Integrated circuit package system with package integration

• US 7,709,944 B2
• Filed: 12/18/2007
• Issued: 05/04/2010
• Est. Priority Date: 12/18/2007
• Status: Active Grant

• Current Assignee: Stats Chippac Pte. Ltd. (JCET Group Co., Ltd.)
• Original Assignee: Stats Chippac BVI limited (JCET Group Co., Ltd.)
• Inventors: Chua, Linda Pei Ee, Kuan, Heap Hoe, Chow, Seng Guan, Merilo, Dioscoro A.
• Primary Examiner(s): Toledo; Fernando L
• Assistant Examiner(s): DIALLO, MAMADOU L
• Application Number:
  US11/958,838
• Publication Number:
  US 20090152701A1
• Time in Patent Office: 868 Days
• Field of Search: 257678-733, 257/685, 257/686, 257/723, 257/726, 257E23031-E23032, 257/E23.042, 257787-796, 257E23001-E23194
• US Class Current: 257/686
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/50 Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/83855 Hardening the adhesive by curing, i.e. thermosetting
• CPC Class Codes: H01L 2225/1058 Bump or bump-like electrical connections, e.g. balls, pillars, posts
• CPC Class Codes: H01L 2225/1088 Arrangements to limit the height of the assembly
• CPC Class Codes: H01L 23/3128 the substrate having spherical bumps for external connection
• CPC Class Codes: H01L 24/73 Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 24/83 using a layer connector
• CPC Class Codes: H01L 24/86 using tape automated bonding [TAB]
• CPC Class Codes: H01L 25/03 all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
• CPC Class Codes: H01L 25/105 the devices being of a type provided for in group H01L27/00
• CPC Class Codes: H01L 25/16 the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/07802 : not being an ohmic electrical conductor
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/15151 : the die mounting substrate comprising an aperture, e.g. for underfilling, outgassing, window type wire connections
• CPC Class Codes: H01L 2924/15311 : being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/15331 : being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/19105 : in a side-by-side arrangement on a common die mounting substrate
• CPC Class Codes: H01L 2924/19107 : off-chip wires

Abstract

An integrated circuit package system comprising: providing a package substrate; attaching a base package having a portion of the base package substantially exposed over the package substrate; forming a cavity through the package substrate to the base package; and attaching a device partially in the cavity and connected to the portion of the base package substantially exposed.

Claims

1. An integrated circuit package system comprising:

providing a package substrate having a package opening;

providing a base package having a base package cavity;

electrically connecting the base package to the package substrate with the base package cavity over the package opening; and

attaching a device partially in the package opening and partially in the base package cavity and connected to the portion of the base package substantially exposed.

2. The system as claimed in claim 1 wherein providing a base package having a base package cavity includes attaching the base package over the package substrate wherein a base package cavity of the base package is over the package opening of the package substrate.

3. The system as claimed in claim 1 wherein providing a base package having a base package cavity includes providing the base package having the base package cavity over a second package substrate of the base package.

4. The system as claimed in claim 1 further comprising attaching a top package over the base package.

5. The system as claimed in claim 1 further comprising forming an upper cavity in a package encapsulant over a first package substrate of the base package.

6. An integrated circuit package system comprising:

forming a package substrate having a package substrate opening;

mounting a base package having a base package cavity and a second package substrate wherein a portion of the second package substrate is substantially exposed over the package substrate;

electrically connecting the base package to the package substrate wherein the base package cavity is substantially aligned to the package substrate opening; and

mounting a device partially within the package opening and connected to the substantially exposed portion of the second package substrate.

7. The system as claimed in claim 6 wherein attaching the device includes attaching a stack package.

8. The system as claimed in claim 6 wherein attaching the device includes attaching a passive component.

9. The system as claimed in claim 6 further comprising attaching a bottom package over the cavity.

10. The system as claimed in claim 6 further comprising attaching an interposer over the cavity.

11. The system as claimed in claim 6 further comprising attaching a top package over the base package with embedded solder-on-pad.

12. An integrated circuit package system comprising:

a package substrate having a package opening;

a base package having a base package cavity;

the base package electrically connected to the package substrate with the base package cavity over the package opening; and

a device partially in the package opening and partially in the base package cavity and connected to the portion of the base package substantially exposed.

13. The system as claimed in claim 12 wherein the base package cavity includes the base package over the package substrate wherein a base package cavity of the base package is over a package opening of the package substrate.

14. The system as claimed in claim 12 wherein the base package cavity is over a second package substrate of the base package.

15. The system as claimed in claim 12 further comprising a top package over the base package.

16. The system as claimed in claim 12 further comprising an upper cavity in a package encapsulant over a first package substrate of the base package.

17. The system as claimed in claim 12 wherein:

the package substrate is the package substrate having a package substrate opening;

the base package is the base package having a base package cavity and a second package substrate wherein a portion of the second package substrate is substantially exposed over the package substrate;

the cavity is the cavity through the package substrate to the base package wherein the base package cavity is substantially aligned to the package substrate opening; and

the device is the device partially within the cavity and connected to the substantially exposed portion of the second package substrate.

18. The system as claimed in claim 17 wherein the device is a stack package.

19. The system as claimed in claim 17 wherein the device is a passive component.

20. The system as claimed in claim 17 further comprising a bottom package over the cavity.

21. The system as claimed in claim 17 further comprising an interposer over the cavity.

22. The system as claimed in claim 17 further comprising a top package over the base package with embedded solder-on-pad.