Light emitting diode package

• US 7,709,857 B2
• Filed: 04/24/2008
• Issued: 05/04/2010
• Est. Priority Date: 04/24/2007
• Status: Active Grant

• Current Assignee: Samsung Electronics Co. Ltd.
• Original Assignee: Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Inventors: Kim, Kyung Tae, Min, Bong Girl
• Primary Examiner(s): Purvis; Sue
• Assistant Examiner(s): Moore; Whitney
• Application Number:
  US12/149,008
• Publication Number:
  US 20080277685A1
• Time in Patent Office: 740 Days
• Field of Search: 257/99, 257/100, 257/690, 257/788, 257/E33.057, 257/692, 257/693, 257/696, 257/776, 257/737, 257/758, 257/778, 257/95, 257/738, 257/784, 257/787, 257/E23.048, 257/E23.059, 257/E23.14, 257/E23.079, 257/E25.032, 257/E21.502, 257/E21.504, 257/E21.505, 438/106, 438121-126, 438/25, 438/26, 438/118, 438/119, 438/107, 438/113
• US Class Current: 257/100
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

Provided is a light emitting diode package in accordance with the present invention including a lead frame composed of at least a pair of lead terminals; a mold receiving a part of the lead frame therein and equipped with an irradiation window opened to radiate light, and further including one or more holes formed to expose a part of a bottom surface of the lead frame received in the inside of the mold; an LED chip mounted on the lead frame positioned in the mold; an electrode connection unit for electrically connecting the LED chip and the lead frame; and a molding agent composed of any one selected from transparent epoxy, silicon, and phosphor blends charged in the mold and protecting the LED chip.

Claims

1. A light emitting diode package comprising:

a lead frame composed of at least a pair of lead terminals;

a mold receiving a part of the lead frame therein and equipped with an irradiation window opened to radiate light, and further including one or more holes formed to expose a part of a bottom surface of the lead frame received in the inside of the mold;

an LED chip mounted on the lead frame positioned in the mold;

an electrode connection unit for electrically connecting the LED chip and the lead frame; and

a molding agent composed of any one selected from transparent epoxy, silicon, and phosphor blends charged in the mold and protecting the LED chip,

wherein the holes is charged with air.

3. The light emitting diode package as recited in claim 1 or 2, wherein the electrode connection unit is composed of a wire or a conductive adhesive.

4. The light emitting diode package as recited in claim 3, wherein the conductive adhesive is made of silver (Ag) including high heat conductivity.

2. A light emitting diode package comprising:

a lead frame composed of at least a pair of lead terminals;

a mold receiving a part of the lead frame therein and equipped with an irradiation window opened to radiate light, and further including one or more holes formed to expose a part of a bottom surface of the lead frame received in the inside of the mold;

an LED chip mounted on the lead frame positioned in the mold;

an electrode connection unit for electrically connecting the LED chip and the lead frame; and

a molding agent composed of any one selected from transparent epoxy, silicon, and phosphor blends charged in the mold and protecting the LED chip,

wherein the holes are charged with any one selected from a group composed of copper, silver, aluminum, or an alloy including one or more of the copper, silver, and aluminum.

5. A light emitting diode package comprising:

a lead frame composed of at least a pair of lead terminals;

a mold receiving a part of the lead frame therein and equipped with an irradiation window opened to radiate light, and further including one or more holes formed to expose a part of a bottom surface of the lead frame received in the inside of the mold;

an LED chip mounted on the lead frame positioned in the mold;

an electrode connection unit for electrically connecting the LED chip and the lead frame; and

a molding agent composed of any one selected from transparent epoxy, silicon, and phosphor blends charged in the mold and protecting the LED chip,

wherein the lead frame received in the mold is bent in the inside of the mold so that the bottom surface of the lead frame received in the end of the mold is exposed to the outside of the bottom surface of the mold.

6. The light emitting diode package as recited in claim 5, wherein a printed circuit board is mounted on the bottom surface of the lead frame exposed to the outside in the end of the mold.

7. The light emitting diode package as recited in claim 5, wherein the hole is charged with air.

8. The light emitting diode package as recited in claim 5, wherein the hole is charged with any one selected from any one selected from a group composed of copper, silver, aluminum, or an alloy including one or more of the copper, silver, and aluminum.

9. The light emitting diode package as recited in claim 5, wherein the electrode connection unit is composed of a wire or a conductive adhesive.

10. The light emitting diode package as recited in claim 9, wherein the conductive adhesive is made of silver (Ag) having high heat conductivity.