Die attach area cut-on-fly method and apparatus

• US 7,709,294 B2
• Filed: 06/24/2005
• Issued: 05/04/2010
• Est. Priority Date: 06/24/2004
• Status: Expired due to Fees

• Current Assignee: CHECKPOINT SYSTEMS, INC. (CCL Industries Incorporated)
• Original Assignee: CHECKPOINT SYSTEMS, INC. (CCL Industries Incorporated)
• Inventors: Clare, Thomas J., Eckstein, Eric, Cote, Andre
• Primary Examiner(s): Ward, Jessica L.
• Assistant Examiner(s): GAMINO, CARLOS J
• Application Number:
  US11/166,534
• Publication Number:
  US 20050284917A1
• Time in Patent Office: 1,775 Days
• Field of Search: 298/32, 298/35, 298/40, 298/47, 298/54, 29/253.5, 295/921, 295/94, 298/25, 298/46, 340571-5727, 156/25.35, 156/592.1, 156/594, 156/825, 156/846, 156/252, 156/253, 156/268, 228 8- 10, 228/13, 228/43, 228/49.1, 228/49.5, 228/120, 228/160, 228/170, 228/171, 228/172, 228/173.6, 228/173.7, 228102-105, 438/111, 438/113
• US Class Current: 438/111
• CPC Class Codes: B23K 20/004 Wire welding
• CPC Class Codes: B23K 2101/32 Wires
• CPC Class Codes: B23K 2101/40 Semiconductor devices
• CPC Class Codes: G06K 19/07718 the record carrier being manufactured in a continuous process, e.g. using endless rolls
• CPC Class Codes: G06K 19/07745 Mounting details of integrated circuit chips
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06K 19/0775 arrangements for connecting the integrated circuit to the antenna
• CPC Class Codes: H01L 21/67132 Apparatus for placing on an insulating substrate, e.g. tape
• CPC Class Codes: H01L 2223/6677 for antenna, e.g. antenna included within housing of semiconductor device antennas per se H01Q
• CPC Class Codes: H01L 2224/05573 Single external layer
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2224/29075 Plural core members
• CPC Class Codes: H01L 2224/2929 with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/293 with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
• CPC Class Codes: H01L 2224/75 Apparatus for connecting with bump connectors or layer connectors
• CPC Class Codes: H01L 2224/78 Apparatus for connecting with wire connectors
• CPC Class Codes: H01L 2224/81121 Active alignment, i.e. by apparatus steering, e.g. optical alignment using marks or sensors
• CPC Class Codes: H01L 2224/81801 Soldering or alloying
• CPC Class Codes: H01L 2224/83851 being an anisotropic conductive adhesive
• CPC Class Codes: H01L 2224/85 using a wire connector
• CPC Class Codes: H01L 23/49855 : for flat-cards, e.g. credit cards cards per se G06K19/00
• CPC Class Codes: H01L 24/75 : Apparatus for connecting with bump connectors or layer connectors
• CPC Class Codes: H01L 24/81 : using a bump connector
• CPC Class Codes: H01L 24/83 : using a layer connector
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00011 : Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01046 : Palladium [Pd]
• CPC Class Codes: H01L 2924/0105 : Tin [Sn]
• CPC Class Codes: H01L 2924/01054 : Xenon [Xe]
• CPC Class Codes: H01L 2924/01057 : Lanthanum [La]
• CPC Class Codes: H01L 2924/01061 : Promethium [Pm]
• CPC Class Codes: H01L 2924/01077 : Iridium [Ir]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/10253 : Silicon [Si]
• CPC Class Codes: H01L 2924/12042 : LASER
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/19043 : being a resistor
• CPC Class Codes: Y10T 156/12 : Surface bonding means and/or assembly means with cutting, punching, piercing, severing or tearing

Abstract

A method and apparatus for bonding integrated circuits uniquely suited to high volume tag production is described, where conductive material of a substrate at the die-attach-area is cut before an IC chip or transponder is placed on the conductive material over the cut and bonded. The apparatus performs the method of placing a first chip on a substrate having a conductive layer, measuring the location of the first chip on the substrate, cutting the conductive layer at a location of an expected subsequently placed chip to form a cut based on the measured location of the first chip, and placing the subsequently placed chip on the substrate over the cut.

Claims

1. A method for cutting a die attach area of a substrate, comprising:

determining a location of a first deposited chip on a moving substrate, while the substrate is moving, the chip being a die;

cutting the substrate, while the substrate is moving, at a location of an expected subsequently placed chip to form a conductive gap based on the location of the first deposited chip; and

depositing the subsequently placed chip on the substrate over the gap while the substrate is moving.

2. The method of claim 1, further comprising welding the subsequently placed chip to the substrate.

9. The method of claim 1, wherein the step of determining the location of the first deposited chip, which is an inoperable chip, on the substrate and the step of cutting the substrate at the location of the expected subsequently placed chip to form the conductive gap is based on the location of the first deposited chip.

3. A method for cutting a die attach area of a substrate, comprising:

determining a location of a transponder deposited at the die attach area on a continuously forward moving substrate at a first time;

cutting the continuously forward moving substrate at the deposited transponder at a second time to form a conductive gap in the substrate in accordance with the determination; and

wherein the transponder has conductive members in communication with the continuously forward moving substrate and the step of cutting the continuously forward moving substrate includes cutting the continuously moving substrate between the conductive members of the deposited transponder at the second time to form the conductive gap in the substrate in accordance with the determination.

4. The method of claim 3, further comprising bonding the transponder to the substrate.

5. The method of claim 3, wherein the step of determining includes registering a location of a flux at the die attach area.

6. A method for cutting a die attach area of a substrate, comprising:

depositing a transponder at the die attach area of a moving substrate while the substrate is moving; and

while depositing the transponder at the die attach area, cutting the moving substrate at the die attach area to form a gap adjacent and corresponding to the transponder.

7. The method of claim 6, further comprising determining an alignment of the deposited transponder on the moving substrate.

8. The method of claim 6, wherein the step of cutting the moving substrate at the die attach area to form a gap adjacent and corresponding to the transponder while depositing the transponder at the die attach area includes cutting the moving substrate at the die attach area to form a gap extending between contact points of the transponder, the contact points for conductive coupling to the moving substrate.