of the photo-mask; instructions for calculating a gradient of a function, wherein the function depends on the first mask pattern and an estimate of a wafer pattern that results from the photolithographic process utilizing at least a portion of the first mask pattern, and wherein the gradient is calculated in accordance with a formula obtained by taking a derivative of the function; and instructions for determining a second mask pattern based, at least in part, on the gradient.
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11. A computer system, comprising:
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at least one processor; at least one memory; and at least one program module, the program module stored in the memory and configured to be executed by the processor, wherein at least the program module is for determining a mask pattern to be used on a photo-mask in a photolithographic process, and wherein the photo-mask has a plurality of distinct types of regions having distinct optical properties, at least the program module mechanism including; instructions for partitioning a target pattern into subsets of the target pattern; instructions for distributing the subsets of the target pattern to a plurality of processors; and instructions for determining a set of second mask patterns each of which corresponding to one of the subsets of the target pattern, wherein at least one of the second set of mask patterns is determined by performing operations including; instructions for providing a first mask pattern that includes a plurality of distinct types of regions corresponding to the distinct types of regions of the photo-mask; instructions for calculating a gradient of a function, wherein the function depends on the first mask pattern and an estimate of a wafer pattern that results from the photolithographic process utilizing at least a portion of the first mask pattern, and wherein the gradient is calculated in accordance with a formula obtained by taking a derivative of the function; and instructions for determining a second mask pattern based, at least in part, on the gradient.
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12. A computer system, comprising:
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means for computing; means for storing; and at least one program module mechanism, the program module mechanism stored in at least the means for storing and configured to be executed by at least the means for computing, wherein at least the program module is for determining a mask pattern to be used on a photo-mask in a photolithographic process, and wherein the photo-mask has a plurality of distinct types of regions having distinct optical properties, at least the program module mechanism including; instructions for partitioning a target pattern into subsets of the target pattern; instructions for distributing the subsets of the target pattern to a plurality of processors; and instructions for determining a set of second mask patterns each of which corresponding to one of the subsets of the target pattern, wherein at least one of the second set of mask patterns is determined by performing operations including; instructions for providing a first mask pattern that includes a plurality of distinct types of regions corresponding to the distinct types of regions of the photo-mask; instructions for calculating a gradient of a function, wherein the function depends on the first mask pattern and an estimate of a wafer pattern that results from the photolithographic process utilizing at least a portion of the first mask pattern, and wherein the gradient is calculated in accordance with a formula obtained by taking a derivative of the function; and instructions for determining a second mask pattern based, at least in part, on the gradient.
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13. A computer-implemented method for determining a pattern to be used in a maskless lithography process, comprising:
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calculating, by a computer, a gradient of a function, wherein the function depends, at least in part, upon a model of the maskless lithographic process, and wherein the gradient is calculated in accordance with a formula obtained by taking a derivative of the function; and generating a pattern based, at least in part, on the gradient of the function. - View Dependent Claims (14, 15, 16, 17)
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18. A computer-implemented method for determining a mask pattern to be used on a photo-mask in a photolithographic process, wherein the photo-mask has a plurality of distinct types of regions having distinct optical properties, comprising:
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converting a first format of a target pattern into a second format, wherein the second format includes a pixel-based based representation; providing a first mask pattern that includes a plurality of distinct types of regions corresponding to the distinct types of regions of the photo-mask, wherein the first mask pattern corresponds to at least a portion of the target pattern; calculating, by a computer, a gradient of a function, wherein the function depends on the first mask pattern and an estimate of a wafer pattern that results from the photolithographic process utilizing at least a portion of the first mask pattern, and wherein the gradient is calculated in accordance with a formula obtained by taking a derivative of the function; and determining a second mask pattern based, at least in part, on the gradient. - View Dependent Claims (19, 20)
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21. A computer system, comprising:
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at least one processor; at least one memory; and at least one program module, the program module stored in the memory and configured to be executed by the processor, wherein at least the program module is for determining a mask pattern to be used on a photo-mask in a photolithographic process, and wherein the photo-mask has a plurality of distinct types of regions having distinct optical properties, at least the program module mechanism including; instructions for converting a first format of a target pattern into a second format, wherein the second format includes a pixel-based representation; instructions for providing a first mask pattern that includes a plurality of distinct types of regions corresponding to the distinct types of regions of the photo-mask, wherein the first mask pattern corresponds to at least a portion of the target pattern; instructions for calculating a gradient of a function, wherein the function depends on the first mask pattern and an estimate of a wafer pattern that results from the photolithographic process utilizing at least a portion of the first mask pattern, and wherein the gradient is calculated in accordance with a formula obtained by taking a derivative of the function; and instructions for determining a second mask pattern based, at least in part, on the gradient.
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22. A computer system, comprising:
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at least one processor; at least one memory; and at least one program module, the program module stored in the memory and configured to be executed by the processor, wherein at least the program module is for determining a mask pattern to be used on a photo-mask in a photolithographic process, and wherein the photo-mask has a plurality of distinct types of regions having distinct optical properties, at least the program module mechanism including; instructions for providing a first mask pattern that includes a plurality of distinct types of regions corresponding to the distinct types of regions of the photo-mask; instructions for determining a first function corresponding to the first mask pattern, wherein a range of the first function has a cardinality that is greater than a number of distinct types of regions of the first mask pattern, a domain of the first function corresponds to a plane of the first mask pattern, and wherein values of the first function indicate locations of boundaries between the distinct types of regions in the first mask pattern with a finer resolution than corresponding location in the plane of the first mask pattern; and instructions for generating a second function based, at least in part, on the first function, wherein the second function corresponds to a second mask pattern.
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23. A computer-implemented method for determining a mask pattern to be used on a photo-mask in a photolithographic process, wherein the photo-mask has a plurality of distinct types of regions having distinct optical properties, comprising:
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providing a first mask pattern that includes a plurality of distinct types of regions corresponding to the distinct types of regions of the photo-mask; determining, by a computer, a first function corresponding to the first mask pattern, wherein a range of the first function has a cardinality that is greater than a number of distinct types of regions of the first mask pattern, a domain of the first function corresponds to a plane of the first mask pattern, and wherein values of the first function indicate locations of boundaries between the distinct types of regions in the first mask pattern with a finer resolution than corresponding location in the plane of the first mask pattern; and generating a second function based, at least in part, on the first function, wherein the second function corresponds to a second mask pattern. - View Dependent Claims (24)
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Specification