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Lithographically defined microelectronic contact structures

  • US 7,714,235 B1
  • Filed: 03/30/2000
  • Issued: 05/11/2010
  • Est. Priority Date: 05/06/1997
  • Status: Expired due to Fees
First Claim
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1. An electronic component comprising:

  • a substrate including a conductive area;

    masking material formed on said substrate, said masking material patterned to form an opening corresponding to at least a portion of said conductive area and a main body portion;

    conductive material deposited on said masking material within said opening and on said main body portion, said conductive material composing a contact structure comprising;

    a base region electrically connected to said conductive area and formed within said opening,a main body region formed on said main body portion of said masking material, said main body region being integrally formed with said base region and displaced away from said substrate, anda contact tip structure on at least a side of said main body region that faces away from said substrate, said contact tip structure configured to contact and thereby make an electrical connection with another electronic component.

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