System and method for display device with reinforcing substance
First Claim
Patent Images
1. A display device, comprising:
- a transparent substrate;
an interferometric modulator configured to modulate light transmitted through the transparent substrate;
a backplate cover sealed to said transparent substrate to form a package, wherein said interferometric modulator is inside said package; and
a rigid reinforcing substance in contact with said backplate cover, wherein said rigid reinforcing substance is configured to provide increased integrity to the backplate cover, and wherein a coefficient of thermal expansion of the reinforcing substance and a coefficient of thermal expansion of the backplate cover are approximately the same.
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Accused Products
Abstract
A package structure and method of packaging an interferometric modulator with a reinforcing substance to help support the integrity of the package. In some embodiments the reinforcing substance is a desiccant integrated into the backplate or the transparent substrate.
304 Citations
34 Claims
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1. A display device, comprising:
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a transparent substrate; an interferometric modulator configured to modulate light transmitted through the transparent substrate; a backplate cover sealed to said transparent substrate to form a package, wherein said interferometric modulator is inside said package; and a rigid reinforcing substance in contact with said backplate cover, wherein said rigid reinforcing substance is configured to provide increased integrity to the backplate cover, and wherein a coefficient of thermal expansion of the reinforcing substance and a coefficient of thermal expansion of the backplate cover are approximately the same. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 31, 32, 33)
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26. A method of manufacturing a display device, comprising:
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providing a transparent substrate comprising an interferometric modulator configured to modulate light transmitted through the transparent substrate; providing a backplate cover configured to mount to said transparent substrate; applying a reinforcing substance to said backplate cover, wherein said reinforcing substance is configured to provide increased integrity to said backplate, wherein a coefficient of thermal expansion of the reinforcing substance and a coefficient of thermal expansion of the backplate cover are approximately the same once cured, and wherein said reinforcing substance is also a desiccant and is rigid once cured; and sealing said backplate cover to said transparent substrate.
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27. A display device package, comprising:
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a transparent substrate; an interferometric modulator configured to modulate light transmitted through the transparent substrate; a backplate cover sealed to said transparent substrate to form a package, wherein said interferometric modulator is inside said package; and a rigid means for reinforcing the integrity of the backplate cover, wherein a coefficient of thermal expansion of the rigid means for reinforcing the integrity of the backplate cover and a coefficient of thermal expansion of the backplate cover are approximately the same. - View Dependent Claims (28)
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29. A display device manufactured by a process comprising:
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applying a reinforcing substance to a backplate cover, wherein said reinforcing substance is a desiccant, and wherein the reinforcing substance is configured to provide increased integrity to said backplate, wherein a coefficient of thermal expansion of the reinforcing substance and a coefficient of thermal expansion of the backplate cover are approximately the same; allowing the reinforcing substance to dry and become rigid; and sealing a transparent substrate comprising an interferometric modulator to the backplate cover. - View Dependent Claims (30)
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34. A display device, comprising:
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a transparent substrate; an interferometric modulator configured to modulate light transmitted through the transparent substrate; a backplate cover sealed to said transparent substrate by a seal to form a package, wherein said interferometric modulator is inside said package; and a reinforcing substance in contact with said backplate cover, wherein said reinforcing substance is configured to provide increased integrity to the backplate cover, wherein a coefficient of thermal expansion of the reinforcing substance and a coefficient of thermal expansion of the backplate cover are approximately the same, and wherein said reinforcing substance is not combined with the seal.
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Specification