Computer-implemented methods, carrier media, and systems for generating a metrology sampling plan
First Claim
1. A computer-implemented method for generating a metrology sampling plan, comprising:
- using a computer system to perform stems of;
identifying one or more individual defects that have one or more attributes that are abdominal from one or more attributes of a population of defects in which the individual defects are included, wherein the population of defects is located in a predetermined pattern on a wafer; and
generating the metrology sampling plan based on results of said identifying such that one or more areas on the wafer in which the one or more identified individual defects are located are sampled during metrology.
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Abstract
Various computer-implemented methods, carrier media, and systems for generating a metrology sampling plan are provided. One computer-implemented method for generating a metrology sampling plan includes identifying one or more individual defects that have one or more attributes that are abnormal from one or more attributes of a population of defects in which the individual defects are included. The population of defects is located in a predetermined pattern on a wafer. The method also includes generating the metrology sampling plan based on results of the identifying step such that one or more areas on the wafer in which the one or more identified individual defects are located are sampled during metrology.
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Citations
22 Claims
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1. A computer-implemented method for generating a metrology sampling plan, comprising:
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using a computer system to perform stems of; identifying one or more individual defects that have one or more attributes that are abdominal from one or more attributes of a population of defects in which the individual defects are included, wherein the population of defects is located in a predetermined pattern on a wafer; and generating the metrology sampling plan based on results of said identifying such that one or more areas on the wafer in which the one or more identified individual defects are located are sampled during metrology. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 17, 18, 19, 20, 21)
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16. The method of claim , wherein the results of said identifying comprise the one or more individual defects located in the one or more areas on the wafer at which the predetermined pattern is more sensitive to process variations than other areas on the wafer at which the predetermined pattern is formed.
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22. A system configured to generate a metrology sampling plan, comprising:
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an inspection system configured to detect defects on a wafer; and a computer system configured to; identify one or more individual defects that have one or more attributes that are abnormal from one or more attributes of a population of defects in which the individual defects are included, wherein the population of defects is located in a predetermined pattern on the wafer; and generate the metrology sampling plan based on the one or more identified individual defects such that one or more areas on the wafer in which the one or more identified individual defects are located are sampled during metrology.
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Specification