Method of manufacturing liquid crystal display panel and apparatus for cutting liquid crystal display panel

• US 7,710,533 B2
• Filed: 12/01/2006
• Issued: 05/04/2010
• Est. Priority Date: 12/08/2005
• Status: Expired due to Fees

• Current Assignee: NEC LCD Technologies Limited (NEC Corporation)
• Original Assignee: NEC LCD Technologies Limited (NEC Corporation)
• Inventors: Mori, Makoto
• Primary Examiner(s): Le; Uyen-Chau N
• Assistant Examiner(s): Bedtelyon; John M
• Application Number:
  US11/606,956
• Publication Number:
  US 20070132935A1
• Time in Patent Office: 1,250 Days
• Field of Search: 349/158, 349/187, 349/190, 225/2, 225/96.5
• US Class Current: 349/187
• CPC Class Codes: B65G 2249/04 Arrangements of vacuum systems or suction cups
• CPC Class Codes: C03B 33/033 Apparatus for opening score lines in glass sheets
• CPC Class Codes: C03B 33/07 Cutting armoured, multi-layered, coated or laminated, glass products
• CPC Class Codes: G02F 1/133351 Manufacturing of individual cells out of a plurality of cells, e.g. by dicing
• CPC Class Codes: Y02P 40/57 Improving the yield, e-g- reduction of reject rates
• CPC Class Codes: Y10T 225/12 With preliminary weakening

Abstract

A liquid crystal display (LCD) panel is fixed to a supporting stage by vacuum holding in a way that an end portion of a predetermined one of edges of the pair of substrates protrudes from the supporting stage. Next, scribe lines are formed respectively in positions on upper and lower surfaces of the end portion of the pair of substrates, and the end portion protruding from the supporting stage. Thereafter, a load is applied to a predetermined position by using a break pin. The load is applied to the predetermined position at a side of the scribe lines toward the outside closer to starting points of the respective scribe lines. Accordingly, the LCD panel is cut.

Claims

1. A method of cutting a pair of substrates comprising the steps of:

fixing the pair of substrates, which have been bonded to each other, to a supporting stage so that an end portion of a predetermined one of edges of the pair of substrates protrudes from the supporting stage and is not supported by any supporting stage;

forming scribe lines respectively in positions on upper and lower surfaces of the end portion of the pair of substrates, the positions opposite to each other, and the end portion protruding from the supporting stage; and

applying a load to a predetermined position, which is not supported by any supporting stage at a side of the scribe lines, the position being outside the scribe lines closer to the predetermined edge than to the scribe lines and being closer to starting points of the respective scribe lines than ending portions of the scribe lines, and advancing along the scribe lines.

2. The method of cutting a pair of substrates according to claim 1, wherein the load applied to the substrates is applied from a direction substantially perpendicular to the substrates.

3. The method of cutting a pair of substrates according to claim 2, wherein the pair of substrates is a liquid crystal display panel.

4. The method of cutting a pair of substrates according to claim 1, wherein the load applied to the substrates is applied from a direction oblique to a line substantially perpendicular to the substrates.

5. The method of cutting a pair of substrates according to claim 4, wherein the pair of substrates is a liquid crystal display panel.

6. The method of cutting a pair of substrates according to claim 4, wherein the load applied to the substrates is applied from a direction oblique to a direction toward the predetermined edge, and to a direction in which the scribe lines extend.

7. The method of cutting a pair of substrates according to claim 1, wherein the shortest distance between the scribe lines and the predetermined position is approximately 5 mm to 15 mm.

8. The method of cutting a pair of substrates according to claim 1, wherein the shortest distance between an edge at the side of the starting points of the respective scribe lines on the pair of substrates and the predetermined position is approximately 30 mm or shorter.

9. The method of cutting a pair of substrates according to claim 1, wherein the load applied to the substrates is applied by use of a break pin made of a nonmetallic material.